A3PE600-1FGG484 - 600K Gate Flash FPGA 484-FBGA | Microchip
MPN： A3PE600-1FGG484 ✓ 啟用中A3PE600-1FGG484 概覽
A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip non-volatile flash memory cells rather than SRAM. This places the ProASIC3E family in the power-management and system-logic hierarchy as a single-chip, live-at-power-up solution: no external configuration PROM or boot flash is required, and the fabric is functional immediately after power application (Level 0 support). This distinguishes flash FPGAs from SRAM FPGAs such as Xilinx Virtex or Altera Stratix families.
Key features include 600K system gates, up to 504 kbits of true dual-port SRAM (110592 bits per DigiKey listing), reprogrammability without an external controller, and a low total cost of ownership through single-chip integration. The -1 speed grade supports system performance suited to glue logic, control, and data-path applications.
Architecturally, the A3PE600 uses a sea-of-vanilla-physics fabric with flash switch elements, giving inherently low static power and instant-on behavior. The 484-FPBGA (23 x 23 mm, 1 mm pitch) package exposes 270 user I/Os with configurable standards, and supply operation over 1.425V to 1.575V per the Microchip USA product listing. Operating range is 0C to +85C (TJ) for the commercial -1 grade.
Typical applications include industrial control and automation, aerospace and defense subsystems, communications line cards, test instrumentation, and secure single-chip designs where configuration readback attacks are a concern because the bitstream resides in flash, not external SRAM.
Design consideration: budget the 1.5V core rail and I/O bank rails independently, and confirm the -1 speed grade meets timing closure in Microchip Libero SoC before committing layout, since the -2 grade offers higher performance in the same package footprint.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet alone.
直接替換替代品，適用於 A3PE600-1FGG484 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： A3PE600-1FGG484 （相同外形與佔位） — 差異在於 Package, Configuration Memory, Family, RoHS Status, Operating Temperature.
A3PE600-1FGG484I
✅ 直接替換聯絡詢價
查看資料表 →A3PE600-FGG484
✅ 直接替換聯絡詢價
查看資料表 →A3PE600-FGG484I
✅ 直接替換聯絡詢價
查看資料表 →A3PE600-FG484
✅ 直接替換聯絡詢價
查看資料表 →A3PE600-FG484I
✅ 直接替換聯絡詢價
查看資料表 →A3PE600-2FG484
✅ 直接替換聯絡詢價
查看資料表 →A3PE600-1FGG484 最大額定值與電氣特性
| Family | ProASIC3E |
| System Gates | 600000 |
| Logic Cells / CLBs | 13824 |
| User I/Os (this package) | 270 |
| Max User I/Os (family) | 616 |
| Embedded SRAM | 110592 bits (504 kbits true dual-port max per family data) |
| Core Supply Voltage | 1.425 V to 1.575 V (1.5 V nominal) |
| Process Technology | 130 nm, 7-layer metal (6 copper), flash-based CMOS |
| Configuration Memory | On-chip flash, live at power-up (Level 0) |
| Speed Grade | -1 |
| 工作溫度 | 0 C to +85 C (TJ) |
| 封裝 | 484-FPBGA (FBGA-484), 23 x 23 mm, 1 mm pitch |
| 安裝類型 | Surface Mount |
| Packaging | Tray |
| RoHS 狀態 | ROHS3 Compliant |
| Product Status | Active |
| Manufacturer Lead Time | 8 weeks |
| Reprogrammability | Yes, single-chip solution, no external boot device |
A3PE600-1FGG484 484-fpbga (fbga-484), 23 x 23 mm, 1 mm pitch 腳位配置指南
A3PE600-1FGG484（484-fpbga (fbga-484), 23 x 23 mm, 1 mm pitch 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： A3PE600-1FGG484.
請參閱 資料表 以查看完整腳位配置。
典型應用
A3PE600-1FGG484 適用於 6 應用s: Industrial Control and Automation, Aerospace and Defense Subsystems, Communications Line Cards, Test and Measurement Instrumentation, Secure Single-Chip Embedded Systems, Prototyping and Low-Volume Production.
Industrial Control and Automation
The A3PE600-1FGG484's 600K gates and 270 user I/Os make it well suited to industrial control cards handling motor sequencing, sensor aggregation, and protocol bridging between field buses and backplanes. Flash configuration gives live-at-power-up behavior, so interlocks and safety logic are active the instant 1.5V and I/O rails settle, with no boot-loader delay as in SRAM FPGAs. The 504 kbits of true dual-port SRAM buffer FIFO traffic between subsystems. Place the FPGA between a microcontroller and high-density I/O, using its parallel fabric for deterministic timing; the trade-off is that complex DSP algorithms need external support since the 130-nm ProASIC3E fabric lacks hardened multipliers at ProASIC3E-class density.
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Aerospace and Defense Subsystems
Flash-based ProASIC3E devices are widely used in aerospace and defense because configuration resides in on-chip flash rather than an external bitstream SRAM, reducing readback attack surface and eliminating configuration PROM parts that add BOM and reliability concerns. The A3PE600-1FGG484 provides 600K gates for telemetry framing, bus interfaces, and glue logic on avionics line-replaceable units. Single-chip, live-at-power-up operation simplifies power sequencing qualification. Note the commercial 0C to +85C rating: for extended-temperature programs specify the A3PE600-1FGG484I industrial variant on the same footprint, and apply Microchip's radiation and screening data separately since this listing covers the commercial flow only.
推薦
Communications Line Cards
In networking and telecom line cards, the A3PE600-1FGG484 aggregates framer, PHY, and backplane interfaces: 270 user I/Os cover multiple parallel LVCMOS banks, and 110592 bits of embedded dual-port SRAM implement per-channel FIFOs. Flash configuration removes the serial configuration flash from the BOM, reducing bring-up complexity in hot-swap shelves where cards must be ready immediately after insertion. The -1 speed grade supports clock rates typical of 130-nm-era line-card control planes (tens to low hundreds of MHz); verify timing closure in Libero SoC, and step up to the pin-compatible A3PE600-2FG484 (-2 grade) if paths fail, without PCB redesign.
推薦
Test and Measurement Instrumentation
Bench instruments and ATE modules use the A3PE600-1FGG484 as a flexible timing, trigger, and routing fabric. The 13,824 CLBs implement counter/timer arrays, trigger state machines, and parallel register banks with deterministic delays, while true dual-port SRAM captures waveform segments locally. Live-at-power-up flash configuration means the instrument front-end is controllable before software loads - valuable for self-test at boot. Designers should reserve I/O banks for clock-capable inputs and keep trigger paths on the shortest routing; if measured skew exceeds budget, migrating to the pin-compatible -2 speed grade closes timing without layout changes, at a modest cost premium.
推薦
Secure Single-Chip Embedded Systems
Because the ProASIC3E bitstream is stored in on-chip flash with no external configuration device, the A3PE600-1FGG484 suits secure embedded controllers where bitstream interception during boot is a threat model. There is no configuration readback bus traffic, and the system presents fewer tamper surfaces than SRAM FPGA designs with boot PROMs. The 600K gates implement custom peripherals, crypto glue logic, and anti-cloning checks around a host processor. Designers should complement the flash FPGA with secure key storage off-chip, and note that physical-security requirements beyond configuration confidentiality (e.g., side-channel hardening) must be addressed at the system level, not by the fabric alone.
推薦
Prototyping and Low-Volume Production
The A3PE600-1FGG484 is a strong fit for prototyping and low-volume products: single-chip flash configuration removes the cost and footprint of a configuration flash, and reprogrammability lets teams iterate without board spins. Total cost of ownership is lower than SRAM FPGA alternatives at this density because the boot device, its associated rail, and assembly steps disappear. The tray packaging suits prototype and small-batch builds; the same die is offered in smaller 256-ball FBGA and 208-pin QG packages (e.g., A3PE600-2FG256, A3PE600-PQG208I) for cost-optimized volume products, though those are not pin-compatible with the 484-ball footprint.
推薦
推薦產品摘要
工程參考資料，適用於 A3PE600-1FGG484 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | A3PE600-1FGG484I | A3PE600-FGG484 | A3PE600-FGG484I | A3PE600-FG484 |
|---|---|---|---|---|---|
| Package | 484-FBGA (23x23 mm, 1 mm pitch) | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600000 | 600000 | 600000 | 600000 | 600000 |
| User I/Os | 270 | 270 | 270 | 270 | 270 |
| Speed Grade | -1 | -1 | standard (no -1 suffix) | standard (no -1 suffix) | standard (no -1 suffix) |
| Operating Temperature | 0C to +85C (TJ) | -40C to +100C (industrial) | 0C to +85C (TJ) | -40C to +100C (industrial) | 0C to +85C (TJ) |
| Core Supply Voltage | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V |
| RoHS Status | ROHS3 Compliant | RoHS compliant (I suffix, industrial) | RoHS compliant (green package) | RoHS compliant (green package) | RoHS compliant |
主要差異化特點
- Live-at-power-up flash configuration, no external boot device (對比A3PE600-FGG484 (equivalent flash behavior) / SRAM FPGAs generally)
- Industrial-temperature drop-in available on the identical footprint (對比A3PE600-1FGG484I)
- Honest trade-off: no hardened DSP/multiplier blocks (對比Xilinx/Altera SRAM FPGAs (e.g., Artix-class))
設計說明
The A3PE600-1FGG484 requires a 1.5V core rail within 1.425V to 1.575V plus independent I/O bank rails. Estimated: static flash-FPGA current is low relative to SRAM FPGAs, but dynamic current scales with clock frequency and toggle rate - budget the core regulator (e.g., 1.5V/1 A class) using Libero SoC power-analysis results at your actual utilization, not a generic estimate. Power rails up before configuration is unnecessary since the fabric is live at power-up, but ensure rail monotonicity per the ProASIC3E family datasheet power-up requirements.
For the 23 x 23 mm, 1 mm-pitch 484-ball FBGA, fan out with via-in-pad or dog-bone escapes on an 8-layer stack (minimum 6 layers for 270 used I/Os). Follow the ProASIC3E datasheet decoupling guidance: place bulk capacitance near each VCC/VCCI bank and 0.1 uF ceramics within a few millimeters of power balls. The center region of the footprint carries power/ground balls - use it for the plane connectivity and escape only signal balls from the perimeter rows.
Verify speed grade before release: the -1 grade is slower than -2, and designs that close timing on a -2 sample may fail on -1 silicon. Re-run Libero SoC timing at -1 with your placement. Also, do not assume industrial temperature: this commercial part is rated 0C to +85C (TJ); if your environment reaches -40C, substitute the pin-identical A3PE600-1FGG484I. Finally, programming requires a Microchip FlashPro programmer via JTAG - plan the header footprint accordingly.
合規資訊
ROHS3 Compliant per Microchip USA listing; PCB Electronics listing notes LEAD FREE. REACH, halogen-free, and conflict-minerals declarations not found in provided data - request certificates from Microchip compliance portal.
