10AX115U1F45E1SG - Arria 10 GX FPGA, 1.15M LE, 1932-FCBGA | Intel
MPN： 10AX115U1F45E1SG ✓ 啟用中10AX115U1F45E1SG 概覽
What is a FPGA? A Field Programmable Gate Array is a reconfigurable semiconductor device whose logic fabric, interconnect, and I/O routing are defined after manufacture via a hardware description language and configuration bitstream. FPGAs sit between fixed-function ASICs and software-driven CPUs in the programmable-logic taxonomy: FPGA -> programmable logic -> logic IC -> integrated circuit. The Arria 10 GX family specifically targets mid-range applications requiring a balance of logic density, embedded transceiver bandwidth, and power efficiency.
Key features of the 10AX115U1F45E1SG include 1,150,000 logic elements, 68,857,560 embedded memory bits, 427,200 adaptive logic modules (ALMs), and 480 user I/Os supporting multiple I/O standards. The device integrates up to 24 transceivers capable of 14.4 Gbps, embedded DSP blocks for fixed‑ and floating‑point signal processing, and a Hard Processor System option via external host CPU. Configuration is via SRAM-based volatile bitstream with AES-256 encryption support.
Architecturally, the Arria 10 GX fabric uses 20 nm Tri-Gate transistors combined with a redundant Adaptive Logic Module (ALM) structure, an embedded Hard Memory Block (M20K) hierarchy, and variable-precision DSP blocks. The transceiver tiles integrate hard PCIe Gen3 and 10 Gbps Ethernet PCS, offloading MAC-layer functions from the programmable fabric. The 0.9 V core supply achieves up to 40% lower power than the prior 28 nm Arria V generation at equivalent throughput.
Typical applications include 10/40/100 Gbps packet processing line cards, wireless baseband aggregation units, broadcast video processing, software-defined radio, ASIC prototyping, and high-speed serial backplane bridging. The high transceiver count also suits test and measurement instrumentation requiring multi-channel serial capture.
A key design consideration is PCB BGA breakout routing - 1932 balls on a 45 x 45 mm substrate typically requires an 8- to 10-layer stackup with microvia-in-pad. Power delivery to the 0.9 V core must use a multiphase VRM with bulk decoupling placed adjacent to the BGA footprint. Quartus Prime is the required design-entry and synthesis tool.
This page synthesizes distributor pricing, drop-in Arria 10 family alternatives, and BGA layout guidance not found in the manufacturer datasheet alone.
直接替換替代品，適用於 10AX115U1F45E1SG — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： 10AX115U1F45E1SG （相同外形與佔位） — 差異在於 Package, Embedded Memory Bits, Process Node, Hard Memory Controllers, Max Transceiver Data Rate.
10AX115U2F45E1SG
✅ 直接替換聯絡詢價
查看資料表 →10AX115U1F45E2SG
✅ 直接替換📋 參考替代品（不在目錄中）
10AX115U1F45I1SG
✅ 直接替換聯絡詢價
查看資料表 →10AX115N2F45E2SG
✅ 直接替換聯絡詢價
查看資料表 →10AX090U1F45E1SG
✅ 直接替換聯絡詢價
查看資料表 →10AX115U1F45E1LG
✅ 直接替換📋 參考替代品（不在目錄中）
10AX115U1F45E1SG 最大額定值與電氣特性
| Family | Arria 10 GX |
| Device Logic Elements | 1,150,000 |
| Embedded Memory Bits | 68,857,560 |
| Adaptive Logic Modules (ALMs) | 427,200 |
| User I/Os | 480 |
| Transceivers | Up to 24 channels |
| Max Transceiver Data Rate | 14.4 Gbps |
| Process Node | 20 nm |
| Core Voltage | 0.9 V |
| 封裝 | 1932-ball FCBGA (F45) |
| Package Dimensions | 45 x 45 mm |
| Configuration | SRAM, AES-256 encrypted bitstream |
| RoHS 狀態 | Compliant |
| Lead Free | Yes |
| Design Tool | Quartus Prime |
| 安裝類型 | Surface Mount (BGA) |
10AX115U1F45E1SG 45 x 45 mm 腳位配置指南
10AX115U1F45E1SG（45 x 45 mm 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： 10AX115U1F45E1SG.
請參閱 資料表 以查看完整腳位配置。
典型應用
10AX115U1F45E1SG 適用於 6 應用s: 100G Ethernet Line Card, Wireless Baseband Aggregation, Broadcast Video Processing, ASIC Prototyping, Software-Defined Radio (SDR), Test & Measurement Instrumentation.
100G Ethernet Line Card
The 10AX115U1F45E1SG's 24 transceivers at 14.4 Gbps make it a strong fit for 100G Ethernet line cards where multiple 25G CAUI-4 lanes must terminate. Its 1.15M LE budget accommodates the full Ethernet MAC plus classification and shim logic, while embedded M20K memory (68.85 Mbit) holds packet descriptors and queue structures without external SSRAM. Power dissipation typically reaches 25-35W, requiring a multiphase 0.9V VRM.
推薦
Wireless Baseband Aggregation
Wireless baseband aggregation units benefit from the 10AX115U1F45E1SG's DSP block density and multi-rate transceiver coverage up to 14.4 Gbps for CPRI or OBSAI backhaul links. The 1.15M LE fabric can implement channel cards, FFT/iFFT engines, and HARQ buffers in parallel. The F45 FCBGA-1932 package's 45x45 mm footprint is acceptable for ATCA-style line cards.
推薦
Broadcast Video Processing
The 10AX115U1F45E1SG's logic density supports multi-channel 4K video processing, including scaling, deinterlacing, and color-space conversion pipelines. The 14.4 Gbps transceivers handle SDI (SMPTE ST-424/ST-2082) and 12G-SDI coaxial interfaces, while general-purpose I/Os at LVDS rates support parallel display interfaces. The 20 nm process keeps per-channel power low enough for rack-dense chassis.
推薦
ASIC Prototyping
ASIC prototyping on the 10AX115U1F45E1SG leverages 1.15M LE for mapping mid-range ASIC RTL directly into the Arria 10 GX fabric. The F45 FCBGA-1932 package's high I/O count (480 user pins) accommodates most ASIC boundary requirements. Quartus Prime's synthesis flow supports ASIC-mapped netlists with timing-driven placement, allowing accurate pre-silicon verification.
推薦
Software-Defined Radio (SDR)
Software-defined radio systems using the 10AX115U1F45E1SG exploit its DSP blocks for wideband DDC/DUC, FFT, and modulation/demodulation in a single device. The 14.4 Gbps transceivers digitize RF at IF or baseband over JESD204B/C interfaces to high-speed ADCs. The 68.85 Mbit embedded M20K memory holds wide sample buffers and FFT windows.
推薦
Test & Measurement Instrumentation
Multi-channel test and measurement instruments rely on the 10AX115U1F45E1SG for protocol-aware pattern generation, BERT, and high-speed capture. The 24 transceivers at 14.4 Gbps simultaneously drive and acquire from multiple DUT lanes, while the 1.15M LE fabric implements protocol stacks (PCIe, Ethernet, USB) as soft cores. The F45 package's high pin count supports extensive front-panel I/O.
推薦
推薦產品摘要
工程參考資料，適用於 10AX115U1F45E1SG — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | 10AX115U2F45E1SG | 10AX115U1F45E2SG | 10AX115U1F45I1SG | 10AX115N2F45E2SG | 10AX090U1F45E1SG | 10AX115U1F45E1LG |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1932-ball FCBGA (F45) | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 900,000 | 1,150,000 |
| Transceivers | Up to 24 channels | Up to 24 channels | Up to 24 channels | Up to 24 channels | 0 (N grade, no transceivers) | Up to 24 channels | Up to 24 channels |
| Speed Grade | U1 (commercial) | U2 (~15% higher Fmax) | E2 (extended) | I1 (industrial) | N2 + E2 | U1 | U1 |
| Embedded Memory (M20K) | 68.85 Mbit | 68.85 Mbit | 68.85 Mbit | 68.85 Mbit | 68.85 Mbit | 53.2 Mbit | 68.85 Mbit |
| User I/Os | 480 | 480 | 480 | 480 | 480 | 480 | 480 |
| Process / Core Voltage | 20 nm / 0.9 V | 20 nm / 0.9 V | 20 nm / 0.9 V | 20 nm / 0.9 V | 20 nm / 0.9 V | 20 nm / 0.9 V | 20 nm / 0.9 V |
主要差異化特點
- Highest-density Arria 10 GX with 24 transceivers in F45 package (對比10AX090U1F45E1SG)
- Pin-compatible speed grade flexibility (對比10AX115U2F45E1SG)
- Logic parity vs N grade at lower cost when transceivers unused (對比10AX115N2F45E2SG)
設計說明
The 1932-ball FCBGA (F45) requires an 8-10 layer PCB stackup for fanout. Use 1.0 mm ball pitch microvia-in-pad construction; outer microvias must land directly on the BGA pad to support 14.4 Gbps transceiver routing. Maintain 100 ohm differential impedance for transceiver channels and stitch ground vias every 2-3 mm around the BGA perimeter. Reference the Arria 10 device handbook for via pattern recommendations.
Estimated: at full utilization with 24 active transceivers, the 10AX115U1F45E1SG core draws ~25-35W from a 0.9 V supply. Use a multiphase VRM (4-6 phases) with output inductors sized for 25A peak; place bulk decoupling within 25 mm of the BGA. Aux rails (1.8V, 2.5V, 3.0V) each require their own decoupling network. Refer to Intel's PowerPlay early-power estimator for design-specific budgeting.
The F45 FCBGA package has a theta_JA around 8-10 C/W with a properly designed heatsink. At 30W typical dissipation, attach a 30x30 mm aluminum heatsink with thermal interface material (TIM) and 200 CFM forced airflow, or design a custom cold plate for chassis conduction cooling. Without active cooling, the junction can exceed 100 C and trigger thermal shutdown under load.
Do not confuse the 'U' grade (with transceivers) with 'S' or 'N' grade (no transceivers) when substituting - the pin assignment differs at transceiver ball locations. Also verify Quartus Prime version compatibility: Arria 10 support requires Quartus 14.0 or later, with current 24.1 release recommended. Use configuration bitstream AES encryption when shipping production units to protect IP.
合規資訊
RoHS compliant per DigiKey product page. Lead-free finish (LG suffix) and standard SnPb ball variants available. AEC-Q100 not applicable - FPGAs are not automotive-qualified unless explicitly Q1-marked.