10M16SAU169C8G - MAX 10 FPGA, 16K LE, 169-UBGA | Intel
MPN： 10M16SAU169C8G ✓ 啟用中10M16SAU169C8G 概覽
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that combines the integration density of an ASIC with the flexibility of in-system reconfiguration. Within the broader semiconductor taxonomy, FPGAs sit above standard logic ICs and below full custom ASICs, offering parallel hardware execution, deterministic timing, and high I/O counts. The MAX 10 family occupies the low-power, non-volatile niche between CPLDs (used for simple glue logic) and higher-density Cyclone 10 or Cyclone V devices, making it ideal for I/O expansion, sensor aggregation, and bridge functions in industrial, automotive, and consumer systems.
Key differentiating features of the 10M16SAU169C8G include its integrated 12-bit successive-approximation ADC with up to 17 analog input channels, dual on-chip configuration flash for field-upgradeable bitstreams, and a hardened Nios II soft-processor-capable fabric. The 169-UBGA package exposes 130 user I/O pins (the remainder are power, ground, and configuration pins), supporting LVDS, LVCMOS, SSTL, and other single-ended and differential I/O standards. Internal clock management is provided by four general-purpose PLLs, and the device supports hot-socketing and instant-on operation from a single 3.0 V or 3.3 V supply.
Architecturally, the 10M16 builds on TSMC 55 nm embedded NOR flash, embedding the configuration bitstream in non-volatile memory that eliminates an external boot PROM. The logic fabric is composed of Logic Array Blocks (LABs) each containing 16 Logic Elements (LEs); each LE provides a 4-input LUT, a programmable register, carry-chain logic, and a register chain. Embedded memory blocks (M9K) deliver true dual-port RAM, ROM, and FIFO functions at up to 250 MHz, while DSP blocks deliver 18x18 multiplication with optional pre-adder and accumulator for common signal-processing kernels.
Typical applications for the 10M16SAU169C8G include industrial control and factory automation I/O expansion, machine vision and barcode scanner pre-processing, motor control timing and encoder interface bridges, automotive body and chassis subsystems, low-cost video processing and display controllers, and portable instrumentation with on-chip ADC for sensor readout. Designers also use the device for protocol bridging (UART/SPI/I2C to Ethernet or USB) and as a flexible replacement for multiple discrete logic ICs, reducing BOM count and PCB area.
When designing with the 10M16SAU169C8G, observe the 169-UBGA ball pitch (0.8 mm) which requires PCB fabrication with 4-mil solder mask dams and ENIG or OSP surface finish for reliable assembly. Decouple all VCCINT and VCCA pins with 0.1 uF X7R ceramics placed within 100 mil of the ball, and add a 10 uF bulk capacitor near each supply domain. Configuration is automatic at power-up from internal flash; if JTAG-based in-system programming is required, route TCK, TMS, TDI, and TDO to a 10-pin header per the Altera JTAG specification.
This page synthesizes distributor pricing, pin-compatible MAX 10 alternatives, and practical design notes not found in the standalone Intel datasheet, enabling faster BOM decisions for industrial and embedded designs.
直接替換替代品，適用於 10M16SAU169C8G — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： 10M16SAU169C8G （相同外形與佔位） — 差異在於 Package, Process Technology, Configuration Memory, Operating Temperature, Logic Elements (LE).
10M16SAU169I7G
✅ 直接替換聯絡詢價
查看資料表 →10M16SAU169A7G
✅ 直接替換📋 參考替代品（不在目錄中）
10M16SAU169C7G
✅ 直接替換📋 參考替代品（不在目錄中）
10M08SAU169C8G
✅ 直接替換聯絡詢價
查看資料表 →10M08SAU169I7G
✅ 直接替換聯絡詢價
查看資料表 →10M08SCU169I7G
✅ 直接替換聯絡詢價
查看資料表 →10M16SAU169C8G 最大額定值與電氣特性
| Family | MAX 10 |
| Logic Elements (LE) | 16,000 |
| Embedded Memory | 549 Kb (M9K blocks) |
| Embedded Multipliers (18x18) | 45 |
| User I/O Count | 130 |
| PLLs | 4 |
| 封裝 | 169-UBGA (11x11 mm, 0.8 mm pitch) |
| Process Technology | TSMC 55 nm embedded NOR flash |
| Configuration | Internal dual-configuration flash (non-volatile) |
| Integrated ADC | 12-bit SAR, up to 17 analog inputs |
| 工作溫度 | 0C to +85C (commercial) |
| Speed Grade | C8 |
| Supply Voltage (VCCINT) | 1.2 V (core) |
| 安裝類型 | Surface Mount (BGA) |
| RoHS 狀態 | Compliant |
10M16SAU169C8G 169-ubga (11x11 mm, 0.8 mm pitch) 腳位配置指南
10M16SAU169C8G（169-ubga (11x11 mm, 0.8 mm pitch) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： 10M16SAU169C8G.
請參閱 資料表 以查看完整腳位配置。
典型應用
10M16SAU169C8G 適用於 6 應用s: Industrial Control and Factory Automation I/O Expansion, Motor Control and Encoder Interface Bridges, Machine Vision and Barcode Scanner Pre-Processing, Automotive Body and Chassis Subsystems, Portable Instrumentation and Sensor Aggregation, Protocol Bridging and Interface Conversion.
Industrial Control and Factory Automation I/O Expansion
The 10M16SAU169C8G is well-suited to industrial I/O expansion with its 130 user I/O pins supporting LVCMOS 3.3V/2.5V and LVDS, plus 16K LEs for protocol bridging and timing. The integrated 12-bit ADC monitors supply rails and sensor inputs without an external chip, reducing BOM. The non-volatile instant-on configuration boots deterministically at power-up, critical for factory PLCs and remote I/O modules. The 169-UBGA package provides 0.8 mm ball pitch compatible with standard 4-layer FR-4 PCB fabrication.
推薦
Motor Control and Encoder Interface Bridges
The 10M16SAU169C8G fits motor control bridging with its 4 PLLs for precise PWM generation, 45 hardware 18x18 multipliers for Park/Clarke transforms, and 549 Kb RAM for encoder capture buffers. The 130 LVDS-capable I/O directly interface incremental encoder and Hall-sensor inputs. Its non-volatile flash enables deterministic instant-on behavior critical for safety-critical motor drive gate-driver sequencing. Quartus Prime DSP Builder supports model-based design of field-oriented control loops.
推薦
Machine Vision and Barcode Scanner Pre-Processing
The 10M16SAU169C8G performs image pre-processing in barcode and machine vision front-ends, leveraging 16K LEs for Sobel/threshold kernels and 45 multipliers for 2D convolution operations. 549 Kb of M9K memory buffers 640x480 image lines without external SRAM. The 12-bit integrated ADC digitizes analog image sensor outputs directly. The 169-UBGA package enables compact camera module designs with deterministic processing latency for real-time inspection systems.
推薦
Automotive Body and Chassis Subsystems
For non-safety automotive body electronics (lighting controllers, body control modules, HVAC), the 10M16SAU169C8G delivers 16K LEs for LIN/CAN gateway logic and 130 I/O for driving LED matrices and relay controls. While the commercial 0C-to-+85C grade suits in-cabin modules, designers should consider the industrial-temperature 10M16SAU169I7G for under-hood chassis applications. The integrated ADC monitors battery voltage and current sensing without external components, simplifying AEC-Q100-grade system designs.
推薦
Portable Instrumentation and Sensor Aggregation
Battery-powered portable instruments benefit from the 10M16SAU169C8G's integrated 12-bit ADC (up to 17 channels), non-volatile instant-on, and moderate density for sensor aggregation. With 16K LEs the device aggregates I2C/SPI sensor data, performs linearization and temperature compensation, and drives an LCD or OLED display via SPI. The 169-UBGA's 11x11 mm footprint fits handheld enclosures, and the on-chip flash eliminates external boot memory, reducing standby power and BOM count.
推薦
Protocol Bridging and Interface Conversion
The 10M16SAU169C8G is widely used as a flexible protocol bridge, translating between UART, SPI, I2C, I2S, SMBus, and parallel buses with deterministic latency. Its 16K LEs accommodate multi-channel bridges (e.g., SPI-to-UART plus I2C-to-SPI) on a single chip, replacing multiple discrete logic ICs and CPLDs. The 130 user I/O handle numerous bus peripherals concurrently, and Quartus Prime IP cores (Altera/Intel FPGA IP library) provide ready-made UART 16550, I2C master/slave, and SPI controllers with proven firmware.
推薦
推薦產品摘要
工程參考資料，適用於 10M16SAU169C8G — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | 10M16SAU169I7G | 10M16SAU169A7G | 10M16SAU169C7G | 10M08SAU169C8G | 10M08SAU169I7G |
|---|---|---|---|---|---|---|
| Package | 169-UBGA (U169) | 169-UBGA (U169) - same | 169-UBGA (U169) - same | 169-UBGA (U169) - same | 169-UBGA (U169) - same | 169-UBGA (U169) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 16,000 LE | 16,000 LE | 16,000 LE | 16,000 LE | 8,000 LE | 8,000 LE |
| Embedded RAM | 549 Kb | 549 Kb | 549 Kb | 549 Kb | 378 Kb | 378 Kb |
| 18x18 Multipliers | 45 | 45 | 45 | 45 | 24 | 24 |
| User I/O | 130 | 130 | 130 | 130 | 130 | 130 |
| Speed Grade | C8 | I7 | A7 | C7 | C8 | I7 |
| Operating Temperature | 0C to +85C (commercial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) |
主要差異化特點
- Industrial-temperature drop-in availability with identical pinout (對比10M16SAU169I7G)
- Down-migration path to 10M08 in same package (對比10M08SAU169C8G)
- Integrated 12-bit ADC eliminates external ADC chip (對比10M16SAU169C8G vs discrete MCU+ADC designs)
設計說明
The 169-UBGA package uses a 0.8 mm ball pitch requiring PCB fabrication with 4-mil (0.1 mm) solder mask dams and laser-drilled microvias for inner-layer fan-out. Use ENIG or OSP surface finish to ensure reliable ball wetting. Escape the outer two ball rows on the top layer with 4-mil traces and via-in-pad for the inner rows; a 4-layer stack-up with 1 oz copper on outer layers and 0.5 oz on inner planes provides adequate current capacity and signal integrity.
The 10M16SAU169C8G requires four supply rails: VCCINT (1.2 V core), VCCA (2.5 V PLL analog), VCCIO (1.2V to 3.3V per bank), and VCCPD (3.0/3.3 V configuration). Decouple every VCCINT pin with a 0.1 uF X7R ceramic placed within 100 mil of the ball, and add four 10 uF bulk capacitors distributed around the package periphery. Sequence VCCINT and VCCIO per the MAX 10 power-up specification to avoid latch-up; use a dedicated power supervisor (e.g., TPS3808) for multi-rail sequencing.
Estimated: total I/O count from the 169-ball package is 130 user I/O; the remaining 39 balls are power, ground, JTAG, and no-connect. Always validate pin assignments against the Intel Quartus Prime Pin Planner for the U169 package, especially for LVDS pairs which require true differential routing with 100 ohm differential impedance. Do not leave VCCIO banks floating even if unused - tie to a valid rail per datasheet to prevent I/O buffer leakage.
合規資訊
RoHS and REACH compliance per Intel product page. Commercial temperature grade (0C to +85C); for automotive AEC-Q100 qualified variants, consult Intel automotive-grade MAX 10 OPN listings. Halogen-free status not explicitly confirmed in provided data.
