A3PE3000-1FG896I - 3M-Gate Flash FPGA, 620 I/O | Microchip
MPN： A3PE3000-1FG896I ✗ 停產A3PE3000-1FG896I 概覽
A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip non-volatile flash memory cells rather than an external configuration ROM. This places it in the hierarchy: FPGA -> programmable logic device -> digital IC -> semiconductor. Unlike SRAM FPGAs, flash FPGAs are live-at-power-up (Level 0 support) and provide a true single-chip solution with inherent security benefits because the bitstream never needs to be exposed during power-up.
Key features include 130-nm, 7-layer metal (6 copper) flash-based CMOS process technology, up to 504 kbits of true dual-port SRAM, and an abundance of advanced I/O standards. The ProASIC3E family adds enhanced clocking resources, multiple PLLs, and support for optional soft ARM Cortex-M1 processor cores, extending the third-generation ProASIC architecture beyond the ProASICPLUS family.
Technical depth: the -1 speed grade delivers 272 MHz system performance at a 1.5V core supply, while the FBGA-896 footprint exposes 620 user I/Os for wide-bus data path, memory interface, and bus-bridging designs. VersaTile-based architecture allows each tile to be configured as logic, SRAM, or register functions, giving high effective gate utilization.
Typical applications include industrial automation controllers, military and aerospace logic consolidation, communications line cards, and test-and-measurement systems where non-volatile, secure, instant-on configuration is required.
Design consideration: the part is end-of-life (December 2026 per distributor data), so new designs should evaluate the low-power A3PE3000L variants or Microchip's newer PolarFire and IGLOO2 families.
This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet.
直接替換替代品，適用於 A3PE3000-1FG896I — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： A3PE3000-1FG896I （相同外形與佔位） — 差異在於 Family, Configuration Memory, Package, Process Technology, System Gates.
A3PE3000-1FGG896I
✅ 直接替換聯絡詢價
查看資料表 →A3PE3000-2FG896I
✅ 直接替換聯絡詢價
查看資料表 →A3PE3000-FG896I
✅ 直接替換聯絡詢價
查看資料表 →A3PE3000-FGG896I
✅ 直接替換聯絡詢價
查看資料表 →A3PE3000L-1FG896I
✅ 直接替換聯絡詢價
查看資料表 →A3PE3000L-1FGG896I
✅ 直接替換聯絡詢價
查看資料表 →A3PE3000-1FG896I 最大額定值與電氣特性
| Family | ProASIC3E (Flash FPGA) |
| System Gates | 3,000,000 |
| User I/O | 620 |
| System Frequency (-1 speed grade) | 272 MHz |
| True Dual-Port SRAM | 504 kbits |
| Process Technology | 130-nm, 7-layer metal (6 copper), flash-based CMOS |
| Core Supply Voltage | 1.5 V |
| Configuration Memory | On-chip flash, 516096 bits, live-at-power-up (Level 0) |
| 封裝 | 896-ball FBGA (FG896), 1 mm pitch |
| 工作溫度 | -40C to +85C (Industrial, I suffix) |
| 安裝類型 | Surface Mount |
| Logic Family | CMOS |
| Soft CPU Support | ARM Cortex-M1 (optional soft core) |
| Reprogrammability | In-system reprogrammable flash |
| Security | Single-chip solution, flash-based bitstream security |
A3PE3000-1FG896I 896-ball fbga (fg896), 1 mm pitch 腳位配置指南
A3PE3000-1FG896I（896-ball fbga (fg896), 1 mm pitch 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： A3PE3000-1FG896I.
請參閱 資料表 以查看完整腳位配置。
典型應用
A3PE3000-1FG896I 適用於 6 應用s: Industrial Automation Controllers, Military and Aerospace Logic Consolidation, Communications Line Cards, Test and Measurement Systems, Secure Embedded Control with Cortex-M1, Power-Up-Critical Bridge and Glue Logic.
Industrial Automation Controllers
The A3PE3000-1FG896I fits industrial automation where deterministic, instant-on behavior is mandatory: its flash configuration provides live-at-power-up Level 0 startup with no boot delay, and the industrial-grade I suffix covers -40C to +85C on the factory floor. With 3M gates and 620 user I/Os, it consolidates bus interfaces, protocol bridges, and motion-control state machines into the single 896-FBGA chip, while 504 kbits of true dual-port SRAM buffer fieldbus packets and sensor streams. Placed as the main control fabric between PLC backplane connectors and I/O drivers, it removes external configuration PROMs and reduces total cost of ownership, though designers must budget for the December 2026 end-of-life in long-lifetime factory equipment.
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Military and Aerospace Logic Consolidation
Flash-based FPGAs are the default choice in military and aerospace payloads because the configuration bitstream never appears on the bus at power-up, giving inherent resistance to bitstream interception, and the single-chip flash solution removes a reliability point (external configuration memory). The A3PE3000-1FG896I provides 3M gates, 272 MHz (-1 grade) fabric performance, and 620 I/Os for sensor-interface and telemetry boards, all in a 1.5V-core 896-FBGA. Dual-port SRAM (504 kbits) implements FIFOs between processing channels. Board designers typically pair it with radiation-tolerant power components and use Libero SoC for secure design flow; the low-power A3PE3000L variant suits battery- or conduction-cooled platforms where dissipation is capped.
推薦
Communications Line Cards
Line-card designs benefit from the A3PE3000-1FG896I's wide 620-user-I/O count, which terminates backplane buses, PHY interfaces, and framer connections simultaneously, and its 272 MHz fabric that closes timing on framing and packet-processing pipelines. The 504 kbits of true dual-port SRAM implement channel FIFOs and statistics counters without external memory. Because flash configuration is live at power-up, the card is ready when the backplane enumerates, simplifying hot-swap sequencing relative to SRAM FPGAs that require configuration download. Designers should allocate the -2 speed grade (A3PE3000-2FG896I) for high-rate serial framing paths if timing margin is tight, as both share the identical 896-FBGA footprint and Libero project.
推薦
Test and Measurement Systems
Bench and automated test instruments use the A3PE3000-1FG896I as reprogrammable channel logic: 3M gates host per-channel pattern generators, capture engines, and timing comparators, while 620 I/Os fan out to probe and relay interfaces on the 896-FBGA. Instant-on flash configuration means the instrument is functional at power switch, and in-system flash reprogramming allows the test sequence logic to be updated in the field without soldering or socketed devices. The 504 kbit dual-port SRAM buffers captured waveforms ahead of the readback path. Note for instrument makers with long service commitments: the device is EOL December 2026, so service-stock buys should be planned now, or use the same-footprint low-power A3PE3000L-1FG896I going forward.
推薦
Secure Embedded Control with Cortex-M1
The ProASIC3E family supports an optional soft ARM Cortex-M1 processor, and the A3PE3000-1FG896I's 3M-gate fabric is large enough to host the CPU core, bus fabric, peripherals, and control state machines together. Because configuration resides in on-chip flash, the firmware and logic image boot instantly and are protected by the flash FPGA's inherent security, an advantage over SRAM FPGA designs whose bitstream is loaded externally at each power-up. The 504 kbit dual-port SRAM provides code buffers and DMA scratch space; 620 I/Os connect motors, sensors, and communication transceivers. Designers should verify Cortex-M1 synthesis resource usage in Libero SoC and choose the -1 speed grade's 272 MHz ceiling when budgeting processor clock domains.
推薦
Power-Up-Critical Bridge and Glue Logic
Systems that must be active the moment power arrives - such as watchdogs, backplane arbitrators, and fail-safe bridges - cannot tolerate the configuration delay of SRAM FPGAs. The A3PE3000-1FG896I is live at power-up (Level 0) from its on-chip flash, making it ideal for arbitration and bridging logic between processors, memories, and legacy buses. The 3M-gate capacity absorbs large address decoders, bus-width converters, and interrupt controllers, while 620 I/Os expose the wide buses on the 896-FBGA footprint. One trade-off: the 1.5V core and 130-nm process draw more static power than modern nodes, so thermally sealed chassis should consider the A3PE3000L variant, which is footprint-identical and requires no PCB change.
推薦
推薦產品摘要
工程參考資料，適用於 A3PE3000-1FG896I — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | A3PE3000-1FGG896I | A3PE3000-2FG896I | A3PE3000-FG896I | A3PE3000L-1FG896I |
|---|---|---|---|---|---|
| Package | 896-ball FBGA (FG896) | 896-ball FBGA - same footprint, lead-free balls | 896-ball FBGA - same | 896-ball FBGA - same | 896-ball FBGA - same |
| Brand | Microchip Technology (Microsemi/Actel) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 |
| Speed Grade / System Frequency | -1 (272 MHz) | -1 (272 MHz) | -2 (faster than -1) | Standard (231 MHz) | -1 (272 MHz, low power) |
| User I/O | 620 | 620 | 620 | 620 | 620 |
| True Dual-Port SRAM | 504 kbits | 504 kbits | 504 kbits | 504 kbits | 504 kbits |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V (reduced power) |
| Power Profile | Standard | Standard | Standard | Standard | Low power (L variant) |
主要差異化特點
- Fastest widely stocked speed grade in FG896 family (對比A3PE3000-FG896I)
- Instant-on flash configuration (對比SRAM-based competitor FPGAs)
- Same-footprint low-power upgrade path (對比A3PE3000L-1FG896I)
- RoHS-compliant variant availability (對比A3PE3000-1FGG896I)
設計說明
The A3PE3000-1FG896I reaches end-of-life in December 2026 per distributor data. Existing designs must either execute a last-time-buy covering the full service-life quantity or qualify a same-footprint successor (A3PE3000-1FGG896I for RoHS builds, or A3PE3000L-1FG896I where power allows) while stock remains. Verify remaining distributor inventory via Octopart (7 listed distributors as of 2026-09-02) before locking the BOM, and request a Microchip PCN/lifetime notification for volume programs.
Estimated: the 1.5V core of this 3M-gate, 130-nm flash fabric draws static power proportional to used tiles and dynamic power proportional to switching activity. For large fabric utilization (above ~70 percent) at 272 MHz, budget airflow or heatsinking in the 896-FBGA thermal path; if measured dissipation is marginal, the footprint-identical A3PE3000L-1FG896I reduces static power without PCB rework. Use Microchip's power calculator in Libero SoC with your actual netlist for exact figures rather than first-order estimates.
The 896-ball FBGA at 1 mm ball pitch requires via-in-pad or dog-bone fanout with sequential-lamination or buried-via stackups; plan at least two signal layers for full escape routing of the 620 user I/Os. Follow the ProASIC3E datasheet power-pin table and place decoupling capacitors (bulk plus high-frequency ceramics) on the 1.5V core rail and each I/O bank supply directly beneath the package. Confirm ball-out against the DS0098 pin tables before finalizing land pattern, as it differs from the 484-ball and 676-ball family variants.
At the -1 grade's 272 MHz ceiling, route high-fanout clock nets on dedicated global clock networks (six chip-level plus quadrant networks per the ProASIC3E architecture) and reference the PLLs for I/O timing closure. For wide memory or backplane interfaces using fast I/O standards, perform IBIS-based simulation of the 1 mm-pitch BGA breakout stubs; the dog-bone fanout stub can degrade edges above approximately 150 MHz. Pin-multiplexed I/O bank assignment in Libero SoC should be checked against VCCI bank domains to avoid supply conflicts.
合規資訊
The A3PE3000-1FG896I (FG suffix) uses standard ball composition; the A3PE3000-1FGG896I (FGG suffix) is the Microchip lead-free ball variant. Exact RoHS/REACH certificates must be confirmed with Microchip or the distributor, as they were not stated in the retrieved web data.
