DSPIC33FJ64GP306A-E/MR - 16-bit 40 MIPS DSC, 64KB Flash | Microchip
MPN： DSPIC33FJ64GP306A-E/MR ✓ 啟用中DSPIC33FJ64GP306A-E/MR 概覽
A Digital Signal Controller combines the computational architecture of a digital signal processor with the peripheral integration and control-oriented instruction set of a microcontroller. DSCs sit within the broader semiconductor hierarchy as microcontrollers -> digital signal controllers -> embedded processors, and the dsPIC33F family is Microchip's flagship 16-bit DSC line, executing digital filter algorithms and high-speed precision digital control loops where standard MCUs lack the arithmetic throughput.
Key features include a fixed-point DSP engine with a barrel shifter and dual internal buses for efficient data handling, 40 MIPS maximum performance from a phase-locked-loop-scaled clock, boundary-scan (JTAG) test capability, and multiple low-power operating modes for energy-constrained designs. The dsPIC33FJ64GPX06A/X08A/X10A subfamily also provides advanced analog peripherals and seamless migration paths to PIC24 MCUs and dsPIC30F DSCs in similar packages, protecting software investment across revisions.
Architecturally, the device is fabricated on an advanced CMOS process and uses a modified Harvard bus structure with separate program and data paths, enabling single-cycle MAC (multiply-accumulate) execution for FIR/IIR filtering, PID loops, and FFT-based processing. The 'A' suffix denotes the enhanced second silicon revision of the original dsPIC33FJ64GP306, offering improved analog performance and errata resolution.
Typical applications include digital power supplies, motor control drives, industrial sensors, and audio signal processing. The extended -40C to +125C temperature grade makes it well suited to automotive-adjacent, heavy-equipment, and outdoor industrial environments where commercial-grade parts cannot survive.
When designing with this part, budget a clean 3.3V rail with local decoupling on all VDD/VSS pairs, and plan the clock tree so the PLL stays within the 40 MIPS ceiling. The VQFN exposed pad must be soldered to a grounded thermal land for both mechanical retention and signal integrity.
This page synthesizes verified distributor data, same-family drop-in alternatives, and practical design guidance not consolidated in the manufacturer datasheet.
直接替換替代品，適用於 DSPIC33FJ64GP306A-E/MR — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： DSPIC33FJ64GP306A-E/MR （相同外形與佔位） — 差異在於 Package, DSP Engine, Family Migration, Operating Temperature, Packaging.
DSPIC33FJ64GP306A-I/MR
✅ 直接替換聯絡詢價
查看資料表 →DSPIC33FJ128GP306A-E/MR
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →DSPIC33FJ256GP306A-E/MR
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
DSPIC33FJ32GP306A-E/MR
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
DSPIC33FJ64GP306A-E/MR 最大額定值與電氣特性
| Core Type | dsPIC33F 16-bit DSC (RISC) |
| Maximum Clock Frequency / Performance | 40 MHz (40 MIPs) |
| Program Memory | 64KB (64K x 8) FLASH |
| 供應電壓 | 3.3 V |
| DSP Engine | Fixed-point, barrel shifter, MAC |
| Bus Architecture | Multiple internal bus |
| Boundary Scan | Yes (JTAG) |
| Low-Power Modes | Yes |
| 工作溫度 | -40C to +125C (E grade) |
| 封裝 | 64-VQFN, 9x9 mm |
| 安裝類型 | Surface Mount |
| Packaging | Tube (EP suffix) |
| Family Migration | Seamless to PIC24 MCU and dsPIC30F DSC |
| Process Technology | Advanced CMOS |
| Silicon Revision | A (dsPIC33FJ64GP306A) |
DSPIC33FJ64GP306A-E/MR 64-vqfn, 9x9 mm 腳位配置指南
DSPIC33FJ64GP306A-E/MR（64-vqfn, 9x9 mm 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： DSPIC33FJ64GP306A-E/MR.
請參閱 資料表 以查看完整腳位配置。
典型應用
DSPIC33FJ64GP306A-E/MR 適用於 6 應用s: Digital Power Supplies, Industrial Motor Control, Audio Signal Processing, Industrial Sensing and Data Acquisition, High-Temperature Embedded Control, Embedded Control and Automation.
Digital Power Supplies
The DSPIC33FJ64GP306A-E/MR fits digital power supply control because its 40 MIPs core and fixed-point DSP engine execute current- and voltage-loop compensators at switching frequencies well beyond analog-controller limits, with single-cycle MAC operations accelerating PID and filter computations. Placed as the main controller, it reads feedback through on-chip analog inputs and drives PWM stages with deterministic latency. The 3.3V logic eases interfacing with gate drivers and supervisors. The extended -40C to +125C rating tolerates power-stage hot spots, while boundary-scan support simplifies in-circuit production test on dense power boards.
推薦
Industrial Motor Control
For motor drives, the DSPIC33FJ64GP306A-E/MR provides the 40 MIPs throughput needed for field-oriented control and sensorless estimation algorithms, executing high-speed precision control loops that Microchip specifically designed the dsPIC33F family to run. The fixed-point DSP engine with barrel shifter keeps Clarke/Park transforms and PI current loops within tight ISR budgets, while the extended -40C to +125C temperature grade withstands drive-enclosure heat without forced-air cooling. Firmware executes from 64KB FLASH, sufficient for FOC plus communication stacks, and low-power modes support standby energy targets in intermittently operated industrial equipment.
推薦
Audio Signal Processing
The dsPIC33F General Purpose (GP) subfamily targets applications including audio, and the DSPIC33FJ64GP306A-E/MR supports FIR/IIR filtering, sample-rate conversion, and level processing at audio rates: a 40 MIPs core executes a single-cycle MAC, letting a 128-tap filter run at 48 kHz sampling with margin to spare. The multiple internal bus architecture streams samples between peripherals and RAM without core contention. Operating from 3.3V it interfaces directly with audio codecs and line-level circuitry, and its QFN-64 footprint integrates DAC, amplifier, and control logic on one compact board for conferencing and public-address products.
推薦
Industrial Sensing and Data Acquisition
In industrial sensing nodes, the DSPIC33FJ64GP306A-E/MR combines a 16-bit control core with the dsPIC33F subfamily's advanced analog peripherals, digitizing transducer signals and applying DSP-based calibration, linearization, and noise filtering in-firmware. The dsPIC33Fs are explicitly designed to execute digital filter algorithms, making them a strong fit for vibration, pressure, and temperature sensing with embedded FFT analysis. The extended -40C to +125C rating survives panel-mounted installations near machinery, low-power modes reduce consumption in battery-backed monitors, and boundary-scan (JTAG) supports automated production verification across the sensor fleet.
推薦
High-Temperature Embedded Control
Equipment installed in hot environments - pumps, compressors, outdoor enclosures, heavy vehicles - needs controllers rated beyond commercial limits. The DSPIC33FJ64GP306A-E/MR's -40C to +125C extended grade directly addresses this: the same silicon reliability targets apply across the whole range, so firmware need not derate near the ceiling. Its 40 MIPs performance covers supervisory logic plus DSP preprocessing on one die, eliminating a separate signal processor. The 64-VQFN (9x9 mm) package keeps board area small, and Microchip's seamless migration to PIC24 MCUs and dsPIC30F DSCs in similar packages future-proofs long-lifetime industrial programs.
推薦
Embedded Control and Automation
As a general-purpose DSC, the DSPIC33FJ64GP306A-E/MR anchors embedded automation boards that need both control I/O and signal processing: PLC remote modules, actuator controllers, and protocol converters. The 64KB FLASH hosts a real-time executive plus communication stacks; the 16-bit core with multiple internal buses sustains deterministic scanning, and the DSP engine handles on-board diagnostics such as signature analysis of actuator current waveforms. Seamless migration within the dsPIC33F and PIC24 families lets one PCB design scale memory or peripherals without layout changes, protecting automation OEMs across product generations.
推薦
推薦產品摘要
工程參考資料，適用於 DSPIC33FJ64GP306A-E/MR — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | DSPIC33FJ64GP306A-I/MR | DSPIC33FJ128GP306A-E/MR | DSPIC33FJ256GP306A-E/MR | DSPIC33FJ32GP306A-E/MR |
|---|---|---|---|---|---|
| Package | 64-VQFN (9x9) | 64-VQFN (9x9) - same | 64-VQFN (9x9) - same | 64-VQFN (9x9) - same | 64-VQFN (9x9) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| FLASH Program Memory | 64KB | 64KB | 128KB | 256KB | 32KB |
| Core Performance | 16-bit, 40 MIPs | 16-bit, 40 MIPs | 16-bit, 40 MIPs | 16-bit, 40 MIPs | 16-bit, 40 MIPs |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Operating Temperature | -40C to +125C | -40C to +85C | -40C to +125C | -40C to +125C | -40C to +125C |
| DSP Engine / Barrel Shifter | Yes | Yes | Yes | Yes | Yes |
| Pin-to-Pin Compatibility | Reference | Pin-to-pin, same die | Pin-to-pin | Pin-to-pin | Pin-to-pin |
主要差異化特點
- Extended temperature grade on identical silicon (對比DSPIC33FJ64GP306A-I/MR)
- Scalable FLASH without PCB change (對比DSPIC33FJ256GP306A-E/MR)
- Full DSP throughput at 3.3V (對比DSPIC33FJ32GP306A-E/MR)
設計說明
The 64-VQFN (9x9 mm) package has a center exposed pad that must be soldered to a grounded land pattern - it provides mechanical retention and the primary ground path. Use an array of thermal vias under the pad, and do not flood solder paste with one large aperture; segment it into a 3x3 or 4x4 grid to avoid voiding. Verify pin 1 orientation against the family datasheet pin diagram before stencil release.
Decouple every VDD/VSS pair with a 0.1uF ceramic placed within 2 mm of the pin, plus one bulk 10uF near the device, following standard dsPIC33F family power guidelines. The PLL multiplies the oscillator up to the 40 MIPS ceiling, so rail noise directly raises clock jitter - use an LDO or well-filtered 3.3V rail. Observe internal-regulator/PLL sequencing requirements in the family datasheet to guarantee a clean reset.
Estimated: at 40 MIPS the core current is in the tens-of-milliampere range (exact figure in the family datasheet electrical characteristics); with 3.3V supply this yields well under 0.5 W dissipation, so no heatsink is needed. However, in a -40C to +125C application, budget junction temperature as Tj = Ta + P * theta_JA and verify theta_JA for your PCB copper area against the datasheet table - the E-grade ceiling assumes adequate board thermal relief.
合規資訊
Compliance data was not present in the provided verified web data; consult the Microchip product page or certificate of conformance for current RoHS/REACH status.
