10AX115U3F45I2LG - Arria 10 GX FPGA, 1.15M LE | Intel | 1932-BGA
MPN： 10AX115U3F45I2LG ✓ 啟用中10AX115U3F45I2LG 概覽
An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and embedded memory and DSP resources. Unlike an ASIC, an FPGA's function is defined by user-loaded configuration data, enabling rapid hardware iteration, post-deployment upgrades, and hardware-level parallelism. Within the programmable logic hierarchy, FPGAs sit above CPLDs (which are smaller and non-volatile) and below structured ASICs in unit cost; Arria 10 GX specifically targets mid-range transceiver-heavy designs bridging Cyclone and Stratix families.
Key differentiating features of the 10AX115U3F45I2LG include 1,150,000 logic elements (LEs), 427,200 adaptive logic modules (ALMs), 52.99 Mbit embedded memory, 480 DSP blocks, and 24 transceivers at the U3 speed grade (12.5 Gbps). The part ships in a 45mm FCBGA-1932 (F45) package suitable for high-pin-count designs requiring maximum I/O density, and is qualified to the industrial operating range.
Arria 10 GX architecture combines a hard memory controller, PCIe hard IP blocks, and 10/12.5 Gbps transceivers on the same die, allowing deterministic latency and lower power than soft implementations. Compared with previous 28nm Arria V, Arria 10 GX achieves roughly 2x DSP throughput per watt, making it suitable for compute-intensive applications like 4K video processing and wireless baseband.
Typical applications include 4K/8K video broadcast equipment, 100G/400G Ethernet line cards, wireless LTE/5G fronthaul, radar and electronic warfare signal processing, medical imaging accelerators, and high-performance compute offload cards. The U3 speed grade supports up to 12.5 Gbps backplane and chip-to-chip links.
When designing with this device, plan for high-density PCB with 1.0mm BGA pitch, multi-layer PCB stack-up (12+ layers typical), and strict power integrity for the 0.95V core rail. Quartus Prime software provides synthesis, place-and-route, and timing analysis.
This page synthesizes distributor pricing, drop-in Arria 10 alternatives, and practical board-design notes not found in the manufacturer datasheet.
直接替換替代品，適用於 10AX115U3F45I2LG — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： 10AX115U3F45I2LG （相同外形與佔位） — 差異在於 Package, Process Technology, DSP Blocks, Operating Temperature, Speed Grade.
10AX115U3F45I2SG
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✅ 直接替換聯絡詢價
查看資料表 →10AX115U2F45I2SG
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查看資料表 →10AX115U3F45I2LG 最大額定值與電氣特性
| Family | Arria 10 GX |
| Logic Elements | 1,150,000 LE |
| Adaptive Logic Modules (ALMs) | 427,200 ALM |
| Embedded Memory | 68,857,856 bit (52.99 Mbit) |
| DSP Blocks | 480 |
| Transceivers | 24 (up to 12.5 Gbps, U3 speed grade) |
| Process Technology | 20nm |
| 封裝 | 1932-BBGA, FCBGA (F45) 45mm |
| 工作溫度 | -40C to +100C (Industrial) |
| 安裝類型 | Surface Mount (BGA) |
| Packaging | Tray |
| Configuration Memory | SRAM-based (volatile) |
| Hard Memory Controllers | Yes |
| Hard PCIe Blocks | Yes (Gen3) |
| RoHS 狀態 | Compliant |
10AX115U3F45I2LG 1932-bbga, fcbga (f45) 45mm 腳位配置指南
10AX115U3F45I2LG（1932-bbga, fcbga (f45) 45mm 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： 10AX115U3F45I2LG.
請參閱 資料表 以查看完整腳位配置。
典型應用
10AX115U3F45I2LG 適用於 6 應用s: 100G/400G Ethernet Line Cards, Wireless 4G/5G Fronthaul CPRI, 4K/8K Video Broadcast Processing, Radar and Electronic Warfare Signal Processing, Medical Imaging (CT/MRI) Reconstruction, High-Performance Compute Offload Cards.
100G/400G Ethernet Line Cards
The 10AX115U3F45I2LG is well-suited for 100G and aggregate 400G Ethernet line cards in telecom and data-center switching. The U3 speed grade delivers 12.5 Gbps per lane across 24 transceivers for ~300 Gbps aggregate serial bandwidth, while the 1.15M LE fabric absorbs soft-MAC, classification, and packet-processing logic. Its 480 DSP blocks accelerate hashing and crypto offload. Industrial temperature rating allows deployment in NEBS-compliant telecom chassis without thermal derating.
推薦
Wireless 4G/5G Fronthaul CPRI
In LTE and 5G fronthaul infrastructure, the 10AX115U3F45I2LG implements CPRI and eCPRI protocols on its 12.5 Gbps transceivers, supporting up to 24 RRH links per device. The 1.15M LE fabric handles PHY-layer baseband processing, while 480 DSP blocks accelerate FFT/iFFT and channelization filters. Hard PCIe Gen3 blocks enable direct host offload. The FCBGA-1932 package integrates cleanly into ATCA and OCP-style baseband cards.
推薦
4K/8K Video Broadcast Processing
The 10AX115U3F45I2LG is widely deployed in 4K and 8K broadcast equipment for real-time video processing, color-space conversion, and multi-stream encoding. The 480 DSP blocks deliver the parallel throughput required for HEVC and AV1 codec acceleration, while 52.99 Mbit of embedded memory buffers reference frames and intermediate line stores. The FCBGA-1932 package supports up to 24 video SERDES channels for SDI/HDMI ingest, fitting a single PCB for video switchers.
推薦
Radar and Electronic Warfare Signal Processing
Defense radar and EW systems leverage the 10AX115U3F45I2LG's 1.15M LE fabric and 480 DSP blocks for pulse compression, beamforming, and Doppler processing at sample rates up to several hundred MSPS. The 12.5 Gbps transceivers feed digital receiver data into the FPGA from multi-channel ADCs. Industrial temperature and rugged FCBGA-1932 package make the device suitable for airborne and naval platforms when paired with conformal coating and vibration isolation.
推薦
Medical Imaging (CT/MRI) Reconstruction
The 10AX115U3F45I2LG accelerates CT and MRI image reconstruction in the back-end of medical imaging systems. Its 480 DSP blocks execute filtered back-projection and iterative reconstruction kernels, while 52.99 Mbit embedded memory holds projection data. Transceivers aggregate raw RF data from multi-channel detector arrays at 12.5 Gbps per lane. The industrial temperature range supports stable operation in controlled hospital-room environments.
推薦
High-Performance Compute Offload Cards
Data-center acceleration cards use the 10AX115U3F45I2LG as a coprocessor for genomics, financial Monte Carlo, and AI inference offload. The PCIe Gen3 hard IP blocks provide low-latency host links, while the 1.15M LE fabric implements custom numeric pipelines. The 480 DSP blocks accelerate floating-point and fixed-point arithmetic at 2-3x the throughput of soft implementations, and 24 transceivers support multi-host configurations or FPGA-to-FPGA clustering.
推薦
推薦產品摘要
工程參考資料，適用於 10AX115U3F45I2LG — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | 10AX115U3F45I2SG | 10AX115U3F45E2LG | 10AX115U2F45I2LG |
|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | FCBGA-1932 (F45) 45mm | FCBGA-1932 (F45) 45mm - same | FCBGA-1932 (F45) 45mm - same | FCBGA-1932 (F45) 45mm - same |
| Logic Elements | 1,150,000 LE | 1,150,000 LE | 1,150,000 LE | 1,150,000 LE |
| Speed Grade | U3 (12.5 Gbps transceivers) | U3 (12.5 Gbps) | U3, extended temp E-grade | U2 (10 Gbps transceivers) |
| Temperature Range | Industrial -40C to +100C | Commercial 0C to +100C | Industrial with extended +125C | Industrial -40C to +100C |
| DSP Blocks | 480 | 480 | 480 | 480 |
| Embedded Memory | 52.99 Mbit | 52.99 Mbit | 52.99 Mbit | 52.99 Mbit |
| Transceivers | 24 channels up to 12.5 Gbps | 24 channels up to 12.5 Gbps | 24 channels up to 12.5 Gbps | 24 channels up to 10 Gbps |
主要差異化特點
- U3 speed grade enables 12.5 Gbps transceivers for 100G Ethernet (對比10AX115U2F45I2LG)
- Industrial -40C to +100C temperature range (對比10AX115U3F45I2SG)
- Largest density (1.15M LE) in Arria 10 GX family (對比10AX090U3F45I2LG)
設計說明
Estimated: The 10AX115U3F45I2LG typically dissipates 25-40W in a fully utilized configuration with active transceivers and DSP. The FCBGA-1932 F45 package requires a high-performance thermal solution - 4-6 W/mK thermal interface material, a copper or aluminum heatsink with at least 2 C/W resistance, and 400+ LFM airflow. Junction-to-ambient (theta_JA) without airflow is approximately 8 C/W per Altera thermal guidelines.
The 1.0mm pitch FCBGA-1932 requires a 12+ layer PCB with stacked micro-via (laser-drilled) build-up layers. Escape routing uses 4/4 mil trace-and-space in the inner ball-pitch region. A continuous GND plane below the FPGA package and a dedicated 0.95V core power plane are mandatory for power integrity. Decoupling requires ~80 capacitors (0.1uF, 1uF, 10uF, 47uF) within 100 mils of the BGA balls.
Core voltage is 0.95V (VCC) with tolerance +/- 30mV; transceivers use 1.0V and 1.5V auxiliary supplies, with I/O banks at 1.2V-3.3V depending on bank assignment. Power sequencing per Intel Arria 10 guidelines requires VCC to ramp before VCCPT and VCCAUX. Use the Arria 10 power tree with PWM controllers such as LTM4677 or ISL8225MEVAL. Estimated: full-power rails at 50-60W peak.
Transceiver channels operating at 12.5 Gbps require controlled-impedance routing (100 ohm differential +/- 10%) with maximum length matching within 5 mils across all 24 channels. Loss budget must stay under 6 dB at 6.25 GHz Nyquist. Use Megtron 6 or equivalent low-loss dielectric for the transceiver layer, and follow Intel Arria 10 GX PCB designer checklist.
Common pitfalls: (1) Insufficient thermal relief causes thermal shutdown at full load. (2) Configuration errors when JTAG and EPCQ flash are both attached - use MSEL pin resistors correctly per datasheet. (3) Voltage rails not sequencing per spec damages internal logic. (4) Ignoring the partial reconfiguration voltage (VCCP) connection on F45 package variants.
合規資訊
RoHS and REACH compliant per Altera (Intel) product page. Industrial temperature grade qualified; AEC-Q100 is not applicable to FPGAs of this class.
