A3PE600-FG484 - ProASIC3E 600K-Gate Flash FPGA | Microchip
MPN: A3PE600-FG484 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $89 | $89.00 |
| 10 | $82.5 | $825.00 |
| 100 | $74 | $7,400.00 |
| 500 | $66.5 | $33,250.00 |
| 1,000 | $59 | $59,000.00 |
Drop-in alternatives for A3PE600-FG484 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
A3PE600-FGG484
✅ Drop-In✓ In Stock
$53.7 / Unit
View Datasheet →A3PE600-FG484I
✅ Drop-In✓ In Stock
$86.1 / Unit
View Datasheet →A3PE600-FGG484I
✅ Drop-In✓ In Stock
$44.03 / Unit
View Datasheet →A3PE600L-FG484M
✅ Drop-In✓ In Stock
$44.9 / Unit
View Datasheet →A3PE600L-FGG484M
✅ Drop-In✓ In Stock
$79.9 / Unit
View Datasheet →A3PE600-FG484 Maximum Ratings & Electrical Characteristics
| Family | ProASIC3E (Flash FPGA) |
| System Gates | 600000 |
| Logic Cells (CLBs) | 13824 |
| User I/Os | 270 |
| Embedded Memory | 110592 |
| Maximum System Frequency | 231 MHz |
| Core Voltage | 1.5 V |
| Technology | 130 nm CMOS flash |
| Package | 484-ball FBGA (23 x 23 mm, 1.0 mm pitch) |
| Package Height | 2.23 mm |
| Mounting Type | Surface Mount |
| Configuration | Nonvolatile flash (single-chip, no external configuration PROM) |
| Package Footprint Compatibility | FG256 and FG484 footprint-compatible |
| Soft Processor Support | Soft ARM support |
| Packaging | Tray |
A3PE600-FG484 fg256 and fg484 footprint-compatible Pin Configuration Guide
Complete pinout information for A3PE600-FG484 (fg256 and fg484 footprint-compatible package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3PE600-FG484.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3PE600-FG484 is suitable for 6 applications: Industrial Automation Control, Networking and Communications, Avionics and Defense Electronics, Test and Measurement Instrumentation, ASIC Replacement and Prototyping, Secure Embedded Systems and IoT Gateways.
Industrial Automation Control
In factory automation controllers, motor drive sequencing, and I/O concentrators, the A3PE600-FG484 integrates glue logic, state machines, and bus bridging into one 600K-gate flash FPGA. Its nonvolatile configuration means the controller powers up functional within milliseconds - no configuration PROM or microprocessor boot handshake - improving line-start reliability. The 270 user I/Os accommodate dense industrial I/O banks at 3.3V and other common standards, while 231 MHz system performance handles multi-axis coordination. Flash storage of the bitstream also resists tampering of proprietary control IP on the plant floor.
Recommended
Networking and Communications
Line cards, switch fabric bridges, and protocol converters benefit from the A3PE600-FG484's combination of 13824 logic cells and 110592 bits of embedded block RAM for FIFOs, packet buffers, and CAM-style lookup structures. At 231 MHz, the fabric supports common 8-bit/16-bit parallel interfaces and bridging logic between MACs, PHYs, and backplanes. Because the ProASIC3E configures from on-chip flash, network equipment recovers instantly after power events without reconfiguration servers, an advantage for unattended telecom cabinets and remote access nodes deployed across dispersed sites.
Recommended
Avionics and Defense Electronics
Avionics subsystems value the ProASIC3E's single-chip nonvolatile configuration and proven security features: the bitstream never leaves the device, reducing supply-chain tampering risk. The A3PE600-FG484's 600K gates implement MIL-STD-style bus interfaces, ARINC-style data formatting, and sensor aggregation in one device. Industrial-grade A3PE600-FGG484I equivalents extend temperature range for cockpit-adjacent or external pods. Flash FPGA determinism (no configuration error window during power-up) simplifies DO-relevant safety analyses for load management, display drivers, and mission-data recorders.
Recommended
Test and Measurement Instrumentation
Bench and automated test equipment use the A3PE600-FG484 for timing generators, bus emulators, and trigger fan-out logic. The 231 MHz fabric timing supports sub-10ns event resolution, and 270 user I/Os allow one FPGA to interface with multiple instrument front-ends simultaneously. Instant-on flash configuration means instruments are ready the moment power is applied - valuable for production test stations cycling power between DUTs. FG256/FG484 footprint compatibility lets instrument OEMs scale designs across the ProASIC3E family without PCB respins as channel counts grow.
Recommended
ASIC Replacement and Prototyping
The ProASIC3E family is explicitly positioned by Microchip as a cost-effective ASIC replacement for consumer, computing, and communications markets. Designers prototype ASIC control logic on the A3PE600-FG484's 13824-cell fabric, then either ship the FPGA directly in low/medium volumes or use the validated design as an ASIC handoff artifact. Nonvolatile flash eliminates the FPGA configuration flash that would otherwise duplicate ROM/OTP in ASIC-like products, cutting BOM cost. 130nm flash technology delivers stable, deterministic timing without the configuration-time variability of SRAM alternatives.
Recommended
Secure Embedded Systems and IoT Gateways
Embedded gateways and secure edge devices use the A3PE600-FG484 as a cryptographic bridge, secure boot manager, or sensor-fusion controller. ProASIC3E flash fabric provides protection against design theft: configuration resides on-chip, so competitors cannot intercept bitstreams during board programming. The device implements soft ARM processor support, allowing a small control CPU plus custom accelerators in one chip. Designers preferring lower static power in battery-assisted nodes can drop in the A3PE600L-FGG484M, which adds Flash*Freeze instantaneous static mode on the identical PCB footprint.
Recommended
Recommended Products Summary
Engineering reference data for A3PE600-FG484 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3PE600-FGG484 | A3PE600-FGG484I | A3PE600-FG484I | A3PE600L-FG484M |
|---|---|---|---|---|---|
| Package | FBGA-484 (23 x 23 mm) | FBGA-484 - same | FBGA-484 - same | FBGA-484 - same | FBGA-484 - same |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600K | 600K | 600K | 600K | 600K |
| User I/Os | 270 | 270 | 270 | 270 | 270 |
| Max System Frequency | 231 MHz | 231 MHz | 231 MHz | 231 MHz | 231 MHz |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.2 V - 1.5 V |
| Temperature Grade | Commercial | Commercial (RoHS pkg) | Industrial | Industrial | Industrial (M grade) |
| Low-Power Flash*Freeze Mode | No | No | No | No | Yes |
Key Differentiators
- Nonvolatile flash configuration - true single-chip solution (vs SRAM FPGAs (Xilinx/Intel equivalents))
- Low-power Flash*Freeze option within the same footprint (vs A3PE600L-FG484M)
- RoHS-compliant package option available (vs A3PE600-FGG484)
Design Notes
Supply the A3PE600-FG484 with a 1.5V core rail and 3.3V auxiliary/I/O rail per the ProASIC3E power architecture in the manufacturer datasheet. Because configuration is nonvolatile, there is no configuration-current surge at power-up, simplifying regulator sizing versus SRAM FPGAs. Nonetheless, decouple each supply ball pair with 0.1uF ceramics placed within 2 mm of the balls, plus bulk 10uF-22uF per rail. Verify core current against your post-place-and-route power estimate in Libero rather than worst-case table values.
The FG484 uses a 1.0 mm ball pitch and 23 x 23 mm body, requiring a standard 484-ball BGA land pattern with via-in-pad or dogbone fanout on at least 0.8 mm channel width; plan for 4+ PCB layers to break out 270 user I/Os. Per the datasheet, FG256 and FG484 packages are footprint-compatible, so designing the FG484 footprint allows future migration to FG256-family members. When using voltage-referenced I/O standards, assign one VREF pin per minibank as required.
A frequent error is ordering the plain FG484 for RoHS-mandated production: in ProASIC3E ordering codes the 'G' denotes RoHS-compliant packaging, so lead-free builds require A3PE600-FGG484 (or FGG484I). Another pitfall is treating higher-density ProASIC3E parts (A3PE1500/A3PE3000) as drop-ins; densities differ far beyond 30% and timing closure must be redone. Finally, recompile the design in Libero SoC and re-verify I/O assignment and timing whenever swapping speed/temperature grade variants.
Compliance Information
Per manufacturer datasheet notes, the 'G' in ProASIC3E ordering codes indicates RoHS-compliant packages; the base A3PE600-FG484 lacks 'G', so specify A3PE600-FGG484/FGG484I for RoHS builds. Other compliance statuses not found in provided data.
