10AS048K4F35I3LG - Arria 10 SX 480K SoC FPGA | Intel | BGA-1152
MPN: 10AS048K4F35I3LG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3450 | $3,450.00 |
| 10 | $3225 | $32,250.00 |
| 100 | $2980 | $298,000.00 |
| 500 | $2790 | $1,395,000.00 |
| 1,000 | $2620 | $2,620,000.00 |
Drop-in alternatives for 10AS048K4F35I3LG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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10AS048K3F35I2LG
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$3850 / Unit
View Datasheet →10AS048K3F35E3LG
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10AS048K3F35I2SG
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$1995 / Unit
View Datasheet →10AS048K4F35E3LG
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$3975 / Unit
View Datasheet →10AS048K4F35E3SG
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$2890 / Unit
View Datasheet →10AS048K4F35I3SG
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$3690 / Unit
View Datasheet →10AS048H4F34I3LG
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$3920 / Unit
View Datasheet →10AS048K4F35I3LG Maximum Ratings & Electrical Characteristics
| Series | Arria 10 SX |
| Family | Arria 10 SoC FPGA |
| Logic Elements | 480,000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Clock Frequency | Up to 1.5 GHz |
| Embedded Block RAM | 28.05 Mbits |
| DSP Blocks (18x19 Multipliers) | 1568 |
| Transceiver Channels | 8 (up to 6.144 Gbps) |
| PLLs | 4 fractional |
| Package | 1152-ball FCBGA (35x35 mm) |
| Process Node | TSMC 20nm |
| Operating Temperature Grade | Industrial (-40C to +100C junction) |
| Mounting Type | Surface Mount (BGA) |
| MSL Level | 3 (per JEDEC J-STD-020) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
| Supply Voltage Core | 0.9 V (core), 1.8 V / 2.5 V / 3.3 V (I/O) |
10AS048K4F35I3LG 1152-ball fcbga (35x35 mm) Pin Configuration Guide
Complete pinout information for 10AS048K4F35I3LG (1152-ball fcbga (35x35 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AS048K4F35I3LG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS048K4F35I3LG is suitable for 6 applications: 5G Small-Cell Baseband Pre-Processing, Industrial Machine Vision Processing, Motor and Motion Control, Test and Measurement Instrumentation, Medical Ultrasound Beamforming, Aerospace Flight Control Prototyping.
5G Small-Cell Baseband Pre-Processing
The 10AS048K4F35I3LG fits 5G small-cell baseband pre-processing because its 480K logic elements plus 1568 DSP blocks deliver up to 1.5 TFLOPs of compute, sufficient to handle PHY-layer FFT/iFFT, channel estimation, and digital pre-distortion at CPRI line rates. Its 8 embedded transceivers support 6.144 Gbps CPRI, which maps cleanly to 4G/5G fronthaul aggregation. The hard dual-core ARM Cortex-A9 HPS running Linux offloads non-realtime MAC/scheduling tasks, while the FPGA fabric handles deterministic DSP with sub-microsecond latency. Place the device between the radio unit (RU) and baseband unit (BBU); DDR3 controller IP manages the symbol buffer.
Recommended
Industrial Machine Vision Processing
The 10AS048K4F35I3LG is well matched to industrial machine vision because its high logic density and 28 Mbits block RAM allow multiple image pipelines to run concurrently - Bayer demosaic, lens correction, defect detection, and CoaXPress decoding. The dual-core ARM Cortex-A9 MPCore HPS runs the host-side GigE Vision or GenICam stack on Linux while the FPGA fabric performs deterministic pixel processing. Industrial -I temperature grade (-40C to +100C junction) supports factory-floor deployments without thermal derating. The 1152-ball FCBGA footprint integrates cleanly with multi-camera CoaXPress-12 frame grabbers.
Recommended
Motor and Motion Control
The 10AS048K4F35I3LG targets precision motor and motion control where its 1568 18x19 DSP blocks implement field-oriented control (FOC) and space-vector PWM at switching frequencies up to 200 kHz. The dual ARM Cortex-A9 MPCore handles trajectory planning and EtherCAT/CANopen master stacks while the FPGA fabric runs deterministic current/torque loops with sub-microsecond response. Industrial temperature grade supports servo-drive cabinet environments. Hardware parallelism allows multi-axis control from a single chip - 4-6 servo axes are typical. Pair with external Sigma-Delta ADCs for current sensing.
Recommended
Test and Measurement Instrumentation
The 10AS048K4F35I3LG suits high-end test and measurement because its 8 transceivers at 6.144 Gbps aggregate multi-channel ADC/DAC data (e.g., 4x 12-bit 1 GSPS ADCs via JESD204B), while 480K LEs implement custom trigger logic and protocol decoding. The hard Cortex-A9 HPS runs Linux hosting SCPI command parsing and USB/LXI connectivity; the FPGA fabric handles deterministic waveform generation and acquisition. The industrial -I temperature grade and 1152-ball FCBGA fit standard oscilloscope/AWG form factors. Block RAM (28 Mbits) buffers long captures before transfer to host.
Recommended
Medical Ultrasound Beamforming
The 10AS048K4F35I3LG supports medical ultrasound beamforming where 1568 18x19 multipliers perform apodization, delay-and-sum, and Hilbert transform across 64-128 channels in real time. The 28 Mbits block RAM store sample histories for dynamic focusing, while the dual ARM Cortex-A9 HPS manages the user interface, image post-processing, and DICOM stack. Industrial temperature grade is acceptable for clinical settings; the FCBGA-1152 footprint fits standard cart-mounted ultrasound boards. Power budget (~31 W typical) requires careful heatsinking but remains air-cooled.
Recommended
Aerospace Flight Control Prototyping
The 10AS048K4F35I3LG enables aerospace flight control prototyping where deterministic sub-microsecond response is mandatory for actuator control loops. The dual ARM Cortex-A9 HPS can run a safety partition (RTOS + DO-178C code) while the FPGA fabric executes hardware-implemented control laws with deterministic latency. Industrial temperature grade supports avionics bay environments; designers should review the package reliability profile for vibration per DO-160. The high 480K logic density accommodates multiple redundant control channels. Transceivers enable MIL-STD-1553B or ARINC 429 bridging.
Recommended
Recommended Products Summary
Engineering reference data for 10AS048K4F35I3LG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS048K3F35I2LG | 10AS048K3F35E3LG | 10AS048K4F35E3LG | 10AS048K4F35I3SG |
|---|---|---|---|---|---|
| Package | 1152-FCBGA (35x35 mm) | 1152-FCBGA (35x35 mm) - same | 1152-FCBGA (35x35 mm) - same | 1152-FCBGA (35x35 mm) - same | 1152-FCBGA (35x35 mm) - same |
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Speed Grade | 4 (highest) | 3 (~15% lower Fmax) | 3 (~15% lower Fmax) | 4 (same as this product) | 4 (same as this product) |
| Temperature Grade | Industrial (-40C to +100C junction) | Industrial | Enhanced | Enhanced | Industrial |
| Logic Elements | 480,000 | 480,000 | 480,000 | 480,000 | 480,000 |
| DSP Blocks (18x19) | 1568 | 1568 | 1568 | 1568 | 1568 |
| Embedded Block RAM | 28.05 Mbits | 28.05 Mbits | 28.05 Mbits | 28.05 Mbits | 28.05 Mbits |
| Transceiver Channels | 8 (up to 6.144 Gbps) | 8 (up to 6.144 Gbps) | 8 (up to 6.144 Gbps) | 8 (up to 6.144 Gbps) | 8 (up to 6.144 Gbps) |
Key Differentiators
- Highest speed grade (4) in the Arria 10 SX 480K family (vs 10AS048K3F35I2LG)
- Industrial temperature grade (-40C to +100C junction) (vs 10AS048K4F35E3LG)
- Dual ARM Cortex-A9 HPS integration eliminates external processor (vs 10AS048K3F35E3LG)
- 8 transceivers supporting up to 6.144 Gbps for CPRI/JESD (vs 10AS048K3F35I2SG)
Design Notes
The 1152-ball FCBGA at 1.0 mm pitch requires a minimum 12-layer PCB with stacked-microvia (laser-drilled + plated) technology in the BGA escape region. Use 0.5 oz copper on outer layers and 1 oz on inner power planes. Keep-out zones under the BGA must be clear of through-hole components to maintain clearance for the rework profile. Decouple each VCCINT/VCCA/VCCD bank with 100nF X7R capacitors plus 10uF bulk ceramics within 5mm of the ball. Refer to Intel AN 583: 'Design Guidelines for Arria 10 FPGAs' for full escape routing recommendations.
Estimated: at typical utilization (50% LEs, 80% DSP, 1.5 GHz HPS active), the device dissipates approximately 31 W TDP. With theta_JA around 8 C/W (FCBGA, 4-layer PCB, 200 LFM airflow), junction temperature rises ~25 C above inlet - acceptable within the 100 C industrial ceiling but requires a heatsink with thermal interface material. For 0 LFM (sealed enclosure), derate to 70% utilization or use a 1 C/W heatsink with conduction cooling. Junction temperature must be monitored via the on-die temperature sensor accessible through the SDM mailbox.
Place transceiver reference-clock sources (e.g., Si5341) within 100mm trace length and route as 100-ohm differential stripline on inner layers with continuous ground reference. Place HPS reference clock and reset logic within 25mm. Multi-gigabit serial links require AC-coupling capacitors on each transmit lane; consult the Arria 10 GX/SX Transceiver User Guide section 3 for lane placement rules. Power-rail sequencing (VCCINT before VCCA before VCCIO) must follow the Intel-supplied power-management IC (e.g., LTC2923) sequence or risk latch-up.
Do not substitute 10AS048K4F35I3LG with a 10AS066K4F35I3LG (660K LEs) without re-running place-and-route - bitstream is not compatible. Also do not substitute between F35 (35x35 mm) and F34 (34x34 mm) packages - ball map differs. When using configuration via JTAG, ensure VCCPD is stable before JTAG TCK toggles, or the device may enter a non-recoverable state requiring power cycling. Always load the latest device firmware (FSBL) before bringing HPS out of reset.
Compliance Information
RoHS and REACH compliant per Intel/Altera product compliance declaration. Halogen-free per JEDEC JS709B. Not AEC-Q100 qualified (industrial grade, not automotive).
