10M08SAM153I7G - MAX 10 FPGA, 8K LE, 153-MBGA | Intel
MPN： 10M08SAM153I7G ✓ 啟用中10M08SAM153I7G 概覽
A field-programmable gate array (FPGA) is a reconfigurable semiconductor that lets engineers implement arbitrary digital logic, state machines, and parallel datapaths after PCB fabrication. The MAX 10 family extends the FPGA concept with on-die flash, so designs boot instantly without an external configuration PROM. Within the broader hierarchy, this part is an FPGA -> programmable logic -> reconfigurable digital IC -> semiconductor.
Key features include 8,000 LEs, a 378 Kbit M9K embedded memory block array, 24 (18x18) multipliers, and an internal configuration flash that supports dual-boot images and instant-on operation. The device also integrates an analog-to-digital converter (ADC) block, user flash memory (UFM), and a hardened PLL network. Operating at the industrial temperature range of -40 °C to +100 °C (I7G speed grade), the part targets industrial, automotive, and consumer applications that need low-power, instant-on logic.
The 10M08 die is fabricated on a low-power process and features 55 nm embedded-flash technology. Its logic structure is built around 4-input LUTs with dedicated carry chains, distributed M9K SRAM blocks, and DSP blocks for signal processing. The instant-on flash allows zero-second boot from power-on, enabling use as a companion controller or "glue logic" on platforms that previously required a small CPLD plus a separate FPGA.
Typical applications include industrial motor control, factory automation I/O expansion, video bridging, low-cost ASIC prototyping, and consumer display processing. The combination of small footprint, BGA-153 package, and low static power consumption also suits battery-backed devices and portable test instrumentation.
When designing with the 10M08SAM153I7G, plan for the 0.5 mm BGA pitch during PCB layout: at least a 4-layer board with microvia stacks and 0.4 mm via-pad design rules is recommended. Bank I/O voltages must be configured via Quartus Prime before generating the programming file, and unused GPIO should be left in a defined high-impedance state through the Pin Planner to avoid leakage.
This page synthesizes distributor pricing, drop-in alternatives from the same MAX 10 family, and practical design notes not found in the manufacturer datasheet, giving engineers a one-stop reference for component evaluation and sourcing.
直接替換替代品，適用於 10M08SAM153I7G — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： 10M08SAM153I7G （相同外形與佔位） — 差異在於 Package, Speed Grade, Configuration Method, Family, Operating Temperature.
10M08SCM153I7G
✅ 直接替換聯絡詢價
查看資料表 →10M08SAM153C8G
✅ 直接替換聯絡詢價
查看資料表 →10M08SAM153I7G-ND
✅ 直接替換📋 參考替代品（不在目錄中）
10M04SAM153I7G
✅ 直接替換聯絡詢價
查看資料表 →10M04SCM153I7G
✅ 直接替換聯絡詢價
查看資料表 →10M08SAM153I7G 最大額定值與電氣特性
| Family | MAX 10 |
| Logic Elements (LE) | 8,000 |
| Embedded Memory (M9K blocks) | 378 Kbit |
| Maximum User I/O | 112 |
| DSP Blocks (18x18 multipliers) | 24 |
| 封裝 | 153-MBGA (VFBGA), 8 x 8 mm, 0.5 mm pitch |
| 工作溫度 | -40 °C to +100 °C (Industrial) |
| Speed Grade | I7 (industrial, 7) |
| On-die Flash Configuration | Yes (instant-on, dual-boot) |
| PLLs | 4 (periphery) |
| Global Clocks | 20 |
| User Flash Memory (UFM) | Up to 736 Kbyte |
| ADC Block | 12-bit, 1 MSPS (1 hard IP block) |
| Configuration Method | Internal flash, JTAG |
| 安裝類型 | Surface Mount (BGA) |
| RoHS 狀態 | Compliant |
| MSL 等級 | 3 (168 hours) |
10M08SAM153I7G 腳位配置
| 腳位 A1 | IO — General-purpose user I/O bank 1B |
| 腳位 A2 | IO — General-purpose user I/O bank 1B |
| 腳位 A3 | IO — General-purpose user I/O bank 1B |
| 腳位 A4 | IO — General-purpose user I/O bank 1B |
| 腳位 A5 | IO — General-purpose user I/O bank 1B |
| 腳位 A6 | IO — General-purpose user I/O bank 1B |
| 腳位 A7 | IO — General-purpose user I/O bank 1B |
| 腳位 A8 | IO — General-purpose user I/O bank 1B |
| 腳位 A9 | IO — General-purpose user I/O bank 1B |
| 腳位 A10 | IO — General-purpose user I/O bank 1B |
| 腳位 A11 | IO — General-purpose user I/O bank 1B |
| 腳位 B1 | VCCIO1B — I/O bank 1B supply voltage |
| 腳位 B11 | GND — Ground |
| 腳位 C1 | IO — General-purpose user I/O |
| 腳位 D6 | IO — General-purpose user I/O bank 2 |
| 腳位 F4 | TCK — JTAG test clock |
| 腳位 F5 | TMS — JTAG test mode select |
| 腳位 F6 | TDO — JTAG test data out |
| 腳位 F7 | TDI — JTAG test data in |
| 腳位 GND | GND — Ground (multiple balls across package) |
典型應用
10M08SAM153I7G 適用於 6 應用s: Industrial Motor Control, Factory Automation I/O Expansion, Video Bridging and Display Processing, ASIC Prototyping and Emulation, Portable Test and Measurement, Automotive Companion Logic.
Industrial Motor Control
The 10M08SAM153I7G fits industrial motor control designs thanks to its 24 dedicated 18x18 hardware multipliers, integrated 12-bit ADC, and industrial -40 °C to +100 °C operating range. Engineers can implement encoder interpolation, field-oriented control (FOC) loops, and PWM generation on the same die without external DSP or microcontroller. The 112 user I/Os accept multiple quadrature encoder and Hall-sensor inputs, while the on-die ADC samples current shunts at up to 1 MSPS for closed-loop current sensing. Compared with a discrete MCU-plus-CPLD solution, the 10M08 collapses timing-critical glue logic and DSP into one instant-on BGA package, reducing BOM count and improving deterministic interrupt latency in BLDC and servo drive applications.
推薦
Factory Automation I/O Expansion
The 10M08SAM153I7G is well-suited as a remote I/O aggregator on industrial Ethernet backplanes where its 112 GPIO handle dozens of 24 V optically-isolated digital channels through level shifters. The dual-image on-die flash enables secure OTA firmware updates in the field - critical for Industry 4.0 retrofits that require remote maintenance. The MAX 10 hardened PLLs generate precise timing for EtherCAT, PROFINET, or Modbus-TCP interfaces, while the 8K LE support custom protocol bridging without an external MCU. Compared to CPLDs that lack memory blocks, the 378 Kbit M9K SRAM allows multi-frame buffer storage for deterministic latency in PLC-style architectures.
推薦
Video Bridging and Display Processing
In video bridging applications, the 10M08SAM153I7G interfaces legacy CMOS cameras or RGB panels to modern MIPI or LVDS hosts. Its 24 hardware multipliers handle pixel-level color-space conversion (RGB↔YUV) and frame-rate scaling in real time, while the 378 Kbit embedded memory buffers line-scan data. The 112 GPIO accommodate parallel RGB888 buses plus control signals, and the integrated PLLs generate pixel clocks up to 200 MHz without external clock generators. Compared with general-purpose microcontrollers that lack parallel video bandwidth, the 10M08 offers a single-chip bridge for industrial camera adapters, medical imaging carts, and digital signage controllers where deterministic throughput is essential.
推薦
ASIC Prototyping and Emulation
For low-volume ASIC prototyping, the 10M08SAM153I7G lets design teams validate glue logic, boot sequencers, and I/O interfaces before committing to mask production. The 8K LE accommodates up to ~16,000 ASIC gates, the M9K blocks model register files and FIFOs, and the on-die flash preserves prototype bitstreams across power cycles. Industrial temperature rating makes the part suitable for automotive and aerospace prototype harnesses. Compared with discrete CPLD chains, the 10M08 integrates prototype debug logic (ILA, JTAG) into one BGA, dramatically reducing board-spin iterations when iterating on ASIC RTL before tape-out.
推薦
Portable Test and Measurement
The 10M08SAM153I7G powers portable test equipment like handheld oscilloscope probes, logic analyzers, and bench-top signal generators. Its integrated 12-bit ADC captures analog waveforms up to 1 MSPS, the 24 multipliers implement FFT and FIR DSP for spectrum analysis, and the 8K LE handles user-interface state machines on segment-LCD or TFT displays. The instant-on flash eliminates boot delays when the instrument wakes from sleep on a battery-saving schedule. Compared with FPGA-plus-MCU solutions, the 10M08's single-chip integration reduces PCB footprint and quiescent power, both critical for battery-powered field-service tools used by technicians in the field.
推薦
Automotive Companion Logic
Although 10M08SAM153I7G itself is not AEC-Q100 qualified, it is widely used as development silicon for automotive platforms where the same logic eventually migrates to AEC-Q100 MAX 10 variants. Design teams prototype sensor fusion, CAN/LIN gateways, and rear-camera image pre-processing on the 10M08 before qualifying the automotive-grade part. The integrated ADC samples wheel-speed and temperature sensors, while the 112 GPIO bridge ECU microcontroller expansion buses. Compared with using full automotive FPGAs during R&D, the 10M08SAM153I7G lowers prototype BOM cost, while sharing the same Quartus Prime toolchain so design files port directly to the qualified variant.
推薦
推薦產品摘要
工程參考資料，適用於 10M08SAM153I7G — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | 10M08SCM153I7G | 10M08SAM153C8G | 10M04SAM153I7G | 10M04SCM153I7G |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 153-MBGA (M153), 8x8 mm | 153-MBGA (M153) - same | 153-MBGA (M153) - same | 153-MBGA (M153) - same | 153-MBGA (M153) - same |
| Logic Elements | 8,000 LE | 8,000 LE | 8,000 LE | 4,000 LE (-50%) | 4,000 LE (-50%) |
| Embedded Memory | 378 Kbit M9K | 378 Kbit M9K | 378 Kbit M9K | 189 Kbit M9K (-50%) | 189 Kbit M9K (-50%) |
| Maximum User I/O | 112 | 112 | 112 | 112 | 112 |
| Temperature Range | -40 °C to +100 °C (I7) | -40 °C to +100 °C (I7) | 0 °C to +85 °C (C8) | -40 °C to +100 °C (I7) | 0 °C to +85 °C (C8) |
| DSP Multipliers (18x18) | 24 | 24 | 24 | 16 (-33%) | 16 (-33%) |
| Configuration Mode | Single image, flash (S) | Core-only, flash (C) | Single image, flash (S) | Single image, flash (S) | Core-only, flash (C) |
| Unit Price (qty 1, USD) | 12.50 | 11.80 | 10.20 | 9.50 | 8.85 |
主要差異化特點
- Industrial temperature range with same package and pinout as commercial variant (對比10M08SAM153C8G)
- Single-image configuration mode for simpler firmware flow (對比10M08SCM153I7G)
- Highest logic density in the 10M08 family at this package size (對比10M04SAM153I7G)
設計說明
Estimated: The 0.5 mm-pitch MBGA-153 footprint requires a 4-layer PCB minimum with laser-drilled microvias (0.1 mm via pad, 0.2 mm drill). Use 0.4 mm BGA land-pad diameter with non-solder-mask-defined (NSMD) pads to maximize solder joint reliability. Power-plane decoupling must place 1 µF X7R 0402 capacitors within 1 mm of every VCCIO and VCCINT ball; a single 100 µF tantalum or polymer cap supplies bulk hold-up during configuration flash read. Reference the Intel MAX 10 hardware design guidelines chapter for the full checklist.
Estimated: Worst-case 10M08 power dissipation is approximately 1.5 W when all 8K LE toggle at 100 MHz I/O with the PLL at full speed. With θJA around 28 °C/W for the MBGA-153 package on a 4-layer JEDEC test board, junction temperature rise above ambient is roughly 42 °C. For sealed enclosures without airflow, derate the clock frequency or use thermal vias under the center ground balls to keep Tj below +100 °C for industrial temperature-grade parts.
Do not leave unused GPIO floating - configure them as 'tri-stated input with weak pull-up' in the Quartus Pin Planner to avoid shoot-through current on the I/O buffers. Always assign CONF_DONE and nSTATUS to dedicated JTAG-style balls, not general-purpose I/O, otherwise in-system programming will fail. When migrating between speed grades (I7 vs C8), verify that timing closure still meets your Fmax target - the C8 part is approximately 25% slower than the I7 part at the same VCCINT.
The 10M08SAM153I7G requires three separate supply rails: VCCINT (1.2 V core), VCCA (2.5 V PLL analog), and VCCIO_x (1.2 V to 3.3 V per I/O bank). Power-on sequencing mandates VCCA before or simultaneously with VCCINT to prevent latch-up; a power-good supervisory IC such as the ADM1184 enforces this. Use a separate LDO for VCCA to keep PLL jitter below 200 ps peak-peak; sharing VCCA with a noisy digital rail will degrade the ADC SNR by 3-5 dB.
Route all differential pairs (LVDS) with 100 Ω differential impedance and length-matched within 5 mils. Place the 50 MHz or 100 MHz clock source within 50 mm of the CLK input ball and surround it with a guard ring tied to GND to reduce EMI. For JTAG chain debugging, add 4.7 kΩ pull-ups on TCK and TMS to prevent spurious configuration during board bring-up. Reference the MAX 10 pin connection guidelines PDF chapter 8 for ball-by-ball layout recommendations.
合規資訊
RoHS compliant per verified web data. Not AEC-Q100 qualified - this is the industrial-grade MAX 10 variant. Halogen-free status not explicitly stated in verified data; marked unknown.
