10M16SAU169C8G - MAX 10 FPGA, 16K LE, 169-UBGA | Intel
MPN: 10M16SAU169C8G β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $36.93 | $36.93 |
| 10 | $33.2 | $332.00 |
| 100 | $28.5 | $2,850.00 |
| 500 | $24.8 | $12,400.00 |
| 1,000 | $21.4 | $21,400.00 |
Drop-in alternatives for 10M16SAU169C8G β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
10M16SAU169I7G
β Drop-Inβ In Stock
$47.5563 / Unit
View Datasheet β10M16SAU169A7G
β Drop-Inπ Reference alternative (not in catalog)
10M16SAU169C7G
β Drop-Inπ Reference alternative (not in catalog)
10M08SAU169C8G
β Drop-Inβ In Stock
$11.85 / Unit
View Datasheet β10M08SAU169I7G
β Drop-Inπ Reference alternative (not in catalog)
10M08SCU169I7G
β Drop-Inβ In Stock
$9.85 / Unit
View Datasheet β10M16SAU169C8G Maximum Ratings & Electrical Characteristics
| Family | MAX 10 |
| Logic Elements (LE) | 16,000 |
| Embedded Memory | 549 Kb (M9K blocks) |
| Embedded Multipliers (18x18) | 45 |
| User I/O Count | 130 |
| PLLs | 4 |
| Package | 169-UBGA (11x11 mm, 0.8 mm pitch) |
| Process Technology | TSMC 55 nm embedded NOR flash |
| Configuration | Internal dual-configuration flash (non-volatile) |
| Integrated ADC | 12-bit SAR, up to 17 analog inputs |
| Operating Temperature | 0C to +85C (commercial) |
| Speed Grade | C8 |
| Supply Voltage (VCCINT) | 1.2 V (core) |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
10M16SAU169C8G 169-ubga (11x11 mm, 0.8 mm pitch) Pin Configuration Guide
Complete pinout information for 10M16SAU169C8G (169-ubga (11x11 mm, 0.8 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M16SAU169C8G.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M16SAU169C8G is suitable for 6 applications: Industrial Control and Factory Automation I/O Expansion, Motor Control and Encoder Interface Bridges, Machine Vision and Barcode Scanner Pre-Processing, Automotive Body and Chassis Subsystems, Portable Instrumentation and Sensor Aggregation, Protocol Bridging and Interface Conversion.
Industrial Control and Factory Automation I/O Expansion
The 10M16SAU169C8G is well-suited to industrial I/O expansion with its 130 user I/O pins supporting LVCMOS 3.3V/2.5V and LVDS, plus 16K LEs for protocol bridging and timing. The integrated 12-bit ADC monitors supply rails and sensor inputs without an external chip, reducing BOM. The non-volatile instant-on configuration boots deterministically at power-up, critical for factory PLCs and remote I/O modules. The 169-UBGA package provides 0.8 mm ball pitch compatible with standard 4-layer FR-4 PCB fabrication.
Recommended
Motor Control and Encoder Interface Bridges
The 10M16SAU169C8G fits motor control bridging with its 4 PLLs for precise PWM generation, 45 hardware 18x18 multipliers for Park/Clarke transforms, and 549 Kb RAM for encoder capture buffers. The 130 LVDS-capable I/O directly interface incremental encoder and Hall-sensor inputs. Its non-volatile flash enables deterministic instant-on behavior critical for safety-critical motor drive gate-driver sequencing. Quartus Prime DSP Builder supports model-based design of field-oriented control loops.
Recommended
Machine Vision and Barcode Scanner Pre-Processing
The 10M16SAU169C8G performs image pre-processing in barcode and machine vision front-ends, leveraging 16K LEs for Sobel/threshold kernels and 45 multipliers for 2D convolution operations. 549 Kb of M9K memory buffers 640x480 image lines without external SRAM. The 12-bit integrated ADC digitizes analog image sensor outputs directly. The 169-UBGA package enables compact camera module designs with deterministic processing latency for real-time inspection systems.
Recommended
Automotive Body and Chassis Subsystems
For non-safety automotive body electronics (lighting controllers, body control modules, HVAC), the 10M16SAU169C8G delivers 16K LEs for LIN/CAN gateway logic and 130 I/O for driving LED matrices and relay controls. While the commercial 0C-to-+85C grade suits in-cabin modules, designers should consider the industrial-temperature 10M16SAU169I7G for under-hood chassis applications. The integrated ADC monitors battery voltage and current sensing without external components, simplifying AEC-Q100-grade system designs.
Recommended
Portable Instrumentation and Sensor Aggregation
Battery-powered portable instruments benefit from the 10M16SAU169C8G's integrated 12-bit ADC (up to 17 channels), non-volatile instant-on, and moderate density for sensor aggregation. With 16K LEs the device aggregates I2C/SPI sensor data, performs linearization and temperature compensation, and drives an LCD or OLED display via SPI. The 169-UBGA's 11x11 mm footprint fits handheld enclosures, and the on-chip flash eliminates external boot memory, reducing standby power and BOM count.
Recommended
Protocol Bridging and Interface Conversion
The 10M16SAU169C8G is widely used as a flexible protocol bridge, translating between UART, SPI, I2C, I2S, SMBus, and parallel buses with deterministic latency. Its 16K LEs accommodate multi-channel bridges (e.g., SPI-to-UART plus I2C-to-SPI) on a single chip, replacing multiple discrete logic ICs and CPLDs. The 130 user I/O handle numerous bus peripherals concurrently, and Quartus Prime IP cores (Altera/Intel FPGA IP library) provide ready-made UART 16550, I2C master/slave, and SPI controllers with proven firmware.
Recommended
Recommended Products Summary
Engineering reference data for 10M16SAU169C8G β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M16SAU169I7G | 10M16SAU169A7G | 10M16SAU169C7G | 10M08SAU169C8G | 10M08SAU169I7G |
|---|---|---|---|---|---|---|
| Package | 169-UBGA (U169) | 169-UBGA (U169) - same | 169-UBGA (U169) - same | 169-UBGA (U169) - same | 169-UBGA (U169) - same | 169-UBGA (U169) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 16,000 LE | 16,000 LE | 16,000 LE | 16,000 LE | 8,000 LE | 8,000 LE |
| Embedded RAM | 549 Kb | 549 Kb | 549 Kb | 549 Kb | 378 Kb | 378 Kb |
| 18x18 Multipliers | 45 | 45 | 45 | 45 | 24 | 24 |
| User I/O | 130 | 130 | 130 | 130 | 130 | 130 |
| Speed Grade | C8 | I7 | A7 | C7 | C8 | I7 |
| Operating Temperature | 0C to +85C (commercial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) |
Key Differentiators
- Industrial-temperature drop-in availability with identical pinout (vs 10M16SAU169I7G)
- Down-migration path to 10M08 in same package (vs 10M08SAU169C8G)
- Integrated 12-bit ADC eliminates external ADC chip (vs 10M16SAU169C8G vs discrete MCU+ADC designs)
Design Notes
The 169-UBGA package uses a 0.8 mm ball pitch requiring PCB fabrication with 4-mil (0.1 mm) solder mask dams and laser-drilled microvias for inner-layer fan-out. Use ENIG or OSP surface finish to ensure reliable ball wetting. Escape the outer two ball rows on the top layer with 4-mil traces and via-in-pad for the inner rows; a 4-layer stack-up with 1 oz copper on outer layers and 0.5 oz on inner planes provides adequate current capacity and signal integrity.
The 10M16SAU169C8G requires four supply rails: VCCINT (1.2 V core), VCCA (2.5 V PLL analog), VCCIO (1.2V to 3.3V per bank), and VCCPD (3.0/3.3 V configuration). Decouple every VCCINT pin with a 0.1 uF X7R ceramic placed within 100 mil of the ball, and add four 10 uF bulk capacitors distributed around the package periphery. Sequence VCCINT and VCCIO per the MAX 10 power-up specification to avoid latch-up; use a dedicated power supervisor (e.g., TPS3808) for multi-rail sequencing.
Estimated: total I/O count from the 169-ball package is 130 user I/O; the remaining 39 balls are power, ground, JTAG, and no-connect. Always validate pin assignments against the Intel Quartus Prime Pin Planner for the U169 package, especially for LVDS pairs which require true differential routing with 100 ohm differential impedance. Do not leave VCCIO banks floating even if unused - tie to a valid rail per datasheet to prevent I/O buffer leakage.
Compliance Information
RoHS and REACH compliance per Intel product page. Commercial temperature grade (0C to +85C); for automotive AEC-Q100 qualified variants, consult Intel automotive-grade MAX 10 OPN listings. Halogen-free status not explicitly confirmed in provided data.
