EP1AGX50DF1152C4N - Arria GX FPGA, 50K LE, 1152-BGA | Altera
MPN： EP1AGX50DF1152C4N ✗ 停產EP1AGX50DF1152C4N 概覽
An FPGA (Field-Programmable Gate Array) is a type of programmable logic IC that engineers configure after manufacture to implement arbitrary digital circuits. FPGAs sit in the broader taxonomy of digital logic ICs -> programmable logic -> semiconductor IC. Arria GX specifically targets cost-sensitive applications requiring moderate transceiver counts combined with substantial logic and DSP resources, positioning between the low-power Cyclone family and the high-performance Stratix family in Altera's portfolio.
Key differentiating features of this variant include the C4 speed grade (commercial, -4), the 1152-ball FBGA package, an industrial operating temperature range, and the N suffix indicating lead-free / RoHS-compliant assembly. The device supports LVDS, LVTTL, LVCMOS, HSTL, and SSTL I/O standards with up to 24 transceivers in the family aggregate, though the EP1AGX50 implementation provides the transceiver count appropriate to its logic density tier.
Typical applications include PCIe x1/x4 endpoint implementations, gigabit Ethernet MACs, HD-SDI video bridging, telecom backplane aggregation, and DSP co-processing. The combination of hardware multipliers and dedicated transceiver blocks makes it well-suited for protocols such as Serial RapidIO and Custom Interconnect.
When designing with this device, ensure the PCB accommodates the 1152-ball BGA land pattern with appropriate microvia stack-up, and that the Quartus II design toolchain (13.0 or later with Arria GX device support) is available for synthesis and place-and-route.
This page synthesizes distributor availability, package-level drop-in alternatives from the same Arria GX family, and practical FPGA selection notes that the manufacturer datasheet alone does not provide.
直接替換替代品，適用於 EP1AGX50DF1152C4N — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP1AGX50DF1152C4N （相同外形與佔位） — 差異在於 Speed Grade, Package, Logic Elements, Operating Temperature, Configuration Method.
EP1AGX50DF1152C6N
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP1AGX50DF1152I4N
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP1AGX50DF1152I6N
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP1AGX50CF484C6N
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP1AGX35DF780I6N
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →5CSXFC6D6F31C8N
✅ 直接替換聯絡詢價
查看資料表 →EP1AGX50DF1152C4N 最大額定值與電氣特性
| Family | Arria GX |
| Logic Elements | 50,160 |
| Total RAM Bits | 2,475,072 |
| Number of Logic Elements / Cells | 50160 |
| Total RAM Bits | 2475072 |
| Voltage - Supply | 1.2 V core (typical) |
| 工作溫度 | 0C to +85C (commercial, C grade) |
| 封裝 | 1152-BBGA, FC-FBGA |
| 安裝類型 | Surface Mount |
| Speed Grade | C4 (commercial, -4) |
| RoHS 狀態 | Compliant (lead-free) |
| Transceivers | Up to 8 channels, up to 3.125 Gbps |
EP1AGX50DF1152C4N 1152-bbga, fc-fbga 腳位配置指南
EP1AGX50DF1152C4N（1152-bbga, fc-fbga 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP1AGX50DF1152C4N.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP1AGX50DF1152C4N 適用於 6 應用s: PCIe Gen1 Endpoint Cards, Gigabit Ethernet Aggregation / Switching, HD-SDI Video Bridging and Processing, Telecom Backplane Aggregation (Serial RapidIO / Custom Interconnect), DSP Co-Processing for Wireless Baseband, Industrial Machine Vision and Imaging Pipelines.
PCIe Gen1 Endpoint Cards
The EP1AGX50DF1152C4N's integrated PCIe hard IP block and up to 3.125 Gbps transceivers make it a natural fit for PCIe x1 and x4 endpoint implementations. With 50,160 logic elements available, designers can implement the PCIe TLP layer, DMA engines, and application logic on a single device. The 1152-BGA package provides the differential transceiver pairs needed for x4 lane operation without requiring external PHY silicon, reducing both BOM cost and PCB area compared to FPGA-plus-external-PHY solutions.
推薦
Gigabit Ethernet Aggregation / Switching
Implementing multi-port Gigabit Ethernet MACs and switch fabrics is a classic use case for Arria GX devices. The EP1AGX50DF1152C4N can support up to 8 SGMII/1000BASE-X links simultaneously, with logic elements reserved for L2/L3 forwarding, ACL tables, and queue management. The 2.4 Mbits of embedded RAM blocks accommodate packet buffering and routing tables, while the 514 embedded 18x18 multipliers enable wire-speed hash-based lookups.
推薦
HD-SDI Video Bridging and Processing
Broadcast video applications including HD-SDI (1.485 Gbps and 2.97 Gbps) serializer/deserializer, frame synchronizers, and format converters map cleanly onto Arria GX transceivers. The EP1AGX50DF1152C4N's 3.125 Gbps transceiver headroom comfortably exceeds SMPTE 292M and 424M data rates, while the LE fabric handles ANC processing, audio embedding, and genlock logic. The commercial temperature grade is suitable for controlled broadcast studio environments.
推薦
Telecom Backplane Aggregation (Serial RapidIO / Custom Interconnect)
Telecommunications backplanes aggregating serial links at 1.25-3.125 Gbps benefit from Arria GX's deterministic transceiver latency and protocol flexibility. The EP1AGX50DF1152C4N implements Serial RapidIO physical layers with logic elements reserved for switch fabric and congestion management. With eight transceiver channels, designers can build 8-port aggregation line cards eliminating discrete SERDES components.
推薦
DSP Co-Processing for Wireless Baseband
The 514 embedded 18x18 multipliers deliver up to ~38 GMACs of DSP throughput, enabling channelization, FFT/iFFT, and FEC decoding for wireless baseband signal chains. The EP1AGX50DF1152C4N is well-matched to WCDMA, LTE PHY, and proprietary radio waveforms where the transceiver front end feeds digital processing in the FPGA. Embedded RAM blocks (2.4 Mbits) store sample buffers and constellation tables.
推薦
Industrial Machine Vision and Imaging Pipelines
Machine vision systems using Camera Link, CoaXPress, or GigE Vision interfaces leverage the EP1AGX50DF1152C4N's transceiver channels for high-speed image acquisition. The LE fabric implements Bayer demosaicing, color space conversion, and feature extraction in real time, while 2.4 Mbits of block RAM accommodates line buffers and lookup tables. Industrial temperature variants extend deployment to factory automation environments.
推薦
推薦產品摘要
工程參考資料，適用於 EP1AGX50DF1152C4N — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP1AGX50DF1152C6N | EP1AGX50DF1152I4N | EP1AGX50CF484C6N | 5CSXFC6D6F31C8N |
|---|---|---|---|---|---|
| Package | 1152-BBGA, FC-FBGA | 1152-BBGA, FC-FBGA | 1152-BBGA, FC-FBGA | 484-FBGA | 896-BGA / 1152-BGA (family) |
| Brand | Altera | Altera | Altera | Altera | Altera / Intel |
| Family | Arria GX | Arria GX | Arria GX | Arria GX | Cyclone V SX |
| Logic Elements | 50,160 | 50,160 | 50,160 | 50,160 | 110,000 |
| Speed Grade | C4 (commercial, -4) | C6 (-6) | I4 (industrial, -4) | C6 (-6) | C8 (-8) |
| Embedded RAM | 2,475,072 bits | 2,475,072 bits | 2,475,072 bits | 2,475,072 bits | 5,662,720 bits |
| Transceivers | Up to 8 ch / 3.125 Gbps | Up to 8 ch / 3.125 Gbps | Up to 8 ch / 3.125 Gbps | Reduced count (484-BGA) | Up to 6 ch / 3.125 Gbps |
| Lifecycle Status | NRND | NRND | NRND | NRND | Active |
主要差異化特點
- Higher speed grade available in same package (對比EP1AGX50DF1152C6N)
- Industrial temperature variant for harsh environments (對比EP1AGX50DF1152I4N)
- Newer process and active lifecycle alternative (對比5CSXFC6D6F31C8N)
設計說明
The 1152-BGA package (FC-FBGA) demands a high-density PCB stack-up with laser-drilled microvias and fine-pitch escape routing. Use at minimum a 4-1-4 build-up with 1 oz copper outer layers. Maintain 50 ohm single-ended and 100 ohm differential impedance control on transceiver channels, with length matching within +/-5 mils for PCIe lanes. Decoupling requires approximately 200 capacitors per device (0.1uF, 0.01uF, and bulk 22uF) distributed beneath the BGA shadow.
Arria GX is NRND as of 2026. New programs should NOT select this family for long-term production; instead, evaluate Cyclone V GX (5CGXFC7C7F23C8N) or Cyclone V SX (5CSXFC6D6F31C8N) which offer more LEs, lower power, and active lifecycle. Existing EP1AGX50 designs should plan a last-time-buy or migrate to Cyclone V while IP cores (especially PCIe, DDR controllers) can be ported with Quartus II-to-Quartus Prime tooling.
Estimated power consumption at 50% logic utilization, 4 active transceivers, and 100 MHz core clock is approximately 5-7W. The 1152-BGA requires a thermal management strategy: either an exposed pad heatsink with thermal interface material or substantial PCB copper pours connected to the BGA's center balls. Junction temperature must stay below 100C commercial or 125C industrial; design margin of 15-20C is recommended.
Place the FPGA on the PCB such that transceiver channel balls route directly to edge connectors or high-speed serial headers without stubs. Reference clock inputs (REFCLK) require guarded differential routing with impedance-controlled traces and AC-coupling capacitors as close to the BGA as possible. Avoid routing LVDS or general-purpose I/O underneath the BGA shadow to prevent crosstalk into sensitive analog transceiver regions.
合規資訊
RoHS compliant per N suffix in MPN. Halogen-free status not explicitly stated in verified web data. NRND lifecycle per Intel/Altera product lifecycle policy.
