10AS048K3F35I2LG - Arria 10 SX SoC FPGA 480K LE | Intel / Altera
MPN: 10AS048K3F35I2LG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $5200 | $5,200.00 |
| 10 | $4950 | $49,500.00 |
| 100 | $4500 | $450,000.00 |
| 500 | $4100 | $2,050,000.00 |
| 1,000 | $3850 | $3,850,000.00 |
Drop-in alternatives for 10AS048K3F35I2LG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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10AS048K3F35I2SG
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View Datasheet →10AS048K2F35I2SG
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View Datasheet →10AS048K2F35E2LG
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$4150 / Unit
View Datasheet →10AS048K2F35E2SG
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View Datasheet →10AS048K3F35I2LG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 SX SoC FPGA |
| Logic Elements | 480K |
| Processor Core | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Clock | 1.5 GHz |
| Package | 1152-FBGA, FC (35x35 mm) |
| Package Code | BGA, Square |
| Number of Terminals | 1152 |
| Form of Terminal | Ball |
| Temperature Grade | Industrial |
| Operating Temperature | -40C to +100C |
| Mounting Type | Surface Mount |
| Device Family | 10AS048 (F35 speed grade) |
| Transceivers | Up to 14.1 Gbps (multi-protocol) |
| PCI Express | Gen3 hard IP |
| Memory Interfaces | DDR4, DDR3, LPDDR3, QDRII+ |
| RoHS Status | Compliant |
| Lead Free | Yes |
10AS048K3F35I2LG bga, square Pin Configuration Guide
Complete pinout information for 10AS048K3F35I2LG (bga, square package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AS048K3F35I2LG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS048K3F35I2LG is suitable for 6 applications: Wireless Baseband Processing, Medical Imaging Accelerator, Broadcast and Pro AV Signal Processing, Industrial Machine Vision, Defense Radar and EW Preprocessing, High-Performance Networking Line Card.
Wireless Baseband Processing
The 10AS048K3F35I2LG is well suited to wireless baseband and radio unit processing because its dual ARM Cortex-A9 HPS runs the L1/L2 protocol stack while the 480K-logic-element fabric implements FFT, channel estimation, and Turbo/LDPC decoding in deterministic hardware. With transceivers up to 14.1 Gbps and hardened PCI Express Gen3, the part handles CPRI or eCPRI backhaul interfaces alongside the radio datapath without an external bridge chip. Designers place the HPS on the JESD204B or CPRI side and offload bit-level processing to fabric DSP blocks, reducing latency well below what a discrete MCU+FPGA architecture achieves and keeping BOM and PCB area lower for 4G/5G small-cell deployments.
Recommended
Medical Imaging Accelerator
The 10AS048K3F35I2LG fits medical imaging systems such as CT, MRI, and ultrasound reconstruction because its 480K logic elements combined with hardened single-precision floating-point DSP blocks deliver the throughput required for back-projection and beamforming pipelines. The dual ARM Cortex-A9 MPCore hosts the patient interface, DICOM stack, and safety diagnostics while the FPGA fabric accelerates the compute kernels. PCI Express Gen3 hard IP links the SoC to a host workstation or to a multi-board imaging chassis at line rate. Industrial temperature rating (-40C to +100C) supports imaging carts and mobile diagnostic enclosures.
Recommended
Broadcast and Pro AV Signal Processing
Broadcast studios and professional AV installations benefit from the 10AS048K3F35I2LG because its high-speed transceivers and abundant DSP bandwidth handle 4K/8K video scaling, color-space conversion, and SDI/HDMI bridging in a single device. The dual ARM cores run control software and network stacks while the FPGA fabric processes pixel pipelines in real time. PCI Express Gen3 connects to capture or playback host cards, and the industrial temperature grade fits the wide environmental range of OB vans and stadium installations. The integrated SoC reduces bill-of-materials count compared with a separate MCU plus FPGA approach.
Recommended
Industrial Machine Vision
The 10AS048K3F35I2LG suits industrial machine vision systems because the FPGA fabric executes image pre-processing, edge detection, and convolutional inference at line rate while the ARM cores orchestrate PLC comms, EtherCAT masters, and HMI logic. CoaXPress, Camera Link, or GigE Vision inputs are absorbed through transceiver channels and fabric IP. The 1152-FBGA package allows dense PCB integration with industrial-grade cameras, while industrial temperature operation tolerates factory-floor environments. Designers replace host PCs with this single SoC to cut system cost, latency, and footprint in high-speed inspection lines.
Recommended
Defense Radar and EW Preprocessing
Defense radar and electronic warfare systems leverage the 10AS048K3F35I2LG for its combination of high-throughput DSP blocks, low-latency fabric, and multi-gigabit transceivers that handle wide-bandwidth A/D converter feeds in real time. The dual ARM Cortex-A9 runs mission software, threat libraries, and network interfaces while FPGA fabric performs pulse compression, CFAR detection, and digital RF memory functions. PCI Express Gen3 links to host processors, and the SoC integration shrinks SWaP-C for size-, weight-, and power-constrained platforms. Industrial temperature operation supports ground-vehicle and shipboard installations.
Recommended
High-Performance Networking Line Card
The 10AS048K3F35I2LG is appropriate for high-performance networking line cards because its transceivers support 10G/25G/40G Ethernet and OTN rates, the FPGA fabric implements packet processing and encryption offload, and the ARM cores manage control plane and management agents. PCI Express Gen3 hard IP connects to a switch fabric ASIC, and hardened memory controllers support DDR4 for deep packet buffers. Industrial temperature supports carrier-grade networking equipment deployed in uncontrolled environments. Designers benefit from SoC integration by eliminating an external CPU for many line-card functions.
Recommended
Recommended Products Summary
Engineering reference data for 10AS048K3F35I2LG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS048K3F35I2SG | 10AS048K3F35E2LG | 10AS048K3F35E2SG | 10AS048K2F35I2LG | 10AS048K2F35I2SG |
|---|---|---|---|---|---|---|
| Package | 1152-FBGA (35x35) | 1152-FBGA (35x35) - same | 1152-FBGA (35x35) - same | 1152-FBGA (35x35) - same | 1152-FBGA (35x35) - same | 1152-FBGA (35x35) - same |
| Brand | Altera (Intel) | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same |
| Logic Elements | 480K | 480K | 480K | 480K | 480K | 480K |
| Speed Grade | K3 (F35 fastest) | K3 | K3 | K3 | K2 (slower) | K2 (slower) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Extended (-40C to +125C) | Extended (-40C to +125C) | Industrial | Industrial |
| Packaging Form | Tray | Tray | Tray | Tray | Tray | Tray |
| HPS | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore |
| Lifecycle Status | Active | Active | Active | Active | Active | Active |
Key Differentiators
- Fastest speed grade in the Arria 10 SX 480K F35 family (vs 10AS048K2F35I2LG)
- Industrial temperature grade coverage (vs 10AS048K3F35E2LG)
- SoC integration eliminates external processor (vs Discrete MCU + Arria 10 GX)
Design Notes
The 1152-ball FCBGA at 35x35 mm requires a high-density PCB stack-up. Use Intel's pin connection guidelines to plan escape routing; follow the recommended 1.0 mm pitch BGA breakout with vias-in-pad for inner rows. Plan for at least 12 PCB layers to maintain signal-integrity for 14.1 Gbps transceivers and DDR4 channels. Provide continuous ground reference planes under the BGA and stitch vias around the perimeter for thermal and electrical performance.
The Arria 10 SX dissipates significant power under fabric load. Use the heatsink or cold-plate reference designs in the Arria 10 thermal management user guide; measure junction temperature with the on-die thermal diode in your application. For typical wireless baseband workloads at 1.5 GHz HPS clock plus 70-80% fabric utilisation, plan for a 25-40W power envelope and provide forced-air cooling or a heat-spreader.
Do not mix the K2 and K3 speed grades freely across designs without re-running timing closure in Quartus Prime. Confirm transceiver channel placement rules before PCB layout, since invalid channel placement prevents the design from compiling. For HPS bring-up, configure boot mode straps correctly and validate reference clock stability before JTAG attachment.
Compliance Information
RoHS and lead-free compliance from Altera material attributes. AEC-Q100 not applicable - this is a high-performance FPGA, not an automotive-qualified IC.
