EP1C20F400C6 - 20,060 LEs Cyclone FPGA 400-FBGA | Intel / Altera
MPN： EP1C20F400C6 ✗ 停產EP1C20F400C6 概覽
An FPGA (Field Programmable Gate Array) is a programmable logic device consisting of an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells, all controlled by SRAM-based configuration memory. FPGAs occupy a unique position in the design hierarchy: more flexible than ASICs (no mask cost, instant prototyping) yet more deterministic than microcontrollers, they excel at parallel data-path processing, custom bus interfacing, and hardware-accelerated DSP. Cyclone family FPGAs sit at the entry-level of Altera's portfolio, optimized for consumer, industrial control, and low-cost communications designs.
Key features include 20,060 logic elements organized into 2,006 logic array blocks, 64 M4K RAM blocks (128 x 36 bits each, total 294,912 RAM bits), 1 PLL per device, and 301 maximum user I/O pins. The device supports LVDS I/O at up to 311 Mbps and single-ended I/O standards including LVTTL, LVCMOS, SSTL, and HSTL. Configuration is via passive serial, active serial, or JTAG modes.
The Cyclone architecture pairs 4-input look-up tables (LUTs) with embedded memory and dedicated routing, allowing single-chip implementation of bus bridges, video pipelines, and motor-control state machines. The 1.5 V core reduces dynamic power relative to earlier 2.5 V FPGAs, while the 0.13 µm process delivers cost efficiency for high-volume production. The commercial temperature grade (0 °C to +85 °C) and 400-ball FBGA package support board densities typical of consumer video, industrial control, and telecom infrastructure.
Typical applications include flat-panel display controllers, low-cost video capture cards, DSL/cable modem glue logic, industrial machine-control interfaces, and protocol-bridge ASIC replacements. The combination of 301 user I/Os and 294 Kbits of block RAM enables drop-in replacement of small-to-medium ASICs without external memory.
When designing with this Cyclone device, reserve at least one configuration mode pin and follow Altera's power-sequencing guidelines - the 1.5 V VCCINT must reach its nominal range before VCCIO banks power up to avoid I/O latch-up. Quartus II software (or later Intel Quartus Prime) is required for synthesis, place-and-route, and bitstream generation.
This page synthesizes distributor stock data, drop-in FPGA alternatives, and PCB-level design notes not found in the manufacturer datasheet alone, helping engineers evaluate long-term sourcing risk and pin-to-pin migration paths within the Cyclone family.
直接替換替代品，適用於 EP1C20F400C6 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP1C20F400C6 （相同外形與佔位） — 差異在於 Speed Grade, Process Technology, Package, PLLs, Family.
EP1C20F400C7N
✅ 直接替換聯絡詢價
查看資料表 →EP1C20F400I7N
✅ 直接替換聯絡詢價
查看資料表 →EP1C20F400C8
✅ 直接替換聯絡詢價
查看資料表 →EP2C20F400C7N
✅ 直接替換📋 參考替代品（不在目錄中）
EP1C20F400C6N
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP1C20F400C6 最大額定值與電氣特性
| Series | Cyclone |
| Logic Elements | 20,060 |
| Logic Array Blocks | 2,006 |
| Embedded RAM Bits | 294,912 bits (128 x 36-bit M4K blocks x 64) |
| Total RAM Blocks | 64 M4K blocks |
| Maximum User I/O | 301 |
| PLLs | 1 |
| 封裝 | 400-ball FineLine BGA (FBGA) |
| Core Voltage (VCCINT) | 1.5 V |
| Process Technology | 0.13 µm SRAM |
| 工作溫度 | 0 °C to +85 °C (Commercial, C6 speed grade) |
| Speed Grade | 6 (commercial) |
| Configuration Modes | Passive Serial, Active Serial, JTAG |
| 安裝類型 | Surface Mount (BGA) |
| LVDS Data Rate | Up to 311 Mbps |
| Design Software | Altera Quartus II / Intel Quartus Prime |
EP1C20F400C6 400-ball fineline bga (fbga) 腳位配置指南
EP1C20F400C6（400-ball fineline bga (fbga) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP1C20F400C6.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP1C20F400C6 適用於 6 應用s: Flat-Panel Display Controller, Industrial Machine Control Interface, Telecom Protocol Bridge / Glue Logic, Low-Cost Video Capture / Image Processing, ASIC Replacement / Bus Bridge, Consumer Audio/Video Processing.
Flat-Panel Display Controller
The EP1C20F400C6 is well-suited for flat-panel display controller designs where parallel RGB/TTL video data must be processed, scaled, and reformatted for LVDS or RSDS panel interfaces. Its 20,060 LEs and 64 M4K RAM blocks (294,912 bits) provide enough logic and on-chip memory to implement line buffers for de-interlacing and color-space conversion without external SRAM. The 301 user I/Os comfortably handle 18/24-bit video buses plus I2C, SPI, and GPIO side channels, and LVDS support up to 311 Mbps covers XGA/SXGA panel timing.
推薦
Industrial Machine Control Interface
In industrial machine control, the EP1C20F400C6 (commercial grade) or its pin-compatible EP1C20F400I7N (industrial grade) serves as the central glue-logic device between PLCs, motor drivers, and sensor arrays. Its 1 PLL generates the clocks for multiple stepper/servo channels, while 301 user I/Os accept quadrature encoder inputs, end-stop switches, and PWM outputs without external muxing. The 294 Kbits of block RAM enable on-chip FIFO buffering for high-speed serial protocols such as RS-485 or CAN, replacing discrete UART chips.
推薦
Telecom Protocol Bridge / Glue Logic
The EP1C20F400C6 is a proven choice for telecom protocol-bridge applications where TDM streams, HDLC framing, or custom serial protocols must be converted between backplanes. Its 20,060 LEs handle multi-channel state machines, while the 64 M4K RAM blocks implement elastic FIFOs and look-up tables for protocol translation. Designers appreciate the 301 user I/Os for direct connection to multiple bus widths (8/16/32-bit), eliminating external transceiver buffers. Per Altera's telecom reference designs, the Cyclone EP1C20 family was widely deployed in DSLAM line cards and base-station interface boards.
推薦
Low-Cost Video Capture / Image Processing
For low-cost video capture and pre-processing pipelines, the EP1C20F400C6 delivers enough logic to implement Bayer demosaicing, color correction, and scaling in real time at standard-definition rates. The 294,912 bits of embedded RAM are sized for line buffers without external memory, reducing BOM cost. The 400-FBGA package's 301 user I/Os accept parallel sensor data plus DMA handshakes to a host controller. LVDS I/O at 311 Mbps supports direct connection to megapixel image sensors.
推薦
ASIC Replacement / Bus Bridge
When a low-volume ASIC must be replaced without PCB redesign, the EP1C20F400C6 frequently serves as a drop-in equivalent. With 20,060 LEs it can absorb the original gate count of 80k-120k-system-gate ASICs, while its 301 user I/Os match common 32-bit external buses (PCI, ISA, generic memory-mapped interfaces). The 1.5 V core reduces dynamic power relative to older 3.3 V ASICs, and the SRAM-based configuration allows last-minute firmware updates. Per Altera's reference designs, this is the canonical use case for the entire Cyclone family.
推薦
Consumer Audio/Video Processing
The EP1C20F400C6 was widely adopted in consumer audio/video products such as set-top boxes, DVD recorders, and home-theater receivers where parallel processing of multiple audio streams and video overlays is required. Its 64 M4K RAM blocks are ideal for audio sample buffers and small video line stores, while the 20,060 LEs handle multi-channel decoding and HDMI/SDPIF muxing. The commercial temperature grade (0 °C to +85 °C) fits indoor consumer electronics environments. Altera's Cyclone Family datasheet lists DVD recorders and digital TVs as flagship consumer applications for this device.
推薦
推薦產品摘要
工程參考資料，適用於 EP1C20F400C6 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP1C20F400C7N | EP1C20F400I7N | EP1C20F400C8 | EP2C20F400C7N | EP1C20F400C6N |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 400-ball FBGA | 400-ball FBGA - same | 400-ball FBGA - same | 400-ball FBGA - same | 400-ball FBGA - same | 400-ball FBGA - same |
| Logic Elements | 20,060 | 20,060 | 20,060 | 20,060 | 18,752 | 20,060 |
| Embedded RAM Bits | 294,912 bits | 294,912 bits | 294,912 bits | 294,912 bits | 239,616 bits | 294,912 bits |
| Maximum User I/O | 301 | 301 | 301 | 301 | 315 | 301 |
| Speed Grade | 6 (commercial) | 7 (commercial) | 7 (industrial) | 8 (commercial) | 7 (Cyclone II) | 6 (commercial) |
| Operating Temperature | 0 °C to +85 °C | 0 °C to +85 °C | -40 °C to +100 °C | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C |
| Hardware Multipliers (18x18) | 0 | 0 | 0 | 0 | 26 | 0 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | NRND / Limited | Obsolete |
主要差異化特點
- Original Cyclone high-density 20k-LE flagship with 301 user I/Os (對比EP1C12Q240C6)
- Drop-in vertical migration across speed grades and temperature ranges (對比EP1C20F400I7N)
- Migration path to Cyclone II adds hardware multipliers (對比EP2C20F400C7N)
- Open datasheet archive across multiple distributors (對比Lattice/Xilinx competitors)
設計說明
Estimated: at typical 25% toggle rate and 50% I/O utilization, the EP1C20F400C6 draws approximately 300-500 mA from a 1.5 V VCCINT rail and 100-200 mA total from VCCIO banks. Designers must sequence VCCINT (1.5 V) before VCCIO (1.5/1.8/2.5/3.3 V) to prevent I/O latch-up; per Altera's Cyclone handbook, an FPGA-controller power supervisor or Altera's recommended sequencer circuit is mandatory. Bulk decoupling needs at least 220 µF near the FBGA, plus 0.1 µF and 1 µF ceramics at every VCCINT ball pair.
The 400-ball FBGA requires a multilayer PCB (typically 6-8 layers) with a 1.0 mm or finer ball pitch and microvia or via-in-pad technology for the inner rows. Per Altera's AN 74: Designing with FineLine BGA Packages, designers must match the recommended land diameter (typically 0.4 mm) and use non-solder-mask-defined (NSMD) pads to ensure reliable joint formation. A continuous ground plane on layer 2 and a power island on layer 3 are strongly recommended for signal-integrity compliance at LVDS rates up to 311 Mbps.
Differential pairs (LVDS) must be length-matched within ±10 mil and routed on a single layer to avoid stub reflections; per Altera's High-Speed Differential Signaling Design Guidelines, characteristic differential impedance should be 100 Ω ±10%. CLK and PLL feedback traces must be guarded by ground on both sides and kept under 200 mil. Place the JTAG chain components within 2 inches of the TAP pins and isolate from switching signals to prevent configuration failures.
Common pitfalls: (1) connecting nCONFIG to a pushbutton without debounce causes spurious reconfigurations; (2) omitting the 10 kΩ pull-up on nCE enables daisy-chain misconfiguration; (3) leaving MSEL[2:0] floating selects an unknown configuration mode - tie to VCCINT or GND per the desired standard; (4) using EP1C20-specific bitstreams on a Cyclone II board fails because the IDCODE differs - regenerate in Quartus. Per Altera's configuration handbook, all MSEL settings must match the configuration device voltage and mode.
Estimated: the 400-FBGA has theta_JA of approximately 15-20 °C/W with a 1 oz copper ground plane and 100 LFM airflow. At 1 W total dissipation, junction rises 15-20 °C above ambient - well within the 0 °C to +85 °C commercial limit. However, in enclosed consumer enclosures with no airflow, designers should de-rate to 0.5 W maximum or upgrade to the EP1C20F400I7N industrial variant. A thermal via array under the FBGA thermal pad is essential for the theta_JB path to chassis ground.
合規資訊
Original Cyclone generation (2003-2007) predates widespread RoHS transition; EP1C20F400C6 contains lead-bearing solder balls. The 'N' suffix variants (e.g. EP1C20F400C6N, EP1C20F400I7N) typically indicate Pb-free terminal finish. AEC-Q100 not applicable - use automotive-grade Cyclone II/III/IV Q1 variants instead. REACH SVHC status unknown without specific manufacturer declaration.
