10M08SAU169I7G - MAX 10 FPGA, 8K LE, 169-LFBGA | Altera
MPN: 10M08SAU169I7G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $16.2 | $162.00 |
| 100 | $14.05 | $1,405.00 |
| 500 | $12.1 | $6,050.00 |
| 1,000 | $10.45 | $10,450.00 |
10M08SAU169I7G Overview
MAX 10 FPGAs belong to the broader taxonomy of FPGAs (field-programmable gate arrays) -> programmable logic devices (PLDs) -> logic ICs -> integrated circuits. MAX 10 is a low-cost, non-volatile family that integrates a flash configuration memory on-chip, eliminating the need for an external boot PROM. The 10M08 is the lowest-density member of this family, optimized for glue logic, I/O expansion, and small control-plane applications where an MCU is overkill or a custom ASIC is too expensive.
Key features include 8K logic elements (LEs), 378 Kbits of embedded block RAM, 130 maximum user I/O pins, an integrated ADC, internal flash configuration memory, and support for industrial-grade temperatures. The LFBGA-169 package provides a compact footprint suitable for space-constrained designs. The 'I' suffix indicates industrial temperature range (-40C to +100C) and the '7' indicates a speed/power grade per Intel's MAX 10 ordering code scheme.
The device uses a TSMC 55nm embedded-flash process, allowing instant-on configuration and unlimited re-programmability. The integrated 12-bit ADC and temperature-sensing diode reduce external analog circuitry. The 169-LFBGA (UBGA) package has a 0.5mm or similar fine pitch typical of Intel FPGA ball-grid packages.
Typical applications include industrial I/O expansion, motor control, sensor aggregation, low-volume bridge designs replacing legacy CPLDs, and prototyping for ASIC replacement. The integrated flash makes MAX 10 suitable for unattended remote installations where the part must self-configure without external boot memory.
A key design consideration is that all variants in the MAX 10 family share the same Quartus Prime toolchain, simplifying code migration across densities. Choose 10M08 when 8K LEs is sufficient; otherwise migrate to 10M16, 10M25, 10M40, or 10M50 within the same tool chain.
This page synthesizes distributor pricing, MAX 10 family drop-in alternatives, and practical design notes not found in the manufacturer datasheet. All 5-8 alternatives share the same MAX 10 family toolchain.
Drop-in alternatives for 10M08SAU169I7G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with 10M08SAU169I7G (same form factor and footprint) — differing in Package, Operating Temperature, Configuration Memory, Speed Grade, Embedded Memory.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10M08SAU169I7P
✅ Drop-In✓ In Stock
$20.5 / Unit
View Datasheet →10M16SAU169I7G
✅ Drop-In✓ In Stock
$47.5563 / Unit
View Datasheet →10M08SCU169A7G
✅ Drop-In✓ In Stock
$19.85 / Unit
View Datasheet →10M08SAU169I7G Maximum Ratings & Electrical Characteristics
| Series | MAX 10 |
| Family | 10M08 |
| Logic Elements (LE) | 8000 |
| Embedded Memory (Bits) | 378048 (378 Kb) |
| Maximum User I/O | 130 |
| Package | 169-LFBGA (UBGA) |
| Core Voltage | 1.2 V |
| Operating Temperature | -40C to +100C (industrial, 'I') |
| Speed/Power Grade | 7 (per MAX 10 ordering code) |
| Mounting Type | Surface Mount |
| Configuration Memory | Internal flash (non-volatile) |
| Integrated ADC | Yes (12-bit, per MAX 10 family) |
| RoHS Status | Compliant (per distributor listings) |
| FPGA Logic Cells (per distributor) | 8000 |
10M08SAU169I7G 169-lfbga (ubga) Pin Configuration Guide
Pin configuration for 10M08SAU169I7G (169-lfbga (ubga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M08SAU169I7G.
Refer to the datasheet for full pin configuration.
Typical Applications
10M08SAU169I7G is suitable for 6 applications: Industrial I/O Expansion, Motor Control & PWM Generation, Sensor Aggregation & Bridge Logic, Legacy CPLD Replacement, Low-Volume ASIC Replacement, Prototyping & Design Validation.
Industrial I/O Expansion
The 10M08SAU169I7G fits industrial I/O expansion designs where a PLC or MCU lacks enough GPIO, special-function pins, or voltage-level translation channels. With 130 user I/O pins and a 169-LFBGA footprint, the device supports parallel buses (16/32-bit), dozens of opto-isolated inputs, and PWM outputs for solenoid/valve control. The integrated 12-bit ADC on the MAX 10 family eliminates external analog front-end for sensor aggregation tasks. Industrial temperature rating (-40C to +100C) plus non-volatile flash configuration means a PLC can power-on instantly after a brownout without boot-PROM delay. Drop into the same U169 footprint as 10M16/10M25 if you later outgrow 8K LEs.
Recommended
Motor Control & PWM Generation
The 10M08SAU169I7G suits low-cost multi-axis motor control applications including stepper drivers, BLDC commutation logic, and encoder counters. With 8K LEs the device can implement 3-4 axes of field-oriented control (FOC) state machines plus safety interlocks; the 169-LFBGA exposes enough I/O for Hall/encoder inputs, PWM outputs, and fault feedback to gate drivers. The non-volatile flash eliminates external boot memory and supports field firmware upgrades via JTAG. Industrial temperature and integrated ADC allow direct sensing of motor current via shunt resistors. Migrate to 10M16 if more axes are needed.
Recommended
Sensor Aggregation & Bridge Logic
The 10M08SAU169I7G is ideal as a sensor-hub FPGA between multiple I2C/SPI/UART sensors and a host processor, handling protocol translation, timestamping, and thresholding. With 8K LEs and 130 I/O, it can interface with up to a dozen sensors simultaneously and pre-process data to reduce host CPU load. The integrated 12-bit ADC on MAX 10 family adds analog sensor channels without an external MUX. Industrial temperature operation is critical for factory-floor deployments where ambient temperature swings are routine.
Recommended
Legacy CPLD Replacement
The 10M08SAU169I7G replaces legacy 5V CPLDs (e.g., Altera MAX V, Xilinx XC9500XL) when designs outgrow 128 macro cells but still need simple parallel-logic behavior with non-volatile boot. Drop into the same 169-LFBGA footprint as a 10M08 vs MAX V migration, with Quartus Prime replacing the legacy MAX+Plus II toolchain. The on-chip flash provides instant-on configuration, no external PROM required. Industrial temperature and 1.2V core (with internal regulators) simplify 5V-tolerance bridging with bank I/O standards.
Recommended
Low-Volume ASIC Replacement
The 10M08SAU169I7G replaces low-volume custom ASICs at a fraction of NRE cost, ideal for 100-10,000 unit production runs where ASIC mask fees are not amortizable. With 8K LEs the device covers state machines, glue logic, and small datapaths that would otherwise require a custom mask set. Quartus Prime IP cores (UART, I2C, SPI, FIFO) replace ASIC RTL blocks. The LFBGA-169 package supports high-density PCB escape routing common in ASIC land patterns, easing migration. Industrial temp grade suits most commercial/industrial markets.
Recommended
Prototyping & Design Validation
The 10M08SAU169I7G works well as a prototyping platform before committing to higher-density MAX 10 (10M25/10M40/10M50) or migration to Cyclone IV/V. Designers can implement full system glue logic, validate pin assignments against the U169 ballout, and confirm timing closure before scaling. Quartus Prime allows seamless migration of the same RTL/bitstream settings to larger MAX 10 densities. The 169-LFBGA package matches the high-density variant footprints, preserving PCB layout work.
Recommended
Recommended Products Summary
Engineering reference data for 10M08SAU169I7G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M08SAU169I7 | 10M16SAU169I7G | 10M08SCU169A7G |
|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 169-LFBGA (U169) | 169-LFBGA (U169) - same | 169-LFBGA (U169) - same | 169-LFBGA (U169) - same |
| Logic Elements | 8000 | 8000 | 16000 (+100%) | 8000 |
| Embedded Memory (Kb) | 378 | 378 | 756 (+100%) | 378 |
| Max User I/O | 130 | 130 | 130 | 130 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Configuration Memory | Internal flash (non-volatile) | Internal flash (non-volatile) | Internal flash (non-volatile) | Internal flash (non-volatile) |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Integrated ADC | Yes (12-bit) | Yes (12-bit) | Yes (12-bit) | Yes (12-bit) |
Key Differentiators
- Non-volatile instant-on configuration (vs Cyclone IV EP4CE6 (SRAM-based FPGA))
- Integrated 12-bit ADC (vs MAX V CPLD (no analog))
- 130 user I/O in 169-ball BGA (vs Lattice MachXO3LF-9400 in 256-ball BGA)
Design Notes
The MAX 10 10M08 requires multiple supply rails: 1.2V core, 2.5V/3.3V analog and I/O bank supplies per bank, plus a 3.0-3.3V configuration flash supply (often shared with a bank). Decouple each rail with at least one 10uF bulk plus 0.1uF + 1nF high-frequency caps placed within 5mm of the BGA balls. Estimated: total supply current at typical 8K LE utilization is 200-400 mA on 1.2V; verify with Quartus Prime PowerPlay analyzer for your design.
The 169-LFBGA package has fine ball pitch (0.5mm or similar); use 4 or more PCB layers with continuous ground/power planes below the BGA, microvias for fanout, and 0.5oz copper on signal layers. Escape routing for inner balls requires via-in-pad with filled-and-capped microvias. A solid ground pour directly under the BGA reduces ground bounce on simultaneous-switching outputs. Refer to Intel MAX 10 hardware design guidelines for fanout pattern recommendations.
Common pitfalls with 10M08SAU169I7G designs include: (1) forgetting that the JTAG pins are dual-purpose and need pull-ups to TCK/TMS if unused; (2) failing to assign CONF_DONE and nSTATUS to user I/O-compatible pins when not using JTAG-only configuration; (3) ignoring the device's minimum configuration flash retention time (typically 10+ years) when storing factory calibration; (4) using 5V inputs without external level shifters (MAX 10 I/O banks are 1.2-3.3V tolerant only).
At high toggle rates the 10M08SAU169I7G's 169-LFBGA junction-to-ambient thermal resistance (theta_JA) is approximately 25-35 C/W on a JEDEC 4-layer test board. Estimated: full-utilization at 100 MHz core clock can dissipate 0.5-1.0W, producing a junction temperature rise of 12-35C above ambient - acceptable for industrial temperature but verify with the Quartus PowerPlay report for your design's actual toggle profile.
Compliance Information
RoHS compliant per distributor listings. Not AEC-Q100 qualified - use MAX 10 automotive variants for AEC-Q100 applications. Lead-free confirmed per Intel ordering code conventions.
