EP1AGX50DF1152I6N - Arria GX FPGA, 50K LE, 1152-BGA | Intel
MPN： EP1AGX50DF1152I6N ✗ 停產EP1AGX50DF1152I6N 概覽
An FPGA (Field-Programmable Gate Array) is a type of integrated circuit containing an array of programmable logic blocks (LABs/CLBs), programmable interconnect, and configurable I/O cells that engineers can reconfigure after manufacture. Within the broader semiconductor taxonomy, FPGAs belong to programmable logic devices (PLDs), which sit under logic ICs and are used for digital logic prototyping, ASIC replacement, and high-speed signal processing. Arria GX is positioned in Intel's (formerly Altera's) mid-range FPGA portfolio, between the lower-cost Cyclone series and the high-end Stratix series, targeting applications needing integrated transceivers without the power and cost of the top-tier families.
Key features include 2,508 LABs/CLBs, 514 user I/O pins, embedded 18x18 multipliers for DSP, and integrated high-speed transceivers capable of supporting PCI Express Gen1, Gigabit Ethernet, Serial RapidIO, and other serial protocols up to 3.125 Gbps. The device also includes dedicated phase-locked loops (PLLs), configuration logic supporting multiple boot modes (AS, PS, JTAG), and on-chip termination for LVDS signaling.
The architecture is built on a SRAM-based lookup table (LUT) fabric with embedded memory blocks (M4K and M512) and DSP blocks for arithmetic-intensive functions. The hard transceiver Physical Coding Sublayer (PCS) and Physical Medium Attachment (PMA) blocks deliver deterministic serial performance, freeing soft logic for protocol stack and application processing. The 1152-ball BGA package offers a high pin count for the required I/O bandwidth while providing a thermal pad for heat dissipation.
Typical applications include telecom line cards, serial protocol bridges, video broadcast equipment, military/aerospace signal processing, and industrial imaging systems. The integrated transceivers reduce BOM cost for designs that would otherwise require external PHY chips.
When designing with this device, ensure the PCB layout provides adequate power decoupling (multiple low-ESR capacitors near each power pin), a properly designed thermal pad with thermal vias to inner copper planes, and length-matched differential traces for the high-speed serial links. Configuration memory must be loaded at every power-up since SRAM-based FPGAs are volatile.
This page synthesizes distributor pricing, drop-in alternative MPNs, and practical PCB design notes not found in the manufacturer datasheet alone, supporting engineers evaluating long-term supply for a part that is approaching end-of-life on Octopart.
直接替換替代品，適用於 EP1AGX50DF1152I6N — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP1AGX50DF1152I6N （相同外形與佔位） — 差異在於 Package, Speed Grade, Operating Temperature, Configuration Method, Logic Elements (LE).
EP1AGX50DF1152I5N
✅ 直接替換聯絡詢價
查看資料表 →EP1AGX50DF1152I4N
✅ 直接替換聯絡詢價
查看資料表 →EP1AGX50DF1152C6N
✅ 直接替換聯絡詢價
查看資料表 →EP1AGX50DF1152C5N
✅ 直接替換聯絡詢價
查看資料表 →EP1AGX50DF1152C4N
✅ 直接替換聯絡詢價
查看資料表 →EP1AGX50DF1152
✅ 直接替換聯絡詢價
查看資料表 →EP1AGX50DF1152I6N 最大額定值與電氣特性
| Series | Arria GX |
| Family | Arria GX FPGA |
| Logic Elements (LE) | 50,160 |
| Total Memory Bits | 2,475,072 |
| Number of LABs/CLBs | 2,508 |
| User I/O Count | 514 |
| 封裝 | 1152-BBGA (FineLine BGA) |
| 工作溫度 | -40C to +100C (Industrial, I6 speed grade) |
| Speed Grade | I6 |
| Process Technology | 90 nm |
| Transceiver Data Rate | Up to 3.125 Gbps |
| Configuration Method | SRAM-based, volatile (AS/PS/JTAG) |
| 安裝類型 | Surface Mount |
EP1AGX50DF1152I6N 1152-bbga (fineline bga) 腳位配置指南
EP1AGX50DF1152I6N（1152-bbga (fineline bga) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP1AGX50DF1152I6N.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP1AGX50DF1152I6N 適用於 7 應用s: Telecom Line Card Interface Bridging, Serial RapidIO Switch Fabric, HD-SDI Video Router and Embedder, Military/Aerospace Signal Processor, Industrial Imaging and Machine Vision, PCI Express Gen1 Endpoint Card, Wireless Baseband Modem.
Telecom Line Card Interface Bridging
The EP1AGX50DF1152I6N's integrated 3.125 Gbps transceivers and 514 user I/Os make it ideal for telecom line cards needing protocol bridging between backplane serial links and parallel framer/mapper ASICs. The 50,160 LEs and 2.475 Mbits of embedded memory handle HDLC framing, Ethernet MAC, and packet buffer functions in a single chip, replacing legacy ASIC+FPGA solutions. Place the device between the backplane SERDES lines and the network processor, using dedicated PCS/PMA blocks for each serial channel. Designers benefit from a single-chip BOM but should verify the I6 speed grade meets the timing budget for the chosen protocol.
推薦
Serial RapidIO Switch Fabric
The EP1AGX50DF1152I6N supports Serial RapidIO (SRIO) at 1.25, 2.5, and 3.125 Gbps through its built-in transceivers, making it a flexible RapidIO endpoint or small switch fabric. With 50K LEs the device can implement a 4-port SRIO switch with local packet buffer memory in the 2.475 Mbit block RAMs. The industrial temperature grade (I6, -40C to +100C) supports outdoor or industrial cabinet installations. Use the soft RapidIO IP from Altera to handle logical-layer transactions and traffic management.
推薦
HD-SDI Video Router and Embedder
The Arria GX family is widely used in broadcast video routers for embedding/de-embedding audio in HD-SDI serial streams at 1.485 Gbps, with the EP1AGX50DF1152I6N providing enough logic for 8-12 channel embedder cards. Its 514 I/Os handle SMPTE 259M/292M/424M video I/O alongside AES/EBU audio and GPI control. The dedicated transceiver CDR recovers the embedded clock, while soft logic implements audio shuffling, Dolby E, and metadata insertion. Larger routers use multiple EP1AGX50 parts with cross-point switching in the FPGA fabric.
推薦
Military/Aerospace Signal Processor
The industrial temperature grade and high logic density of the EP1AGX50DF1152I6N suit defense electronics applications such as radar front-end processing, electronic warfare subsystems, and secure communications. With 50K LEs and embedded 18x18 multipliers, the device implements FFT pipelines, channelizers, and digital downconverters in a single chip. Designers targeting military temperature (-55C to +125C) should look at the EP1AGX50Q-prefix SMD part numbers. The 1152-BGA package meets the rugged packaging requirements of MIL-PRF-38535 qualified builds.
推薦
Industrial Imaging and Machine Vision
The EP1AGX50DF1152I6N's combination of 514 user I/Os and built-in transceivers suits high-speed Camera Link, CoaXPress, or GigE Vision frame grabbers used in machine vision systems. The 50K LEs implement image preprocessing pipelines (filtering, thresholding, Bayer conversion) while the transceivers move pixel data at line-rate speeds to the host PC. Industrial temperature operation enables deployment in factory automation cells and outdoor machine vision installations. The volatile SRAM configuration loads at power-up from a parallel flash or EPCS serial configuration device.
推薦
PCI Express Gen1 Endpoint Card
The EP1AGX50DF1152I6N supports PCI Express Gen1 x1, x4, and x8 endpoints through its built-in transceivers and hard PCIe IP block, with 50K LEs available for the application logic. A typical PCIe endpoint card uses the FPGA for DMA engines, protocol processing, and I/O expansion while the integrated PCIe block handles the link layer. This combination removes the need for an external PCIe PHY and PHY-to-FPGA bridge chip. Designers should verify the I6 timing grade meets PCIe Gen1 jitter and latency requirements for their use case.
推薦
Wireless Baseband Modem
The EP1AGX50DF1152I6N's 18x18 hardware multipliers and 2.475 Mbit of embedded memory implement PHY-layer baseband processing for small-cell wireless base stations, including turbo decoders, FFT/IFFT blocks, and channel estimation. The 3.125 Gbps transceivers connect to RF front-end ADCs/DACs via CPRI or OBSAI digital interfaces. With 50K LEs, a single FPGA can serve a 2x2 MIMO LTE femtocell PHY. Industrial temperature operation suits outdoor small-cell deployments.
推薦
推薦產品摘要
工程參考資料，適用於 EP1AGX50DF1152I6N — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP1AGX50DF1152I5N | EP1AGX50DF1152I4N | EP1AGX50DF1152C6N |
|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1152-BBGA (FineLine BGA) | 1152-BBGA - same | 1152-BBGA - same | 1152-BBGA - same |
| Logic Elements | 50,160 LE | 50,160 LE (identical) | 50,160 LE (identical) | 50,160 LE (identical) |
| Speed Grade | I6 (industrial) | I5 (industrial, faster) | I4 (industrial, fastest) | C6 (commercial, 0C to +85C) |
| Temperature Range | -40C to +100C (industrial) | -40C to +100C | -40C to +100C | 0C to +85C |
| User I/O | 514 | 514 (identical) | 514 (identical) | 514 (identical) |
| Transceiver Rate | Up to 3.125 Gbps | Up to 3.125 Gbps | Up to 3.125 Gbps | Up to 3.125 Gbps |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete |
主要差異化特點
- Mid-range Arria GX with 50K LE and built-in 3.125 Gbps transceivers (對比EP1SGX40DF1020C6)
- Industrial temperature grade with 1152-ball BGA (對比EP1AGX50CF484I6N)
- I6 speed grade offers lowest cost among industrial Arria GX 1152-BGA options (對比EP1AGX50DF1152I5N)
設計說明
Estimated: The 1152-FineLine BGA package dissipates up to ~8W typical for a 50K-LE Arria GX at full utilization. Provide a thermal pad land pattern with at least 9 thermal vias (0.3 mm drill, 1.0 mm pitch) connecting to a continuous copper inner plane. Without thermal vias, junction temperature may exceed 100C ambient ratings. Use the Altera PowerPlay early power estimator in Quartus II before final layout to size the heatsink or forced-air cooling.
Route all high-speed transceiver differential pairs with 100 ohm differential impedance, length matching within 150 mils, and continuous reference plane on layer 2. Use 8 mil trace width with 6 mil spacing on a 4-layer 1 oz board to hit 100 ohm differential. Minimize the number of vias on each RX/TX pair - no more than 2 vias total. Place AC coupling capacitors (0.1 uF) close to the transmitter output pins.
Estimated: EP1AGX50DF1152I6N requires VCCINT (1.2V core for Arria GX 90 nm), VCCPD (3.3V pre-driver), VCCIO (1.5V/1.8V/2.5V/3.3V per bank), and VCCA_PLL (1.2V analog). Place at least 4 decoupling capacitors per supply pin (0.1 uF + 0.01 uF + 10 uF bulk + 220 uF bulk). Use a Ferrite bead on the PLL analog supply to isolate from digital switching noise. Power sequencing requires VCCINT before VCCIO with monotonic rise.
The EP1AGX50DF1152I6N is SRAM-based and volatile - it must reload configuration at every power-up. Use a serial EPCS16 or EPCS64 configuration flash with AS (active serial) mode for low-pin-count boot. For fastest boot use parallel x16 flash with PS (passive serial) or FPP (fast passive parallel). The CONF_DONE pin must be pulled high via 10K resistor to VCCPD, and nSTATUS pulled to 1K pull-up. JTAG header (10-pin or 20-pin Altera format) required for in-system programming.
Obsolescence risk: this part is obsolete as of 2026-09-06 with no authorized franchised stock. Before committing a new design, verify last-time-buy availability from independent distributors and authenticate each shipment (X-ray decapsulation, lot-trace, country-of-origin review). For new designs, evaluate migration paths to Arria 10 (10AX115N3F40I2SG) or Cyclone 10 GX, which require a complete PCB redesign and firmware port to Quartus Prime Pro.
合規資訊
RoHS and lead-free status not explicitly confirmed in verified distributor data as of 2026-09-06. Request compliance documentation from distributor before volume orders. AEC-Q100 not applicable - this is an industrial FPGA, not an automotive-qualified part.
