10AX090R1F40I1SG - Arria 10 GX FPGA, 900K LE, 1517-BGA | Intel / Altera
MPN： 10AX090R1F40I1SG ✓ 啟用中10AX090R1F40I1SG 概覽
An FPGA (Field Programmable Gate Array) is a reconfigurable integrated circuit containing configurable logic blocks (ALMs), programmable interconnects, embedded memory blocks, DSP blocks, and high-speed transceivers. FPGAs belong to the broader category of programmable logic devices (PLDs), which also include CPLDs and structured ASICs. Within Intel's portfolio, the Arria 10 family sits between the lower-cost Cyclone series and the high-end Stratix 10, making it a common choice for bandwidth-intensive applications such as 10G/25G networking, video broadcast, and wireless baseband.
Key differentiating features of the 10AX090R1F40I1SG include 339620 Adaptive Logic Modules (ALMs), 47.32 Mbit embedded SRAM, integrated DSP blocks, and high-speed serial transceivers optimized for data rates up to 12.5 Gbps. The 0.9 V core voltage, 20 nm process, and 1517-ball FCBGA package deliver a balance of performance and power efficiency. Industrial temperature grade (I1 = -40C to +100C junction range) makes it suitable for ruggedized and outdoor deployments.
The 10AX090R1F40I1SG leverages Intel's hardened floating-point DSP blocks, partial reconfiguration, and a 28 Gbps-capable transceiver fabric. The 20 nm Tri-Gate process reduces static power compared to prior 28 nm Arria V parts, while the embedded Hard Processor Subsystem (HPS) option simplifies ARM-based SoC integration when paired with appropriate derivatives.
Typical applications include 10G/40G Ethernet switching fabrics, digital video broadcast encoders, software-defined radio platforms, radar signal preprocessing, test and measurement ASIC prototyping, and high-speed data acquisition systems. Its integrated transceivers make it especially attractive for protocols such as PCIe Gen3, 10G KR, and JESD204B Class 1.
When designing with the 10AX090R1F40I1SG, careful PCB layout is required for the FCBGA substrate due to high-speed signal integrity requirements. Use at least 8 PCB layers with continuous ground planes beneath the BGA, controlled-impedance routing for transceivers, and proper decoupling to meet the 0.9 V core tolerance.
This page synthesizes distributor pricing, drop-in alternative MPNs, and practical design notes that complement the manufacturer datasheet, helping engineers compare the 10AX090R1F40I1SG against other Arria 10 variants and competitive FPGAs.
直接替換替代品，適用於 10AX090R1F40I1SG — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： 10AX090R1F40I1SG （相同外形與佔位） — 差異在於 Package, Speed Grade, Mounting Type, DSP Blocks, Temperature Grade.
10AX090R1F40E1SG
✅ 直接替換聯絡詢價
查看資料表 →10AX090N3F40I2SG
✅ 直接替換聯絡詢價
查看資料表 →10AX090N3F45I2SG
✅ 直接替換聯絡詢價
查看資料表 →10AX090N2F40I2SG
✅ 直接替換聯絡詢價
查看資料表 →10AX090N4F40I3LG
✅ 直接替換聯絡詢價
查看資料表 →10AX090R1F40I1SG 最大額定值與電氣特性
| Series | Arria 10 GX |
| Family | Arria 10 |
| Logic Elements (LE) | 900,000 |
| Adaptive Logic Modules (ALM) | 339,620 |
| Embedded Memory | 47.32 Mbit |
| User I/O Pins | 342 |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| 封裝 | 1517-BBGA, FCBGA |
| 安裝類型 | Surface Mount |
| Operating Temperature Grade | Industrial |
| Packaging | Tray |
| RoHS 狀態 | Compliant |
| Device Type | FPGA - Field Programmable Gate Array |
| MSL 等級 | 3 (168 hours) |
10AX090R1F40I1SG 1517-bbga, fcbga 腳位配置指南
10AX090R1F40I1SG（1517-bbga, fcbga 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： 10AX090R1F40I1SG.
請參閱 資料表 以查看完整腳位配置。
典型應用
10AX090R1F40I1SG 適用於 6 應用s: 10G/40G Ethernet Switching Fabric, Digital Video Broadcast Encoder, Software-Defined Radio (SDR) Platform, High-Speed Data Acquisition System, Wireless Baseband Processing, ASIC Prototyping Platform.
10G/40G Ethernet Switching Fabric
The 10AX090R1F40I1SG's 12.5 Gbps transceivers (R1 grade) directly support 10G Ethernet, 40G Ethernet (via four 10G lanes), and PCIe Gen3 x8. With 339,620 ALMs and 47.32 Mbit embedded memory, it can implement full L2/L3 forwarding tables, queue management, and packet parsing engines. The F40 FCBGA package provides 342 user I/O pins for parallel side-band interfaces, MDIO, and CPU attach buses. This makes it ideal for top-of-rack switches, network interface cards, and carrier Ethernet equipment where deterministic latency and bandwidth aggregation are required.
推薦
Digital Video Broadcast Encoder
The 10AX090R1F40I1SG suits broadcast encoder applications including 4K HEVC, JPEG2000, and contribution video transport over SDI. Its 20 nm process and 339K ALMs enable real-time encoding at 60 fps while the hardened DSP blocks accelerate motion estimation and transform operations. The 47.32 Mbit embedded buffer memory holds multiple reference frames, and the transceivers interface directly to 12G SDI serializers. According to the Altera Arria 10 Device Datasheet, the F40 package's signal integrity is qualified for the high-speed serial requirements of broadcast video.
推薦
Software-Defined Radio (SDR) Platform
For software-defined radio platforms, the 10AX090R1F40I1SG offers the DSP density and ADC/DAC interfacing required for wideband baseband processing. Its hardened floating-point DSP blocks accelerate FFT, channelization, and modulation/demodulation algorithms. The R1 transceivers interface to JESD204B Class 1 ADCs/DACs at data rates up to 12.5 Gbps, while the 47.32 Mbit embedded memory supports deep sample buffers. The industrial temperature grade (I1) is suitable for outdoor SDR deployments such as tactical communications or radio astronomy.
推薦
High-Speed Data Acquisition System
The 10AX090R1F40I1SG is well suited for high-speed data acquisition in test and measurement, medical imaging, and radar preprocessing. Its 47.32 Mbit embedded memory and 339K ALMs allow continuous capture from parallel ADC arrays, real-time DSP filtering, and trigger detection. The R1 transceivers accept JESD204B data streams at 12.5 Gbps per lane, enabling aggregate acquisition rates exceeding 50 Gbps. Industrial temperature grade supports deployment in factory automation and outdoor instrumentation.
推薦
Wireless Baseband Processing
In wireless infrastructure (small cells, LTE/5G baseband units, microwave backhaul), the 10AX090R1F40I1SG provides the DSP throughput needed for PHY-layer processing, channel coding, and beamforming. Its hardened floating-point DSP blocks deliver up to 1.5 TFLOPs of DSP performance per the Arria 10 datasheet. The transceivers support CPRI (Common Public Radio Interface) up to 9.8 Gbps, enabling direct connection to remote radio heads. The F40 FCBGA package has the signal integrity required for these high-speed serial links.
推薦
ASIC Prototyping Platform
The 10AX090R1F40I1SG serves as an effective ASIC prototyping platform for mid-complexity designs requiring up to 900K ASIC gates equivalent. Engineers can partition ASIC RTL across multiple Arria 10 devices and validate system behavior at near-ASIC speeds using the R1 transceivers for chip-to-chip bridging. The 20 nm process timing models closely match leading-edge ASIC geometries. Industrial temperature grade supports pre-silicon validation in automotive and industrial customer environments.
推薦
推薦產品摘要
工程參考資料，適用於 10AX090R1F40I1SG — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | 10AX090R1F40E1SG | 10AX090N3F40I2SG | 10AX090N3F45I2SG | 10AX090N2F40I2SG | 10AX090N4F40I3LG |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1517-BBGA, FCBGA (F40) | 1517-BBGA, FCBGA (F40) - same | 1517-BBGA, FCBGA (F40) - same | 1517-BBGA, FCBGA (F45) - different package | 1517-BBGA, FCBGA (F40) - same | 1517-BBGA, FCBGA (F40) - same |
| Logic Elements | 900,000 LE | 900,000 LE | 900,000 LE | 900,000 LE | 900,000 LE | 900,000 LE |
| Embedded Memory | 47.32 Mbit | 47.32 Mbit | 47.32 Mbit | 47.32 Mbit | 47.32 Mbit | 47.32 Mbit |
| Transceiver Grade | GX (R1 = up to 12.5 Gbps) | GX (R1 = up to 12.5 Gbps) | N3 (no transceivers) | N3 (no transceivers) | N2 (lower speed grade transceivers) | N4 (no transceivers) |
| Temperature Grade | Industrial (I1) | Commercial (E1) | Industrial (I2) | Industrial (I2) | Industrial (I2) | Industrial (I3) |
| Process Technology | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
主要差異化特點
- Highest density Arria 10 GX variant with industrial temp grade (對比10AX090R1F40E1SG)
- Cost-effective transceiver option within Arria 10 family (對比10AX090R2F40I1SG / 10AX090R3F40I1SG)
- Integrated transceivers vs N-series drop-in alternatives (對比10AX090N3F40I2SG)
設計說明
The 1517-ball FCBGA package requires a high-density PCB with at least 8 layers. Use a 1.0 mm or finer BGA pitch PCB with microvia stack-ups (e.g., 1-2-1 or 2-4-2). Place a continuous ground plane beneath the BGA to control return paths for the high-speed transceivers. Maintain 100-ohm differential impedance for transceiver lanes and 50-ohm single-ended for LVCMOS I/O.
The 10AX090R1F40I1SG requires multiple supply rails: 0.9 V core, 1.2 V or 1.5 V transceiver supply, 1.8 V or 2.5 V auxiliary, and 3.0 V configuration supply. Estimated core power consumption under typical workloads is 15-25 W, with peak transients during configuration. Use a sequence controller such as the LTC2977 or equivalent to enforce proper rail sequencing. Decoupling: place 0402-size 0.1 uF and 10 uF capacitors within 1 ball pitch of each supply ball.
Estimated: at 20 W total power dissipation, the F40 FCBGA package's junction-to-ambient thermal resistance (theta_JA) of approximately 8-10 C/W with a heat sink attached results in 160-200 C junction temperature rise above ambient. Industrial temperature grade requires junction temperature below 100 C, so a heat sink with thermal interface material and adequate airflow (>= 200 LFM) is mandatory. The Altera Arria 10 Thermal Modeling Tool provides device-specific thermal data.
Do not assume all 10AX090 variants are pin-compatible - only F40-package variants share ball assignments. Configuring the FPGA requires either an external configuration device (EPCS or compatible flash) or JTAG programming via USB-Blaster II. The MSL3 moisture sensitivity level (168 hours floor life at 30 C/60% RH) requires proper dry-bag handling and bake-out before reflow if exposure exceeds the floor life.
合規資訊
RoHS compliant per DigiKey product listing. Industrial temperature grade (I1) per Altera ordering code convention; not AEC-Q100 qualified (FPGAs typically not AEC-Q100 qualified as discrete components - system-level qualification required).
