ATSAM4S2CB-ANR - 120MHz Cortex-M4 MCU 128KB Flash | Microchip
MPN： ATSAM4S2CB-ANR ✓ 啟用中ATSAM4S2CB-ANR 概覽
A microcontroller unit (MCU) is a single integrated circuit that combines a processor core, memory, and peripherals into one chip, sitting within the broader hierarchy of embedded processors: Cortex-M4 core -> ARM RISC MCU -> system-on-chip -> embedded control system. MCUs are the workhorses of industrial control, consumer devices, and IoT nodes, where deterministic real-time behavior and low power matter more than raw throughput.
Key features of the ATSAM4S2CB-ANR include the Cortex-M4 core with hardware FPU-free DSP instructions (single-cycle MAC, SIMD), a full-speed USB Device port with embedded transceiver, supply operation from 1.62V to 3.6V, and low active power consumption cited by Microchip at approximately 180 uA per MHz. The device operates across the industrial temperature range with gull-wing terminals on a square LFQFP body.
Technically, the SAM4S series implements a three-stage Harvard pipeline with an ARMv7E-M architecture, optional cache, and dual-bank flash implementation across the family (up to 2048 KB on larger variants), enabling safe in-application firmware updates. The peripheral set includes USART, SPI, TWI (I2C), PWM channels, a 12-bit ADC, and a hardware AES/GHASH cryptographic engine on select family members, allowing the same board design to scale flash density from 128 KB to 2 MB without PCB changes.
Typical applications include industrial automation and motor control nodes, consumer and appliance interfaces, USB-equipped instrumentation and sensor bridges, and low-power embedded systems that need Cortex-M4 DSP performance with a long-lived, pin-compatible upgrade path.
When designing with this part, note that at 120 MHz flash wait states are significant, so performance-critical code should be relocated to SRAM or the flash cache enabled; also plan VDDCORE and VDDIO decoupling per the datasheet.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet, giving engineers a single verified reference point.
直接替換替代品，適用於 ATSAM4S2CB-ANR — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： ATSAM4S2CB-ANR （相同外形與佔位） — 差異在於 Core Processor, Package, Operating Temperature, Packaging, RoHS Status.
ATSAM4S4CB-ANR
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
ATSAM4S8CB-ANR
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
ATSAM4S16CB-ANR
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
ATSAM4S2CA-ANR
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
ATSAM4S2CB-AU
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
ATSAM4S2CB-ANR 最大額定值與電氣特性
| Core Processor | ARM Cortex-M4 (32-bit RISC) |
| Core Architecture | ARMv7E-M Harvard, 3-stage pipeline |
| 最大時脈頻率 | 120 MHz |
| Flash Memory | 128 KB (128K x 8) |
| SRAM | 64 KB |
| 供應電壓 | 1.62 V to 3.6 V |
| Core Voltage | 1.2 V |
| Power Consumption | 180 uA/MHz (typical, per Microchip) |
| USB | Full-speed USB Device port with embedded transceiver |
| Number of I/O | Up to 79 programmable I/O lines |
| 工作溫度 | -40C to +85C (industrial grade) |
| 封裝 | 100-LQFP (14x14 mm), gull-wing, square LFQFP |
| 安裝類型 | Surface Mount |
| Terminal Form | Gull Wing |
| Packaging | Tape & Reel (suffix NR) |
| Flash Family Range | Up to 2048 KB within SAM4S family, dual-bank with cache |
| RoHS 狀態 | RoHS compliant (green package per Mouser listing) |
ATSAM4S2CB-ANR 100-lqfp (14x14 mm), gull-wing, square lfqfp 腳位配置指南
ATSAM4S2CB-ANR（100-lqfp (14x14 mm), gull-wing, square lfqfp 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： ATSAM4S2CB-ANR.
請參閱 資料表 以查看完整腳位配置。
典型應用
ATSAM4S2CB-ANR 適用於 6 應用s: Industrial Automation and Control Nodes, USB-Equipped Instrumentation and Test Devices, Consumer Appliance Interfaces and HMI, Low-Power Embedded and IoT Sensor Nodes, Motor Control and Power Conversion Subsystems, Networking Accessories and Embedded Gateways.
Industrial Automation and Control Nodes
The ATSAM4S2CB-ANR fits industrial automation nodes because its 120 MHz Cortex-M4 core provides deterministic real-time response, DSP MAC instructions accelerate control-loop math (PID, filters), and the industrial -40C to +85C grade survives factory-floor temperature extremes. In a typical node it reads sensors via its TWI/SPI/USART peripherals, executes control logic, and communicates with a PLC or gateway over RS-485 via a transceiver. Operating from a 3.3V rail with 180 uA/MHz active consumption, it keeps cabinet thermal budgets low, and its 128 KB flash supports robust application code with bootloader-based field updates.
推薦
USB-Equipped Instrumentation and Test Devices
The embedded full-speed USB Device transceiver is the decisive advantage here: the ATSAM4S2CB-ANR implements USB 2.0 full-speed (12 Mbps) device roles - virtual COM ports, HID panels, and data-acquisition bridges - without an external PHY, reducing BOM cost and board area in handheld instruments and lab peripherals. The 120 MHz core sustains USB stack overhead plus signal processing (fixed-point DSP via single-cycle MAC), while 64 KB SRAM buffers acquisition samples between USB transfers. Its industrial temperature grade and 1.62V-3.6V operation from a single 3.3V rail simplify battery and bench-instrument power designs.
推薦
Consumer Appliance Interfaces and HMI
For appliance user interfaces - touch buttons, segment or small TFT displays, and motor or valve control - the ATSAM4S2CB-ANR combines PWM peripherals for backlight and buzzer control, ADC inputs for touch or sensor sensing, and enough Cortex-M4 headroom at 120 MHz to drive HMI logic and communication simultaneously. Green-package RoHS compliance supports consumer regulatory requirements, and the 128 KB flash comfortably holds UI frameworks and localized string tables. Designers value the pin-compatible SAM4S ladder: if a feature update needs more code space, migrating to 512 KB or 1 MB variants requires no PCB respin.
推薦
Low-Power Embedded and IoT Sensor Nodes
Microchip's SAM4S2C page highlights 180 uA/MHz power consumption, which - combined with the family's power-management and sleep modes detailed in the datasheet - makes the ATSAM4S2CB-ANR practical for mains-adjacent and duty-cycled battery IoT nodes. Estimated: at 3.3V and an average 25% duty cycle at 120 MHz, average current is roughly 5-6 mA, feasible for a year on a 3000 mAh cell with deeper sleep between samples. On-chip 12-bit ADC, TWI and USART peripherals connect common MEMS sensors and radios, while 64 KB SRAM holds buffering and lightweight protocol stacks for sub-GHz or BLE companion modules.
推薦
Motor Control and Power Conversion Subsystems
The SAM4S peripheral set - PWM channels, 12-bit ADC, and general-purpose timers with capture/compare - supports BLDC, stepper, and low-complexity AC motor control. The Cortex-M4's single-cycle MAC executes Clarke/Park transforms and PI loops in fixed-point arithmetic at 120 MHz, comfortably closing current loops in the tens-of-kilohertz range. In a drive board the ATSAM4S2CB-ANR typically sequences a gate-driver IC such as a half-bridge driver, samples shunt currents through the ADC, and communicates status over USART or CAN-adjacent links. Its industrial grade suits motor-driven appliances, pumps, fans, and factory automation actuators.
推薦
Networking Accessories and Embedded Gateways
For accessories such as networked sensors, serial-to-Ethernet bridges, and small gateways, the ATSAM4S2CB-ANR provides multiple USARTs, SPI and TWI buses to link PHYs and external MACs, plus USB device for local configuration. The 120 MHz Cortex-M4 with cache-capable flash architecture from the SAM4S datasheet sustains lightweight TCP/IP stacks and protocol translation between RS-232/RS-485 field devices and upstream IP networks. Green RoHS LQFP packaging with gull-wing terminals supports standard SMT assembly for networking hardware volumes, and the 1.62V-3.6V supply integrates cleanly with common PoE-derived or 3.3V rail designs.
推薦
推薦產品摘要
工程參考資料，適用於 ATSAM4S2CB-ANR — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | ATSAM4S4CB-ANR | ATSAM4S8CB-ANR | ATSAM4S16CB-ANR | ATSAM4S2CA-ANR |
|---|---|---|---|---|---|
| Package | 100-LQFP (14x14 mm) | 100-LQFP (14x14) - same | 100-LQFP (14x14) - same | 100-LQFP (14x14) - same | 100-LQFP (14x14) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / Max Speed | ARM Cortex-M4, 120 MHz | ARM Cortex-M4, 120 MHz | ARM Cortex-M4, 120 MHz | ARM Cortex-M4, 120 MHz | ARM Cortex-M4, 120 MHz |
| Flash Memory | 128 KB | 256 KB | 512 KB | 1 MB | 128 KB |
| Supply Voltage | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V |
| Temperature Grade | Industrial (-40C to +85C) | Industrial | Industrial | Industrial | Industrial |
| Packaging | Tape & Reel (NR suffix) | Tape & Reel | Tape & Reel | Tape & Reel | Tape & Reel |
主要差異化特點
- Smallest flash SAM4S variant in the 100-LQFP CB footprint (對比ATSAM4S4CB-ANR)
- Full-speed USB device with embedded transceiver (對比ATSAM4N16CA-CFUR)
- Cost-optimized 64 KB SRAM / 128 KB flash balance (對比ATSAM4S16CB-ANR)
設計說明
Power the ATSAM4S2CB-ANR from a regulated 3.3V rail within the 1.62V-3.6V range. Per the SAM4S datasheet, the device requires a 1.2V VDDCORE domain, typically generated by the on-chip regulator or supplied externally per the datasheet's power-supply options chapter - do not leave this configuration ambiguous at schematic review. Decouple each VDDIO pin pair with 100 nF ceramic capacitors placed within 2 mm, plus bulk 10 uF per supply domain. Estimated: at full 120 MHz active operation (~21.6 mA at 180 uA/MHz, 3.3V) core-plus-clock power is about 71 mW before peripheral and I/O loads.
At 120 MHz, flash access introduces wait states; if performance-critical routines (DSP, control loops) run from flash without cache benefits, effective throughput drops noticeably. Relocate hot code to SRAM or ensure the SAM4S flash cache is enabled and sequential code access is optimized. Another common pitfall: SAM4S parts do NOT include a hardware FPU - software floating point at 120 MHz is many cycles per operation, so use fixed-point math (Q15/Q31) to exploit the single-cycle MAC instead.
Use the 100-LQFP (14x14 mm) footprint with gull-wing pads per IPC-7351 recommendations and place a via-stitched ground plane directly under the die. Route the USB D+/D- pair as a 90-ohm differential pair with matched length, keeping stubs under 5 mm; the embedded transceiver tolerates modest routing but not long mismatched traces. Provide a 10-pin SWD header (SWDIO/SWCLK + NRST) for programming and debug - omitting it forces costly ISP recovery via the UART boot path when flash is locked.
Thermal design is straightforward: Estimated worst-case dissipation with all peripherals active is on the order of 100-150 mV-scale currents at 3.3V, i.e. well under 0.5 W, and the 100-LQFP theta_JA on a standard four-layer board keeps junction rise below ~20C - no heatsink or copper pour beyond the standard ground plane is needed. Verify with the datasheet theta_JA table if your board is two-layer or enclosed, and confirm ambient stays within the industrial -40C to +85C rating including self-heating.
合規資訊
Mouser lists the package as 'LQFP,GREEN,IND TEMP,MRL' indicating a green (RoHS) industrial-temperature package. REACH, halogen-free, and conflict-minerals status not stated in provided data - verify via Microchip's product compliance portal.
