10AX115R4F40I3SG - Arria 10 GX FPGA, 1.15M LEs, 1517-FCBGA | Altera
MPN： 10AX115R4F40I3SG ✓ 啟用中10AX115R4F40I3SG 概覽
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit whose logic functionality, interconnect, and I/O behavior are defined by configuration memory rather than fixed mask interconnect, enabling post-fabrication reprogramming. FPGAs sit in the broader taxonomy of programmable logic devices alongside CPLDs, and are widely used for parallel compute pipelines, hardware-accelerated networking, ASIC prototyping, and embedded DSP. Within Intel PSG (formerly Altera) lineups, Arria 10 GX sits between the lower-cost Cyclone series and the high-end Stratix family, offering mid-tier logic density with integrated transceivers and hard IP blocks.
Key features include 342 user I/O pins, embedded DSP blocks with hardened floating-point support, up to 24 transceiver channels supporting multi-gigabit serial protocols, distributed and M20K block RAM, partial reconfiguration support, and PCI Express hard IP. The device is hardened with variable-precision DSP blocks, allowing efficient implementation of FFTs, FIR filters, and matrix-multiply operations directly in fabric. The integrated transceivers reach data rates suitable for 10 GbE, 40 GbE, PCIe Gen2/Gen3, and backplane interconnect, eliminating the need for external PHYs in many designs.
Typical applications for the 10AX115R4F40I3SG include radar signal processing in defense systems, 4K video broadcast equipment, medical imaging accelerators, base-station baseband, and ASIC emulation/prototyping platforms. The wide logic capacity and high I/O count make it well-suited to designs requiring parallel pipelines with hundreds of channels of I/O bandwidth. The 1517-ball FCBGA package provides ample signal escape routing for high-density board layouts, typically requiring high-layer-count PCBs.
When designing with this device, ensure proper power-rail sequencing across the 0.9 V core and auxiliary supplies, follow Intel's pinout and signal-integrity guidelines for the F40 package, and verify Quartus Prime device support for the I3 industrial temperature grade. Designers should also consider using the Intel Transceiver Toolkit for high-speed serial link validation.
This page synthesizes distributor pricing, drop-in same-family Arria 10 alternatives, and practical design notes beyond what the manufacturer datasheet alone provides.
直接替換替代品，適用於 10AX115R4F40I3SG — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： 10AX115R4F40I3SG （相同外形與佔位） — 差異在於 Package, DSP Blocks, Embedded Memory, PCIe Hard IP, Process Node.
10AX115R4F40I3LG
✅ 直接替換聯絡詢價
查看資料表 →10AX115R4F40E3SG
✅ 直接替換聯絡詢價
查看資料表 →10AX115R3F40I2SG
✅ 直接替換聯絡詢價
查看資料表 →10AX115R2F40I1SG
✅ 直接替換聯絡詢價
查看資料表 →10AX115R1F40I1SG
✅ 直接替換聯絡詢價
查看資料表 →10AX090R4F40I3SG
✅ 直接替換📋 參考替代品（不在目錄中）
10AX115R4F40I3SG 最大額定值與電氣特性
| Family | Arria 10 GX |
| Logic Elements | 1,150,000 |
| Embedded Memory | 68,857,600 bits |
| User I/O | 342 |
| Core Voltage | 0.9 V |
| Process Technology | 20 nm |
| 工作溫度 | -40C to +100C (Industrial) |
| 封裝 | 1517-BBGA, FCBGA (F40) |
| 安裝類型 | Surface Mount |
| Lead-Free / RoHS | Yes / Compliant |
| MSL 等級 | 3 |
| Configuration Memory | SRAM-based, volatile |
| DSP Blocks | Hardened variable-precision DSP |
10AX115R4F40I3SG 1517-bbga, fcbga (f40) 腳位配置指南
10AX115R4F40I3SG（1517-bbga, fcbga (f40) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： 10AX115R4F40I3SG.
請參閱 資料表 以查看完整腳位配置。
典型應用
10AX115R4F40I3SG 適用於 6 應用s: Radar and Defense Signal Processing, 4K Video Broadcast and Studio Equipment, Medical Imaging Acceleration, Telecom Base-Station Baseband Processing, ASIC Prototyping and Emulation, Industrial Automation and Machine Vision.
Radar and Defense Signal Processing
The 10AX115R4F40I3SG's 1.15 M logic elements, hardened variable-precision DSP blocks, and 342 user I/Os make it ideal for phased-array radar, electronic-warfare, and SIGINT systems. Per Altera's Arria 10 GX datasheet, the hardened DSP blocks can implement multi-tap FIR filters, FFT pipelines, and beam-forming weights directly in fabric, sustaining sample rates well above 1 GSPS across hundreds of channels. The R4 speed grade preserves timing margin for high-fanout beam-steering nets, while the I3 industrial temperature grade supports deployment in unconditioned outdoor enclosures. Compared with DSP processors or GPU-based systems, this Arria 10 variant offers deterministic latency and lower per-channel power consumption at multi-hundred-MHz clock rates.
推薦
4K Video Broadcast and Studio Equipment
The Arria 10 GX 10AX115R4F40I3SG serves as a multi-channel 4K/UHD video processing engine in broadcast switchers, contribution encoders, and playout servers. With up to 24 multi-gigabit transceivers per the Altera datasheet, the device aggregates 12G-SDI, quad-link 3G-SDI, and IP-based SMPTE ST 2110 streams in parallel. Its 68,857,600 bits of embedded memory buffer compressed and uncompressed video frames at line rate. The R4 speed grade is well matched to multi-format up/down/cross-conversion pipelines that operate above 300 MHz fabric clocks. Designers typically pair this device with external HDMI 2.0 / SDI gateway chips and rely on the FPGA for low-latency color-space conversion and HDR metadata insertion.
推薦
Medical Imaging Acceleration
The 10AX115R4F40I3SG is well suited to CT, MRI, and ultrasound image-reconstruction pipelines, where its variable-precision DSP blocks deliver high-throughput back-projection, FFT-based reconstructions, and image-filtering kernels. Per the Altera family datasheet, the embedded DSP supports IEEE 754 single-precision floating point and lower-precision fixed-point at native fabric rates. Designers can reconstruct multi-slice CT volumes in real time at sub-second latency, replacing GPU racks with deterministic FPGA pipelines that meet medical device latency budgets. The I3 industrial temperature grade supports imaging carts and operating-room equipment, and the 342 user I/O count accommodates many parallel sensor analog front ends.
推薦
Telecom Base-Station Baseband Processing
The 10AX115R4F40I3SG accelerates LTE and 5G NR baseband processing in small-cell and macro-cell base stations. Its hardened DSP blocks implement channel estimation, MIMO detection, FFT/iFFT, and turbo/LDPC decoding at line rate, while the integrated transceivers handle CPRI or eCPRI fronthaul links. Per Altera's Arria 10 GX datasheet, the R4 speed grade supports 4G/5G numerologies with timing margin, and the I3 industrial temperature grade supports outdoor remote-radio-head enclosures. The 1.15 M LE capacity handles multi-sector, multi-antenna configurations within a single device, replacing multi-FPGA partitions and reducing system cost.
推薦
ASIC Prototyping and Emulation
The 10AX115R4F40I3SG provides mid-range capacity for ASIC and SoC prototyping and emulation. With 1.15 M logic elements and 342 user I/Os, it can host complex ASIC subsystems including processor cores, memory controllers, and high-speed peripherals. The R4 speed grade and high I/O count enable fast bring-up and debug, while the F40 1517-ball FCBGA package provides ample signal escape for high-density prototyping boards. Designers typically partition large ASICs across multiple Arria 10 devices with high-speed serial links bridging chips, achieving deterministic co-emulation at hundreds of MHz.
推薦
Industrial Automation and Machine Vision
The 10AX115R4F40I3SG is deployed in industrial machine-vision systems, robotic controllers, and high-channel-count motion controllers. Its hardened DSP enables real-time image preprocessing, defect detection, and convolutional inference at line rate without CPU/GPU offload. The 342 user I/Os accommodate many parallel camera-link or CoaXPress interfaces, while the I3 industrial temperature grade supports factory-floor operation. Compared with general-purpose processors, this Arria 10 variant offers deterministic latency, allowing vision pipelines to synchronize with conveyor motion and high-speed pick-and-place systems.
推薦
推薦產品摘要
工程參考資料，適用於 10AX115R4F40I3SG — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | 10AX115R4F40I3LG | 10AX115R4F40E3SG | 10AX115R3F40I2SG | 10AX115R2F40I1SG | 10AX090R4F40I3SG |
|---|---|---|---|---|---|---|
| Package | 1517-BBGA, FCBGA (F40) | 1517-BBGA, FCBGA (F40) - same | 1517-BBGA, FCBGA (F40) - same | 1517-BBGA, FCBGA (F40) - same | 1517-BBGA, FCBGA (F40) - same | 1517-BBGA, FCBGA (F40) - same |
| Brand | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 900,000 (-22%) |
| User I/O | 342 | 342 | 342 | 342 | 342 | 342 |
| Speed Grade | R4 (highest) | R4 | R4 | R3 (one slower) | R2 (two slower) | R4 |
| Operating Temperature | -40C to +100C (I3 industrial) | -40C to +100C (I3) | 0C to +100C (E3 extended) | -40C to +100C (I2) | -40C to +100C (I1) | -40C to +100C (I3) |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
主要差異化特點
- Highest R4 speed grade in the 10AX115 family (對比10AX115R3F40I2SG)
- Industrial temperature range (I3) versus I1/I2 (對比10AX115R2F40I1SG)
- Same footprint as lower-density 10AX090 family (對比10AX090R4F40I3SG)
設計說明
Estimated: The Arria 10 GX 10AX115R4F40I3SG draws roughly 12-20 W in typical designs at moderate utilization, with peak power above 25 W under heavy DSP utilization. Use Intel-recommended power controllers (e.g., EN63A0QI family) and follow the device-family datasheet's decoupling and bulk-capacitor recommendations. Power-rail ramp sequencing must follow the datasheet sequence to avoid configuration-memory corruption and I/O latch-up. Designers should budget for at least 4 power-supply rails (core, auxiliary, transceiver, I/O).
The 1517-ball FCBGA (F40) package requires a high-layer-count PCB (typically 12+ layers) with microvia-in-pad or stacked-via escape. Maintain 100-ohm differential impedance on transceiver channels and follow Intel's package-dimension and breakout guidelines. Use Intel's board-design tool and review the pin-connection guidelines for unused and reserved pins. Decoupling capacitors should be placed as close as practical to the package with low-impedance power planes beneath the device.
Do not confuse the 'S' (lead-free, RoHS) designator with the temperature grade. Confirm that I3 industrial temperature parts are selected for outdoor or factory-floor deployment. Always verify Quartus Prime device support for the exact ordering code before committing the design to layout. Designers should also confirm that the configuration scheme (JTAG, AS, PS) matches the chosen boot memory and that unused JTAG/MSEL pins are correctly biased per the datasheet.
Estimated: At 20 W total power dissipation in the 1517-ball FCBGA with theta_JA around 8-12 C/W (with proper PCB heatsink), the junction-temperature rise is approximately 160-240 C above ambient. Active cooling or substantial copper thermal vias are essential. Use thermal simulation tools to verify junction temperature stays below 100C across the I3 industrial operating range, including derating for the worst-case ambient. Consider heatsink attachment or forced-air cooling for high-utilization designs.
合規資訊
RoHS and lead-free per the 'S' designator in the part number. Reach and conflict-minerals statements are typical for Intel PSG Altera FPGA products; verify with Intel's official product compliance documentation.