10AX090N3F45I2SG - Arria 10 GX FPGA 900K LE, 1932-FCBGA | Intel
MPN： 10AX090N3F45I2SG ✓ 啟用中10AX090N3F45I2SG 概覽
An FPGA (Field Programmable Gate Array) is a reconfigurable semiconductor device whose logic fabric, interconnect, and I/O behavior are defined by a configuration bitstream after manufacturing. FPGAs occupy the middle ground between fixed-function ASICs and software-programmable processors: they deliver hardware-level parallelism and deterministic timing while allowing in-field reconfiguration. Within Intel's portfolio, the Arria 10 family sits between the low-power Cyclone series and the high-performance Stratix series, optimized for mid-range applications that demand transceiver bandwidth, DSP throughput, and modest power budgets.
Key features of the 10AX090N3F45I2SG include 24 transceivers supporting data rates up to 28.05 Gbps, hardened floating-point DSP blocks, partial reconfiguration support, and 28 Mb of distributed RAM. The device also embeds two hard memory controllers and a PCIe Gen3 x8 hard IP block, enabling high-bandwidth system integration without consuming fabric resources. The 1932-ball FCBGA package measures 45 x 45 mm and provides ample signal integrity for multi-gigabit serial links.
Architecturally, the Arria 10 GX combines an adaptive logic module (ALM)-based core fabric with hard intellectual property blocks for transceivers, memory controllers, and variable-precision DSP. The -3 speed grade delivers the highest Fmax in the family while still maintaining industrial-grade temperature operation from -40C to +100C, making it suitable for harsh-environment deployments.
Typical applications include 100G/400G optical transport network (OTN) line cards, radar and electronic warfare signal processing, 4K/8K video broadcast infrastructure, medical imaging accelerator boards, and ASIC prototyping. The 28.05 Gbps transceivers are particularly well suited for CPRI over fiber and 100GbE aggregation.
Designers should plan power delivery with at least 0.9 V at 30 A for core rails and use Intel's PowerPlay Early Power Estimator before layout. The 1932-ball FCBGA requires a high-layer-count PCB (typically 12+ layers) with microvia stack-ups to break out the full BGA.
This page synthesizes distributor pricing, drop-in alternatives, comparison data, and practical design notes for the 10AX090N3F45I2SG that are not collated in the manufacturer datasheet alone.
直接替換替代品，適用於 10AX090N3F45I2SG — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： 10AX090N3F45I2SG （相同外形與佔位） — 差異在於 Package, Speed Grade, DSP Blocks, Process Technology, Number of LABs/CLBs.
10AX090N3F45I2LG
✅ 直接替換聯絡詢價
查看資料表 →10AX090N3F45E2LG
✅ 直接替換聯絡詢價
查看資料表 →10AX090N3F40I2SG
✅ 直接替換聯絡詢價
查看資料表 →10AX090N2F45I2SG
✅ 直接替換聯絡詢價
查看資料表 →10AS066N3F45I2SG
✅ 直接替換📋 參考替代品（不在目錄中）
10AX090N3F45I2SG 最大額定值與電氣特性
| Family | Arria 10 GX |
| Logic Elements | 900,000 |
| Adaptive Logic Modules (ALMs) | 339,620 |
| Embedded Memory (M20K blocks) | 1,800 |
| Embedded Memory (bits) | 59,234,304 |
| DSP Blocks | 1,518 |
| Maximum User I/Os | 768 |
| Transceivers | 24 |
| Max Transceiver Data Rate | 28.05 Gbps |
| Process Technology | TSMC 20nm |
| Speed Grade | -3 |
| Temperature Grade | Industrial (-40C to +100C) |
| 封裝 | 1932-ball FCBGA (F45) 45 x 45 mm |
| 安裝類型 | Surface Mount (BGA) |
| RoHS 狀態 | Compliant |
10AX090N3F45I2SG 1932-ball fcbga (f45) 45 x 45 mm 腳位配置指南
10AX090N3F45I2SG（1932-ball fcbga (f45) 45 x 45 mm 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： 10AX090N3F45I2SG.
請參閱 資料表 以查看完整腳位配置。
典型應用
10AX090N3F45I2SG 適用於 7 應用s: 100G/400G Optical Transport Line Cards, Radar and Electronic Warfare Signal Processing, 4K/8K Video Broadcast Infrastructure, Medical Imaging Accelerator Boards, ASIC Prototyping and Emulation, Test and Measurement Instrumentation, 5G Fronthaul and Baseband Processing.
100G/400G Optical Transport Line Cards
The 10AX090N3F45I2SG's 24 transceivers at 28.05 Gbps make it a natural fit for 100G and emerging 400G OTN/OTU4 line cards. Four transceivers can be aggregated into a single 100G port, and the 900K logic elements plus 1,518 DSP blocks provide ample fabric for OTN framer/mapper, FEC, and MACD IP cores. Industrial temperature operation allows deployment in outdoor-cabinet telecom hardware.
推薦
Radar and Electronic Warfare Signal Processing
The 10AX090N3F45I2SG delivers 1,518 variable-precision DSP blocks capable of supporting 32-tap FFT/iFFT and complex multiplies at high Fmax, well-suited to radar pulse compression and EW channelization. The 24 transceiver channels at 28.05 Gbps handle multi-element phased-array antenna digitizers. Industrial temperature and the -3 speed grade support deployment in airborne and naval EW pods.
推薦
4K/8K Video Broadcast Infrastructure
The 10AX090N3F45I2SG drives 4K and 8K broadcast workflows: 768 user I/Os support multi-stream SDI aggregation, 1,518 DSP blocks accelerate HEVC/H.265 intra-frame encoding, and the 59.2 Mbit embedded memory buffers 8K frame buffers. Industrial temperature enables use in OB vans and outdoor broadcast enclosures where fanless thermal envelopes are required.
推薦
Medical Imaging Accelerator Boards
The 10AX090N3F45I2SG accelerates CT and MRI reconstruction (back-projection, FDK, iterative reconstruction) thanks to 1,518 floating-point-capable DSP blocks and 900K LEs for control plane. The 24 transceivers at 28.05 Gbps accept multi-channel detector data from modern CT scanners. Industrial temperature operation supports use in clinical and mobile imaging carts.
推薦
ASIC Prototyping and Emulation
The 10AX090N3F45I2SG's 900K LEs make it a viable ASIC prototyping vehicle for mid-complexity ASICs up to ~20M gates when using multi-FPGA partitioning. The 24 transceivers at 28.05 Gbps handle high-speed chip-to-chip links in multi-FPGA emulation boards. The industrial temperature range supports in-vehicle pre-silicon validation.
推薦
Test and Measurement Instrumentation
The 10AX090N3F45I2SG sits inside high-end oscilloscopes and protocol analyzers where its 768 user I/Os drive fine-grained channelization and its 28.05 Gbps transceivers analyze 100G-class signals. The 1,518 DSP blocks perform real-time FFT-based spectrum analysis at multi-GHz sample rates. Industrial temperature ensures stability in lab and field test environments.
推薦
5G Fronthaul and Baseband Processing
The 10AX090N3F45I2SG supports 5G fronthaul (CPRI/eCPRI up to option 9) via 24 transceivers at 28.05 Gbps and executes low-PHY baseband processing using 1,518 DSP blocks and 900K LEs. Hardened PCIe Gen3 x8 enables host connectivity. Industrial temperature operation allows deployment in outdoor 5G base station units.
推薦
推薦產品摘要
工程參考資料，適用於 10AX090N3F45I2SG — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | 10AX090N3F45I2LG | 10AX090N3F45E2LG | 10AX090N2F45I2SG | 10AX090N3F40I2SG | 10AS066N3F45I2SG |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1932-FCBGA (F45) 45x45mm | 1932-FCBGA (F45) 45x45mm - same | 1932-FCBGA (F45) 45x45mm - same | 1932-FCBGA (F45) 45x45mm - same | 1932-FCBGA (F40) 40x40mm - smaller | 1932-FCBGA (F45) 45x45mm - same |
| Logic Elements | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 | 660,000 |
| Speed Grade | -3 | -3 | -3 | -2 | -3 | -3 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Extended (0C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Family Variant | Arria 10 GX | Arria 10 GX | Arria 10 GX | Arria 10 GX | Arria 10 GX | Arria 10 SX (with ARM) |
主要差異化特點
- Highest-density Arria 10 GX FPGA in the F45 FCBGA-1932 package (對比10AX090N3F40I2SG (F40 variant))
- Speed grade -3 maximizes Fmax in industrial temperature (對比10AX090N2F45I2SG (-2 speed grade))
- GX variant with 24 transceivers at 28.05 Gbps (對比10AS066N3F45I2SG (Arria 10 SX))
設計說明
Estimated: at typical Arria 10 GX utilization (75% LE, 50% DSP, all 24 transceivers active), total power consumption is approximately 25-35 W, requiring at least 0.9 V core rail at 30 A. Use Intel PowerPlay Early Power Estimator (EPE) before PCB layout. Place bulk decoupling (4x 470 uF polymer + 22x 22 uF ceramic) immediately adjacent to the FCBGA's power pins and use a 12+ layer PCB stack-up with dedicated power/ground planes.
The 1932-ball FCBGA F45 package at 45 x 45 mm with 1.0 mm ball pitch requires laser-drilled microvias (stacked 2-2-2 or 1-2-1 build-up). Maintain 50-ohm controlled impedance for transceiver lanes and 100-ohm differential for high-speed serial. Use Intel's Arria 10 GX pin-out table to identify GXB/HSMC/LVDS pairs before final pin assignment.
Industrial temperature range to +100C junction demands either a high-performance heatsink with TIM, or 1+ m/s forced airflow across the FCBGA. Estimate theta_JA around 0.5-1.5 C/W with a properly designed thermal solution. Place 6-8 thermal vias in the ball-grid thermal pad array to spread heat into inner ground planes.
For 28.05 Gbps transceivers, route AC-coupled channels with pre-emphasis and equalization settings from Intel's Transceiver Toolkit. Match trace lengths within +/- 0.127 mm for lanes within a bond group. Use the Arria 10 GX IBIS-AMI models for channel simulation; expect -8 dB insertion loss at 14 GHz Nyquist frequency.
Do not confuse the F45 (45x45 mm) FCBGA with the F40 (40x40 mm) variant - they share pin count but have different I/O maps and are NOT pin-to-pin interchangeable. Confirm the OPN string ends in F45 before PCB fab. Also verify the SX/GX distinction: 10AX = GX, 10AS = SX (with ARM cores); the bitstream is incompatible across families.
合規資訊
RoHS and lead-free status confirmed per Intel product page and Ampheo distributor listing. AEC-Q100 not applicable as this is a high-density FPGA designed for industrial/telecom/datacom, not automotive. REACH and halogen-free status should be verified from latest Intel material declaration.
