ATSAM3S4CA-CU - 64MHz Cortex-M3 MCU 256KB Flash | Microchip
MPN： ATSAM3S4CA-CU ✓ 啟用中ATSAM3S4CA-CU 概覽
A microcontroller unit (MCU) is a single integrated circuit that combines a processor core, memory (Flash for program storage and SRAM for data), and peripherals on one die, forming the lowest layer of the embedded processing hierarchy: ARM Cortex-M3 core -> 32-bit MCU -> embedded processor -> semiconductor. MCUs execute dedicated control tasks in everything from consumer appliances to industrial automation, replacing multi-chip solutions with lower cost and power.
Key features of the ATSAM3S4CA-CU include the 64 MHz ARM Cortex-M3 RISC core with Thumb-2 instruction set, 256 KB (256K x 8) of Flash program memory, 48 KB of SRAM, and a wide supply range of 1.62 V to 3.6 V. The device integrates a DMA controller that offloads the CPU for peripheral-to-memory transfers, and it is packaged as a 100-TFBGA (9x9) ball grid array for compact, high-density PCB layouts. Mouser lists it as industrial temperature range with MRL A packing classification.
Technically, the SAM3S family implements the Cortex-M3 pipeline with nested vectored interrupt controller (NVIC), and per the Microchip product page for the related ATSAM3S4C variant, the family is pin-to-pin compatible with the SAM3N4C series, giving designers a migration path between entry-level and feature-rich parts. The core runs from an internal supply domain of roughly 1.08 V to 1.32 V (1.2 V typical regulator output) per published parametric data.
Typical applications include industrial control and factory automation nodes, battery-powered portable instruments leveraging the low-voltage operating range, and consumer appliances requiring 32-bit processing headroom with USB or serial connectivity.
When designing with this device, budget the 256 KB Flash and 48 KB SRAM early: projects that grow past these limits require migration to ATSAM3S8-class devices in the same footprint family.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
直接替換替代品，適用於 ATSAM3S4CA-CU — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： ATSAM3S4CA-CU （相同外形與佔位） — 差異在於 SRAM, Flash Memory, Series, RoHS Status, Core Processor.
ATSAM3S4CA-CUR
✅ 直接替換📋 參考替代品（不在目錄中）
ATSAM3S2CA-CU
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →ATSAM3S8CA-CU
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →ATSAM3A4CA-CU
✅ 直接替換聯絡詢價
查看資料表 →ATSAM3S4CA-CU 最大額定值與電氣特性
| Core Processor | ARM Cortex-M3 |
| Core Size | 32-Bit |
| Maximum Clock Speed | 64 MHz |
| Flash Memory | 256 KB (256K x 8) |
| SRAM | 48 KB |
| Supply Voltage Range | 1.62 V to 3.6 V |
| Core Supply Voltage | 1.08 V to 1.32 V (1.2 V nominal) |
| 封裝 | 100-TFBGA (9x9 mm) |
| 安裝類型 | Surface Mount |
| Series | SAM3S |
| 工作溫度 | -40C to +85C (Industrial) |
| DMA Controller | Yes |
| Instruction Set | Thumb-2 (RISC) |
| Program Memory Type | Flash |
| Packing Classification | MRL A |
| Life Cycle Stage | ACTIVE |
| Pin-to-Pin Compatible Family | SAM3N4C |
ATSAM3S4CA-CU 100-tfbga (9x9 mm) 腳位配置指南
ATSAM3S4CA-CU（100-tfbga (9x9 mm) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： ATSAM3S4CA-CU.
請參閱 資料表 以查看完整腳位配置。
典型應用
ATSAM3S4CA-CU 適用於 6 應用s: Industrial Control and Automation, Battery-Powered Portable Instruments, Consumer Appliances, Data Acquisition Systems, IoT Sensor Nodes, Medical and Diagnostic Handhelds.
Industrial Control and Automation
The ATSAM3S4CA-CU fits industrial control nodes that need 32-bit processing headroom with deterministic interrupt response. Its 64 MHz ARM Cortex-M3 core with NVIC handles multi-task control loops, while the 256 KB Flash accommodates communication stacks (Modbus, CAN gateways) and 48 KB SRAM buffers process data. The DMA controller offloads serial and ADC transfers, keeping CPU cycles available for the control algorithm, and the -40C to +85C industrial rating covers cabinet-mounted electronics. Running from a standard 3.3 V rail with a 1.62 V to 3.6 V tolerance, it integrates directly into 24 V industrial systems with a simple buck or LDO front end.
推薦
Battery-Powered Portable Instruments
For handheld meters, data loggers, and portable test equipment, the ATSAM3S4CA-CU offers a wide 1.62 V to 3.6 V supply range that tolerates discharging battery packs without a regulator, plus a DMA-driven architecture that lets the CPU sleep while peripherals move data into the 48 KB SRAM. The Thumb-2 instruction set compresses the 256 KB Flash budget, leaving room for OTA-style field updates. The 9x9 mm 100-ball TFBGA keeps PCB area small for compact enclosures, and the industrial temperature range supports outdoor use where consumer-grade parts would fail.
推薦
Consumer Appliances
White goods, small appliances, and HVAC controllers benefit from the ATSAM3S4CA-CU's balance of 32-bit performance and integration. The 64 MHz Cortex-M3 executes user-interface state machines, sensor fusion, and motor-control assist routines concurrently, while 256 KB Flash holds multi-language HMI code and 48 KB SRAM manages display buffers. Per Microchip, the family is pin-to-pin compatible with the SAM3N4C series, so appliance platforms can start on the lower-cost SAM3N and migrate to SAM3S as feature requirements grow without changing the PCB, protecting tooling investment across product tiers.
推薦
Data Acquisition Systems
The ATSAM3S4CA-CU's DMA controller is the key enabler for data-acquisition designs: ADC sample streams are moved to the 48 KB SRAM without CPU intervention, maximizing throughput at 64 MHz and minimizing jitter between samples. The 256 KB Flash supports on-board calibration tables, linearization curves, and local averaging algorithms, while the 3.3 V I/O domain interfaces directly with common external ADC front ends. The compact 9x9 mm TFBGA suits dense multi-channel DAQ cards, and the -40C to +85C range covers harsh monitoring environments.
推薦
IoT Sensor Nodes
Connected sensor endpoints use the ATSAM3S4CA-CU to run protocol stacks alongside sampling firmware: the Cortex-M3 at 64 MHz has headroom for TCP/MQTT-style framing, while the DMA moves UART or SPI transceiver traffic to SRAM efficiently. The low-voltage 1.62 V minimum supply supports coin-cell-adjacent and two-cell designs, and the 256 KB Flash accommodates security routines and future feature expansion. Its pin compatibility with SAM3N devices lets IoT platform vendors qualify one PCB across cost-optimized and feature-rich SKUs, streamlining procurement and firmware maintenance.
推薦
Medical and Diagnostic Handhelds
Portable medical devices such as glucose meters, pulse oximeters, and diagnostic readers require silent, low-noise digital control and long battery life. The ATSAM3S4CA-CU serves these with its efficient 64 MHz Cortex-M3, low-voltage operation down to 1.62 V, and DMA-assisted sampling that keeps the analog measurement path predictable by minimizing CPU wake-ups. The 256 KB Flash holds device calibration data, UI resources, and compliance logging, while the industrial -40C to +85C rating plus BGA solder reliability support sterilization-tolerant and field-deployed instruments.
推薦
推薦產品摘要
工程參考資料，適用於 ATSAM3S4CA-CU — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | ATSAM3S4CA-CUR | ATSAM3S2CA-CU | ATSAM3S8CA-CU | ATSAM3A4CA-CU |
|---|---|---|---|---|---|
| Package | 100-TFBGA (9x9 mm) | 100-TFBGA (9x9) - same | 100-TFBGA (9x9) - same | 100-TFBGA (9x9) - same | 100-ball BGA - same footprint class |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | ARM Cortex-M3, 64 MHz | ARM Cortex-M3, 64 MHz | ARM Cortex-M3, 64 MHz | ARM Cortex-M3, 64 MHz | ARM Cortex-M3, 64 MHz |
| Flash Memory | 256 KB | 256 KB | 128 KB (-50%) | 512 KB (+100%) | 256 KB |
| Supply Voltage | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.8 V / 2.5 V / 3.3 V domains |
| DMA Controller | Yes | Yes | Yes | Yes | Yes |
| Distinct Feature | Balanced memory, USB device class | Identical; reel packaging | Cost-optimized, smaller Flash | Largest Flash in footprint | Adds CAN controller (SAM3A) |
主要差異化特點
- Largest memory in the same BGA footprint tier (對比ATSAM3S2CA-CU)
- Identical drop-in continuity for reel assembly (對比ATSAM3S4CA-CUR)
- Migration path to CAN-capable SAM3A variant (對比ATSAM3A4CA-CU)
- Honest trade-off: smaller ecosystem than STM32 (對比STM32F103CBT6)
設計說明
Power the ATSAM3S4CA-CU from a 3.3 V rail within its 1.62 V to 3.6 V range; the on-chip regulator generates the 1.08 V to 1.32 V core domain internally, so no external core supply is required. Place 100 nF ceramic decoupling capacitors at each VDDIO/VDDCORE ball pair plus one bulk 10 uF capacitor near the package. Estimated: at 64 MHz full-speed operation from 3.3 V, budget core plus I/O current per the SAM3S datasheet power consumption tables rather than assuming a fixed number - current scales with clock frequency and active peripherals.
The 9x9 mm 100-ball TFBGA uses a fine-pitch ball grid array: design fan-out with 0.5 mm-pitch escape routing and consider via-in-pad or dog-bone fanout on inner rows. Follow Microchip's SAM3S hardware design guidelines: keep the VDDCORE decoupling loop shortest, place the 480-ohm-class RC on the core regulator output exactly as specified in the datasheet, and provide a solid ground plane under the BGA. Verify the landing pattern against the latest IPC-referenced Microchip package drawing before fabrication.
Flash programming budget: 256 KB is shared by code, constants, and bootloader. Plan for a small margin before committing to ATSAM3S4CA-CU; if the application may grow, the pin-compatible ATSAM3S8CA-CU (512 KB) in the same 100-TFBGA footprint is the safe migration path. Also note that the -AU (LQFP) and -MU (QFN) suffixes of the same die are NOT footprint-compatible with the -CU BGA - do not substitute them without a PCB respin.
合規資訊
Compliance statuses not stated in the provided Verified Web Data; the 'MRL A' packing classification and industrial temperature range are confirmed via Mouser, but RoHS/REACH/lead-free statements must be verified on the official Microchip product compliance page.
