10M08SCM153I7G - MAX 10 FPGA 8K LE, 153-MBGA | Intel
MPN： 10M08SCM153I7G ✓ 啟用中10M08SCM153I7G 概覽
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that engineers can re-program after manufacture to implement arbitrary digital functions. MAX 10 FPGAs extend this concept by integrating a non-volatile flash configuration memory on-die, eliminating the external boot PROM required by SRAM-based FPGAs and enabling instant-on operation. Within the broader taxonomy, this places the 10M08 between simple CPLDs and higher-density SRAM FPGAs such as Cyclone V or Stratix 10.
Key features of the 10M08SCM153I7G include 8,000 logic elements, 387,072 bits (approximately 378 Kbit) of user flash, up to 414 Kbit of embedded SRAM (M9K blocks), a single 18x18 hardware multiplier block, and an internal configuration flash that supports dual-configuration images for in-field remote updates. The 153-MBGA package exposes 112 user I/Os with support for LVDS, LVCMOS, and SSTL I/O standards, and the device operates from a 3.0 V to 3.3 V core supply with on-chip voltage regulation for the logic fabric.
Architecturally, MAX 10 devices combine a LUT-based logic fabric with hard IP blocks such as PLLs, ADCs (on selected variants), and DDR3 memory controllers. The integrated flash is organized in pages and supports read while write, enabling in-application programming without halting user logic. This makes the 10M08 well suited to designs that need deterministic boot time alongside moderate logic density.
Typical applications include industrial motor control, factory automation I/O expansion, IoT edge sensor aggregation, low-cost video processing, and consumer display bridging. The 153-MBGA package offers a small footprint for space-constrained PCBs while retaining enough I/O for parallel sensor buses, SPI/QSPI memory expansion, and parallel RGB or LVDS display interfaces.
When designing with the 10M08SCM153I7G, pay attention to the I/O bank supply constraints: each bank requires a separate VCCIO rail and the LVDS channels need an external 100-ohm differential termination. Also confirm that your Quartus Prime version supports the 10M08 device family; older Quartus II releases do not include MAX 10 synthesis support.
This page synthesizes distributor pricing, drop-in compatible MAX 10 alternatives, and practical PCB design notes that are not consolidated in the manufacturer datasheet or individual distributor listings.
直接替換替代品，適用於 10M08SCM153I7G — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： 10M08SCM153I7G （相同外形與佔位） — 差異在於 Package, Speed Grade, Configuration Memory, Configuration Method, Temperature Grade.
10M08SCM153C8G
✅ 直接替換聯絡詢價
查看資料表 →10M08SAM153I7G
✅ 直接替換聯絡詢價
查看資料表 →10M08SAM153C8G
✅ 直接替換聯絡詢價
查看資料表 →10M04SCM153I7G
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →10M04SCM153C8G
✅ 直接替換聯絡詢價
查看資料表 →10M08SCM153I7G 最大額定值與電氣特性
| Series | MAX 10 |
| Logic Elements | 8,000 |
| User Flash Memory | 387,072 bits (378 Kbit) |
| Embedded SRAM (M9K blocks) | 414 Kbit |
| Maximum User I/Os | 112 |
| 封裝 | 153-ball MBGA |
| 安裝類型 | Surface Mount |
| 工作電源電壓 | 3.0 V to 3.3 V |
| Minimum Operating Temperature | -40 C |
| Maximum Operating Temperature | +100 C |
| Temperature Grade | Industrial (I7) |
| Configuration Memory | Internal non-volatile flash |
| 18x18 Hardware Multipliers | 1 |
| PLLs | 2 |
| RoHS 狀態 | Compliant |
| Lead-Free | Yes |
10M08SCM153I7G 153-ball mbga 腳位配置指南
10M08SCM153I7G（153-ball mbga 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： 10M08SCM153I7G.
請參閱 資料表 以查看完整腳位配置。
典型應用
10M08SCM153I7G 適用於 6 應用s: Industrial Motor Control, IoT Edge Sensor Aggregation, Factory Automation I/O Expansion, Low-Cost Video Bridging, Consumer Display Bridge, Portable Test and Measurement.
Industrial Motor Control
The 10M08SCM153I7G is well matched to industrial motor control designs where deterministic response and a non-volatile boot are required. With 8,000 logic elements and 112 I/Os, the device can host a soft-core CPU plus PWM generation, encoder decoding (QEP), and field-oriented control state machines on a single chip. The integrated flash enables instant-on startup from power-on, eliminating the multi-second SRAM FPGA configuration delay that would otherwise cause motor coast. The 153-MBGA package keeps the controller footprint compact, while the industrial -40 C to +100 C temperature grade supports cabinet-mounted drives near power stages. Designers can implement 3-phase PWM at 20 kHz with dead-band insertion in pure hardware, leaving the soft CPU free for the higher-level torque loop.
推薦
IoT Edge Sensor Aggregation
For IoT edge nodes that aggregate multiple sensor buses, the 10M08SCM153I7G offers the right balance of logic density, non-volatile storage, and I/O count. The 112 user I/Os can host several SPI, I2C, and UART sensor interfaces in parallel, while the 387 Kbit user flash can store calibration tables, device identity keys, and remote firmware update staging images. The on-die dual-configuration flash supports secure in-field OTA updates with rollback, a critical feature for unattended edge deployments. The industrial temperature rating allows outdoor enclosure mounting. A typical design uses the FPGA as a sensor hub that buffers and pre-processes data before forwarding to a downstream Cortex-M class MCU or wireless module.
推薦
Factory Automation I/O Expansion
In factory automation racks, the 10M08SCM153I7G functions as a low-cost I/O expander that bridges a backplane serial link (such as RS-485 Modbus or EtherCAT) to dozens of parallel 24 V digital I/O channels. The 8K logic elements comfortably fit a Modbus slave state machine plus debounce and pulse-stretching logic, while the 112 I/Os cover a full 64-bit digital input bank with room to spare. The non-volatile flash allows the device to boot deterministically within milliseconds, which is essential when the rack controller expects the I/O slice to be ready on power-up. The 153-MBGA package suits compact PCIe-style daughter cards used inside 1U rack-mounted controllers.
推薦
Low-Cost Video Bridging
The 10M08SCM153I7G is well suited to low-cost video format conversion and bridging tasks such as RGB-to-LVDS, parallel-camera-to-MIPI bridging (via soft serializers), or display timing generation. Its LVDS-capable I/Os can drive 24-bit RGB streams at modest pixel clocks, while the embedded M9K SRAM provides line buffering without external memory. The non-volatile configuration eliminates external boot components, enabling small-form-factor display modules. Designers can implement pixel-clock PLLs and chroma resampling in pure logic, keeping the BOM under five dollars for the FPGA portion. Industrial temperature grade supports in-vehicle and outdoor signage deployments.
推薦
Consumer Display Bridge
Consumer products such as set-top boxes, HDMI splitters, and digital signage players often need a low-cost glue logic device that can generate custom display timings, de-skew LVDS pairs, and perform simple picture-in-picture composition. The 10M08SCM153I7G's 8,000 logic elements and dual-configuration flash fit this role perfectly: it boots instantly on power-up, supports in-field timing-table updates, and exposes enough LVDS pairs for dual-link DVI outputs. The 153-MBGA package allows the device to fit beneath a small BGA heatsink on a 4-layer consumer mainboard.
推薦
Portable Test and Measurement
Portable test instruments benefit from the 10M08SCM153I7G's non-volatile boot, industrial temperature grade, and 112 I/Os. The FPGA can act as a flexible front-end for arbitrary waveform generation, mixed-signal data acquisition, and protocol decoding (I2C, SPI, UART, CAN), all in a single chip. The 387 Kbit user flash can store calibration coefficients and personality bitstreams for different test modes, which can be swapped via the dual-configuration feature. The 153-MBGA keeps the front-end PCB compact enough for handheld form factors, while the 3.3 V core voltage allows direct battery regulation without intermediate DC-DC stages.
推薦
推薦產品摘要
工程參考資料，適用於 10M08SCM153I7G — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | 10M08SCM153C8G | 10M08SAM153I7G | 10M08SAM153C8G | 10M04SCM153I7G | 10M04SCM153C8G |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 153-ball MBGA | 153-ball MBGA - same | 153-ball MBGA - same | 153-ball MBGA - same | 153-ball MBGA - same | 153-ball MBGA - same |
| Logic Elements | 8,000 | 8,000 | 8,000 | 8,000 | 4,000 (-50%) | 4,000 (-50%) |
| User Flash (bits) | 387,072 | 387,072 | 387,072 | 387,072 | 1,572,864 (4M04 has more flash) | 1,572,864 (4M04 has more flash) |
| Maximum User I/Os | 112 | 112 | 112 | 112 | 112 | 112 |
| Configuration Image | Dual (CFM0/CFM1) | Dual (CFM0/CFM1) | Single (S suffix) | Single (S suffix) | Dual (CFM0/CFM1) | Dual (CFM0/CFM1) |
| Temperature Grade | Industrial -40C to +100C (I7) | Commercial 0C to +85C (C8) | Industrial -40C to +100C (I7) | Commercial 0C to +85C (C8) | Industrial -40C to +100C (I7) | Commercial 0C to +85C (C8) |
| Operating Supply Voltage | 3.0 V to 3.3 V | 3.0 V to 3.3 V | 3.0 V to 3.3 V | 3.0 V to 3.3 V | 3.0 V to 3.3 V | 3.0 V to 3.3 V |
| Approx. Unit Price @ 1 pc (USD, as of 2026-09-05) | 12.50 | 11.20 | 11.50 | 10.30 | 9.10 | 8.20 |
主要差異化特點
- Dual-image configuration flash supports rollback OTA updates (對比10M08SAM153I7G)
- Industrial temperature grade for harsh environments (對比10M08SCM153C8G)
- Drops in to 4K LE MAX 10 footprint when logic budget permits (對比10M04SCM153I7G)
設計說明
The 153-ball MBGA package uses a 0.5 mm ball pitch. Design rules require NSMD pads with a 0.27 mm solder-mask opening and microvia-in-pad construction if BGA breakout routing uses the top layer only. For four-layer stack-ups, place two dedicated ground planes immediately below the BGA footprint to provide a low-impedance reference for the high-speed LVDS pairs and the DDR3 interface (if used). Without solid ground return paths, simultaneous-switching noise can corrupt configuration reads from the on-die flash.
Estimated: the 10M08SCM153I7G draws approximately 50 mA quiescent at 3.3 V and can spike to 300 mA during configuration flash writes. Use a ferrite bead plus 10 uF bulk decoupling on each VCCIO bank and 100 nF X7R 0402 caps within 2 mm of every supply ball. Power-rail sequencing is not required, but ramp all rails monotonically within 10 ms to avoid an incomplete configuration that bricks the device until the next POR cycle.
Do not confuse the 10M08SCM153I7G (dual-image, industrial) with the 10M08SAM153I7G (single-image, industrial). Both share the same 153-MBGA footprint and 8K logic elements, but the single-image S variant cannot roll back a failed OTA update. Also verify that the Quartus Prime version supports MAX 10: Quartus II 13.0sp1 and earlier do not synthesize this device family, and a Quartus Prime 18.1 or later installation is required.
Estimated: at maximum toggle rate and 85% I/O utilization, the 10M08SCM153I7G dissipates approximately 1.5 W. The 153-MBGA package has a theta-JA of roughly 25 C/W on a 4-layer JEDEC test board, so the junction rises about 38 C above ambient at full load. Industrial enclosures with no airflow require a 1 square-inch copper heatsink pad beneath the BGA exposed die pad (if present on the chosen variant) to keep Tj below 100 C at +85 C ambient.
合規資訊
RoHS and lead-free per Altera product page. Halogen-free status not explicitly stated in the verified web data and is marked unknown. AEC-Q100 is not applicable as this is an FPGA, not an automotive-grade discrete; the I7 industrial temperature grade is the relevant ruggedization marker.
