10AX115R3F40I2SG - Arria 10 GX FPGA, 1.15M LE, F40 FCBGA | Intel
MPN： 10AX115R3F40I2SG ✓ 啟用中10AX115R3F40I2SG 概覽
A Field-Programmable Gate Array (FPGA) is a reconfigurable integrated circuit containing an array of programmable logic blocks, interconnect fabric, and embedded resources such as transceivers, memory blocks, and DSP slices. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs) → FPGAs → SRAM-based high-density FPGAs → SoC FPGAs with transceivers. Arria 10 devices represent Intel's mid-range FPGA family, positioned between low-power Cyclone and high-performance Stratix families, and are widely used in communications infrastructure, broadcast video, and high-performance computing.
Key features of the 10AX115R3F40I2SG include 24 high-speed transceiver channels (up to 17.4 Gbps), hard memory controllers supporting DDR4 and DDR3, integrated PCI Express Gen3 hard IP blocks, and a hardened floating-point DSP architecture. The device also embeds variable-precision DSP blocks, partial reconfiguration support, and a 20-channel fabric clock network.
The Arria 10 architecture uses TSMC's 20nm process, providing a favorable performance-per-watt profile versus prior-generation 28nm devices. The integrated transceivers, hard memory controllers, and PCIe Gen3 IP eliminate the need for soft IP implementations, freeing FPGA fabric for application logic.
Typical applications include 4K/8K video processing and broadcast infrastructure, 100G/400G optical transport network line cards, 5G baseband processing, radar and electronic warfare front-ends, and high-performance test & measurement equipment. The high logic density and built-in 17.4 Gbps transceivers make it particularly suited for protocol bridging, packet processing, and high-throughput DSP applications.
When designing with this device, ensure the F40 FCBGA land pattern matches Arria 10 family pin-compatible variants, plan power-rail sequencing for the 0.95V core and 1.2V transceiver supplies, and provide adequate PCB thermal dissipation for the high-density flip-chip BGA.
This page synthesizes distributor pricing, drop-in alternatives within the same F40 FCBGA footprint, and practical design notes not found in the manufacturer datasheet alone.
直接替換替代品，適用於 10AX115R3F40I2SG — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： 10AX115R3F40I2SG （相同外形與佔位） — 差異在於 DSP Blocks, Package, Embedded Memory, Hard Memory Controllers, Family.
10AX115R3F40E2SG
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →10AX115R3F40I2LG
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
10AX115R2F40I2SG
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →10AX115R2F40I2LG
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →10AX115R2F40I1SG
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →10AX115N3F40I2SG
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →10AX115R3F40E2LG
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →10AX115R2F40E2SG
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →10AX115R3F40I2SG 最大額定值與電氣特性
| Series | Arria 10 GX |
| Family | 10AX115 |
| Logic Elements | 1,150,000 |
| Embedded Memory | 68,857,856 bits |
| User I/O Count | 342 |
| 封裝 | 1517-BBGA, FCBGA (F40) |
| Temperature Grade | Industrial (-40C to +100C) |
| Speed Grade | I2 |
| Transceiver Channels | 24 (up to 17.4 Gbps) |
| Hard Memory Controllers | Yes (DDR4/DDR3) |
| PCIe Hard IP | Gen3 |
| DSP Blocks | Yes (variable-precision) |
| Process Node | 20 nm (TSMC) |
| RoHS 狀態 | Compliant |
| 安裝類型 | Surface Mount (BGA) |
10AX115R3F40I2SG 1517-bbga, fcbga (f40) 腳位配置指南
10AX115R3F40I2SG（1517-bbga, fcbga (f40) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： 10AX115R3F40I2SG.
請參閱 資料表 以查看完整腳位配置。
典型應用
10AX115R3F40I2SG 適用於 6 應用s: 100G/400G Optical Transport Network Line Cards, 4K/8K Broadcast Video Processing, 5G Baseband and Fronthaul Processing, Radar and Electronic Warfare Front-Ends, High-Performance Test & Measurement, Industrial High-Speed Protocol Bridging.
100G/400G Optical Transport Network Line Cards
The 10AX115R3F40I2SG's 24 transceiver channels at up to 17.4 Gbps natively support 100GbE (CAUI-4 / CAUI-10) and OTU4 line-rate processing without external muxponders, while its 1.15M LE fabric handles MAC framing, FEC, and OTN mapping. Hard PCIe Gen3 blocks ease co-processing with a host ASIC. Designers place the FPGA between optical modules and a switch ASIC, with the F40 FCBGA footprint providing ample balls for the high-lane-count SERDES. The industrial temperature grade supports outdoor OTN shelf deployments.
推薦
4K/8K Broadcast Video Processing
The 10AX115R3F40I2SG provides 1.15M logic elements plus variable-precision DSP slices that accelerate 4K/8K video codecs, color space conversion, and HDR processing pipelines in broadcast studio and contribution equipment. Embedded memory of 68 Mbit absorbs line and frame buffers without external DDR, reducing BOM cost. The 17.4 Gbps transceivers route 12G-SDI or SMPTE 2110 uncompressed video streams between production switchers and playout servers.
推薦
5G Baseband and Fronthaul Processing
The 10AX115R3F40I2SG's hard PCIe Gen3 blocks interface with baseband SoCs while the 17.4 Gbps transceivers support CPRI and eCPRI fronthaul links to remote radio heads at 4G/5G base stations. Hard DDR4 controllers feed massive IQ sample buffers at line rate. The 1.15M LE fabric implements L1 PHY, MAC, and scheduling algorithms in a single device. Industrial temperature grade suits outdoor small-cell and macro-cell deployments.
推薦
Radar and Electronic Warfare Front-Ends
The 10AX115R3F40I2SG's combination of 24 transceivers at 17.4 Gbps and high DSP block density enables digital array radar beamforming, pulse compression, and electronic countermeasure signal processing in a single device. Hard memory controllers feed wideband ADC/DAC sample streams while the 1.15M LE fabric implements adaptive beam-steering weights in real time. Industrial-grade operation supports airborne and ground-mobile radar platforms.
推薦
High-Performance Test & Measurement
The 10AX115R3F40I2SG powers protocol-aware test instruments (oscilloscopes, BERT, protocol analyzers) where its 17.4 Gbps transceivers drive high-speed serial stimulus and capture, and its 1.15M LE fabric implements multi-protocol decoding. Hard PCIe Gen3 connects to host processors for real-time waveform upload. Industrial temperature ensures stable operation in lab and field test environments.
推薦
Industrial High-Speed Protocol Bridging
The 10AX115R3F40I2SG bridges between industrial protocols (EtherCAT, PROFINET, TSN) and high-speed serial standards (PCIe Gen3, USB 3.1, SATA) in factory automation controllers. The hard PCIe Gen3 and high-density fabric enable low-latency protocol translation without software intervention. Industrial temperature grade supports shop-floor deployment from -40C to +100C.
推薦
推薦產品摘要
工程參考資料，適用於 10AX115R3F40I2SG — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | 10AX115R3F40E2SG | 10AX115R3F40I2LG | 10AX115R2F40I2SG | 10AX115N3F40I2SG |
|---|---|---|---|---|---|
| Package | 1517-BBGA, FCBGA (F40) | 1517-BBGA, FCBGA (F40) - same | 1517-BBGA, FCBGA (F40) - same | 1517-BBGA, FCBGA (F40) - same | 1517-BBGA, FCBGA (F40) - same |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 |
| Temperature Grade | Industrial (-40C to +100C) | Extended (0C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Speed Grade | I2 | E2 | I2 | I2 | I2 |
| Transceiver Variant | R3 (24 ch @ 17.4 Gbps) | R3 (24 ch @ 17.4 Gbps) | R3 (24 ch @ 17.4 Gbps) | R2 (reduced ch count) | N3 (no transceivers) |
| Embedded Memory | 68,857,856 bits | 68,857,856 bits | 68,857,856 bits | 68,857,856 bits | 68,857,856 bits |
| User I/O Count | 342 | 342 | 342 | 342 | 342 |
主要差異化特點
- Highest transceiver count within F40 industrial family (對比10AX115R2F40I2SG)
- Industrial temperature grade for harsh environments (對比10AX115R3F40E2SG)
- R3 transceivers enable higher-margin SERDES links (對比10AX115R2F40I2SG)
設計說明
The 1517-ball F40 FCBGA package requires substantial copper thermal management. Estimated: at 1.15M LE utilization near 100% with 24 transceivers active, the device can dissipate 20-30W. The exposed-die flip-chip BGA needs a top-side heatsink or high-density PCB inner copper planes connected via thermal vias to the central ball grid. Use Intel's power-estimator tools (PowerPlay Early Power Estimator) early in the design cycle to size cooling.
Power sequencing is mandatory for Arria 10 devices. Core supply (0.95V VCC), transceiver supplies (VCCR/VCCP/VCCT at 1.0-1.2V), and I/O supplies (1.2V-2.5V VCCIO) must ramp in a specific order per Intel's Pin Connection Guidelines. Use a dedicated sequencer IC or a properly-configured PMIC to avoid latch-up. Inrush current through the monolithic regulator (POR) must be limited to the datasheet's monotonic-ramp specification.
Place 0.1uF + bulk-decoupling caps within the package footprint for each power rail group. SERDES reference clock routing requires 100-ohm differential impedance and length matching to within 5 mils per Intel's guidelines. The configuration pins (MSEL, nCONFIG, nSTATUS, CONF_DONE) must be pulled to known states at power-up; consult the Arria 10 configuration user guide for the AS, PS, JTAG, and FPP modes.
Do not confuse 'I2' (industrial speed grade 2) with 'I2C' (the inter-IC bus). Industrial-grade Arria 10 FPGAs require MSL handling per JEDEC J-STD-033. Re-balling or re-flowing the F40 FCBGA is not supported - any board-level rework should replace the entire component. Designers must also avoid routing high-speed SERDES lanes across power-plane splits; use a contiguous GND reference plane under all transceiver channels.
合規資訊
RoHS and lead-free compliance per Intel Arria 10 product family specifications. AEC-Q100 is not applicable for FPGAs; industrial-grade temperature rating is the relevant qualification for harsh-environment use. LG-suffix variants (e.g., 10AX115R3F40I2LG) denote lead-free/green compound.