Microchip Technology
A3PE3000L-FG896M - 3M-Gate Low-Power Flash FPGA | Microchip
MPN： A3PE3000L-FG896M ✓ 啟用中
1.2 V / 1.5 V Vdss
896-ball FBGA (FG896) Package
On-chip flash (nonvolatile, single-chip) Memory
MOQ： 1 |
A3PE3000L-FG896M 概覽
The Microchip (formerly Microsemi/Actel) A3PE3000L-FG896M is a 3-million-gate ProASIC3L low-power flash FPGA with 75,264 logic cells and 620 user I/O, fabricated on a 130nm CMOS flash process and housed in an 896-ball Fine-Pitch Ball Grid Array (FBGA) package operating from a 1.2V/1.5V core supply.
A flash FPGA is a field-programmable gate array whose configuration is stored in on-chip flash memory rather than SRAM. Unlike SRAM FPGAs, flash FPGAs are single-chip solutions that do not require an external configuration PROM, power up instantly, and are inherently more secure because the bitstream is not stored externally. Within the power management hierarchy of programmable logic, the ProASIC3L family sits as Microchip's low-power variant of the ProASIC3/ProASIC3E families, adding Flash*Freeze technology.
Key differentiating features include Flash*Freeze technology, which allows the device to enter an ultra-low-power sleep mode while retaining state and waking in microseconds; 1.2V to 1.5V core operation for reduced dynamic and static power; single-chip reprogrammable flash configuration; Schmitt-trigger option on single-ended inputs; and weak pull-up/pull-down support on I/O.
Technically, the device uses a sea-of-gates flash architecture with versatile logic elements, embedded block RAM, and supports IEEE 1149.1 (JTAG) boundary scan testing. The pin-compatible package strategy across the ProASIC3L family (except PQ208) allows design migration between density grades without PCB rework.
Typical applications include military and aerospace systems, industrial automation, portable instrumentation, and low-power embedded control where nonvolatile single-chip configuration and minimal standby power are essential.
Design consideration: the M temperature grade suffix indicates a military-grade screening level; verify supply sequencing and use Microchip Libero SoC design tools for implementation.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet.
A flash FPGA is a field-programmable gate array whose configuration is stored in on-chip flash memory rather than SRAM. Unlike SRAM FPGAs, flash FPGAs are single-chip solutions that do not require an external configuration PROM, power up instantly, and are inherently more secure because the bitstream is not stored externally. Within the power management hierarchy of programmable logic, the ProASIC3L family sits as Microchip's low-power variant of the ProASIC3/ProASIC3E families, adding Flash*Freeze technology.
Key differentiating features include Flash*Freeze technology, which allows the device to enter an ultra-low-power sleep mode while retaining state and waking in microseconds; 1.2V to 1.5V core operation for reduced dynamic and static power; single-chip reprogrammable flash configuration; Schmitt-trigger option on single-ended inputs; and weak pull-up/pull-down support on I/O.
Technically, the device uses a sea-of-gates flash architecture with versatile logic elements, embedded block RAM, and supports IEEE 1149.1 (JTAG) boundary scan testing. The pin-compatible package strategy across the ProASIC3L family (except PQ208) allows design migration between density grades without PCB rework.
Typical applications include military and aerospace systems, industrial automation, portable instrumentation, and low-power embedded control where nonvolatile single-chip configuration and minimal standby power are essential.
Design consideration: the M temperature grade suffix indicates a military-grade screening level; verify supply sequencing and use Microchip Libero SoC design tools for implementation.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet.
直接替換替代品，適用於 A3PE3000L-FG896M — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： A3PE3000L-FG896M （相同外形與佔位） — 差異在於 Family, Package, Configuration Memory, Process Technology, RoHS Status.
Microchip Technology
Family: ProASIC3E
Package: 896-BGA / 896-FBGA (31x31 mm, 1.0 mm ball pitch)
Configuration Memory: On-chip Flash (non-volatile, single chip)
比較對象 A3PE3000L-FG896M →
Microchip Technology
Family: ProASIC3E
Package: 896-BGA (FBGA)
Configuration Memory: Flash (non-volatile, reprogrammable)
比較對象 A3PE3000L-FG896M →
Microchip Technology
Family: ProASIC3L (Flash FPGA)
Package: 896-ball FBGA
Process Technology: 130 nm Flash
比較對象 A3PE3000L-FG896M →
Microchip Technology
Family: ProASIC3L
Package: 896-ball FBGA
Configuration Memory: Nonvolatile flash (single-chip, Instant On)
比較對象 A3PE3000L-FG896M →
此產品無可直接替換的替代品。
申請替代品A3PE3000L-FG896M 最大額定值與電氣特性
| Family | ProASIC3L (ProASIC3EL) |
| Equivalent Gates | 3,000,000 |
| Logic Cells | 75,264 |
| User I/O | 620 |
| Process Technology | 130 nm CMOS flash |
| Core Voltage | 1.2 V / 1.5 V |
| 封裝 | 896-ball FBGA (FG896) |
| 安裝類型 | Surface Mount |
| Configuration Memory | On-chip flash (nonvolatile, single-chip) |
| Low-Power Technology | Flash*Freeze |
| JTAG Boundary Scan | IEEE 1149.1 |
| Input Type Option | Schmitt trigger on single-ended inputs |
| Pull Resistors | Weak pull-up / pull-down |
| Temperature Grade | M (military screening per suffix) |
A3PE3000L-FG896M 896-ball fbga (fg896) 腳位配置指南
A3PE3000L-FG896M（896-ball fbga (fg896) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： A3PE3000L-FG896M.
請參閱 資料表 以查看完整腳位配置。
典型應用
A3PE3000L-FG896M 適用於 3 應用s: 嵌入式系統, IoT 裝置, 工業控制.
嵌入式系統
使用 A3PE3000L-FG896M 於嵌入式應用中進行核心處理。
IoT 裝置
由 A3PE3000L-FG896M 驅動的智慧連網裝置。
工業控制
使用 A3PE3000L-FG896M 的自動化與控制系統。
此產品無常見問題。
工程參考資料，適用於 A3PE3000L-FG896M — 比較、設計指引及合規資訊。
合規資訊
RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
無鉛
Unknown
無鹵
Unknown
衝突礦產
Unknown
Compliance data not present in the provided web data.
資料驗證日期： 2026-09-02
— 資料由 XAIPART 元件工程團隊驗證及整理
相關元件與詞彙
Microchip Technology
Actel Corporation
Microsemi Corporation
A3PE3000L-FG896M
ProASIC3L
flash FPGA
field-programmable gate array
Flash*Freeze technology
896-ball FBGA
IEEE 1149.1 JTAG
130nm CMOS
SRAM FPGA
low-power FPGA
military FPGA
boundary scan
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