EP1K100F1256-2 - ACEX 1K 100k Gates FPGA, F1256, -2 Speed | Intel
MPN： EP1K100F1256-2 ✗ 停產EP1K100F1256-2 概覽
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit whose digital logic functionality is defined after manufacturing by the end user. FPGAs sit in the programmable logic hierarchy below full custom ASICs but above generic logic ICs, occupying the role of flexible hardware that can be reconfigured for DSP, control, protocol bridging, and parallel processing workloads. Compared with discrete logic ICs, FPGAs integrate anywhere from thousands to millions of logic elements, embedded multipliers, block RAM, and high-speed transceivers onto a single die.
Key features of the EP1K100F1256-2 include approximately 4,992 logic elements (LEs), 12 embedded array blocks providing roughly 49,152 RAM bits, 333 user-I/O pins, and a core voltage of 2.5 V with multi-standard I/O support (LVTTL, LVCMOS, PCI, SSTL, LVDS). The device supports configuration via passive serial, active serial, and JTAG modes, and is fabricated on a 0.18 µm SRAM process. Per-pin slew-rate control and programmable drive strength simplify signal-integrity tuning at the board level.
The ACEX 1K architecture is built around Logic Array Blocks (LABs) connected by a continuous row-and-column routing network; each LAB contains ten LEs with carry-chain and cascade-chain support for arithmetic and wide fan-in logic. The embedded array blocks (EABs) provide up to 4 Kbits of dual-port RAM each and can be cascaded to build FIFOs, lookup tables, and DSP coefficient stores. JTAG boundary-scan test (IEEE 1149.1) is integrated for board-level testability.
Typical applications include telecommunications line cards, industrial control and factory automation backplanes, PCI/PCI-X bridge designs, network routers and switches, video and image processing pipelines, and legacy glue-logic replacement. Engineers choose the EP1K100F1256-2 when they need a cost-effective, mid-density programmable fabric with a proven toolchain (Quartus) and a mature FPGA platform with abundant reference designs.
When designing with this part, ensure the 256-ball FineLine BGA PCB footprint follows Intel's recommended land pattern and that decoupling follows the Quartus PowerPlay guidelines for ACEX 1K. Because the device is SRAM-based, the configuration bitstream must be loaded from a non-volatile PROM (such as an EPC family configuration device) on every power-up; this adds a boot-time latency that may matter in fast-startup systems.
This page synthesizes distributor stock signals, ACEX 1K family context, and practical design considerations not collected on a single distributor page, giving procurement and engineering teams a single source for evaluation, sourcing, and migration decisions.
直接替換替代品，適用於 EP1K100F1256-2 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP1K100F1256-2 （相同外形與佔位） — 差異在於 Family, Mounting Type, Package, Process Technology.
EP1K100F1256-3
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
EP1K100F1256-1
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
EP1K100FI1256-2
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
EP1K100FI1256-3
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
EP1K100EFI484-2
✅ 直接替換聯絡詢價
查看資料表 →EP1K100F1256-2 最大額定值與電氣特性
| Family | ACEX 1K |
| Typical Gates | 100,000 |
| Maximum Gates | 257,000 |
| Embedded Array Blocks (EABs) | 12 |
| Total RAM Bits | 49,152 |
| User I/O Pins | 333 |
| 封裝 | 256-ball FineLine BGA (F1256) |
| Speed Grade | -2 |
| Core Voltage | 2.5 V |
| I/O Standards | LVTTL, LVCMOS, PCI, SSTL, LVDS |
| Configuration Modes | Passive Serial, Active Serial, JTAG |
| Process Technology | 0.18 µm SRAM |
| JTAG (IEEE 1149.1) | Yes |
| 安裝類型 | Surface Mount (BGA) |
| RoHS 狀態 | unknown |
EP1K100F1256-2 256-ball fineline bga (f1256) 腳位配置指南
EP1K100F1256-2（256-ball fineline bga (f1256) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP1K100F1256-2.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP1K100F1256-2 適用於 6 應用s: Telecommunications Line Cards, Industrial Control and Factory Automation Backplanes, PCI / PCI-X Bridge and Endpoint Designs, Network Routers and Switches, Video and Image Processing Pipelines, Legacy Glue-Logic Replacement and Modernization.
Telecommunications Line Cards
The EP1K100F1256-2 is well suited to mid-complexity telecommunications line-card glue logic where 333 user I/Os allow direct fan-out to TDM buses, framers, and PHY devices. Its 12 embedded array blocks provide 49,152 bits of dual-port RAM which is enough to build small FIFOs and look-up tables for channel-associated signaling and framing alignment. The 2.5 V core and LVTTL/LVCMOS I/O standards make it compatible with the legacy 3.3 V line-card ASIC ecosystem, while JTAG boundary-scan simplifies board-level test of high-density BGA assemblies. ACEX 1K devices in telecom were typically used for protocol conversion between T1/E1 framers, HDLC controllers, and backplane serializers, with the -2 speed grade offering adequate timing margin for 77.76 MHz STS-3 tributary rates.
推薦
Industrial Control and Factory Automation Backplanes
ACEX 1K devices were a staple of industrial backplane designs, and the EP1K100F1256-2 in the F1256 256-ball BGA delivers the pin count and routing density required to bridge multiple fieldbus masters to a single controller card. The -2 speed grade comfortably meets Profibus, CANopen, and DeviceNet timing margins at typical baud rates up to 12 Mbps, while the abundant embedded RAM supports packet buffering without external SRAM. Programmable I/O standards let one FPGA interface directly to 5 V and 3.3 V peripherals across mixed-voltage backplanes, eliminating level translators. JTAG-based in-system programmability is critical in factory automation, allowing field firmware updates without removing cards from service.
推薦
PCI / PCI-X Bridge and Endpoint Designs
The EP1K100F1256-2 supports 33 MHz and 66 MHz PCI and PCI-X signaling through its programmable I/O banks, with 333 user I/Os offering enough bandwidth for 32-bit and 64-bit PCI implementations. The 12 EABs supply 49 Kbits of dual-port RAM for transaction buffering, scatter-gather descriptor queues, and configuration-space register mirroring. The 2.5 V core keeps power dissipation reasonable across the BGA's 31 C/W theta_JA thermal envelope, even with all PCI parity and arbitration logic enabled. Engineers building custom PCI endpoints with ACEX 1K often pair the FPGA with a PCI clock buffer and a 3.3 V bus termination network; the -2 speed grade meets PCI 66 MHz setup-and-hold margins with standard 4 ns SI paths.
推薦
Network Routers and Switches
In network router and switch line cards the EP1K100F1256-2 served as a versatile protocol-bridging engine, fanning out 333 user I/Os across multiple Ethernet PHYs, POS framers, and switch-fabric ASICs. Its 12 EABs totaling 49,152 bits of dual-port RAM are sufficient for small egress FIFOs, route-lookup TCAM shadow tables, and statistics counters. The LVDS-capable I/O banks allow direct connection to GbE serializer/deserializer chips, eliminating external LVDS buffers. The 0.18 µm 2.5 V core balances power and performance for sustained packet-processing workloads, and the -2 speed grade supports GbE datapath rates up to 125 MHz DDR comfortably.
推薦
Video and Image Processing Pipelines
For mid-resolution video and image processing, the EP1K100F1256-2 with its 4,992 LEs and 12 dual-port EABs supports pipelined pixel-processing architectures up to SVGA resolutions. The 333 user I/Os allow direct connection to video ADCs, DACs, and digital video interfaces without external bus multiplexers. The embedded array blocks are well suited to small line buffers and coefficient storage for simple FIR filters and color-space converters. The 0.18 µm SRAM process delivers predictable timing closure for the parallel pixel-rate datapaths typical of camera preprocessing and frame-grabber boards, with the -2 speed grade comfortably meeting 65 MHz pixel clocks.
推薦
Legacy Glue-Logic Replacement and Modernization
The EP1K100F1256-2 is a frequent target for legacy board-repair scenarios where a board was originally designed around several discrete TTL/CMOS logic ICs and needs to be consolidated into a single programmable device. With 333 user I/Os and 49,152 RAM bits, a single ACEX 1K can replace dozens of 74-series buffers, latches, and small FIFOs, freeing significant board area. For modernization paths engineers can recompile the same Quartus II design into a Cyclone II EP2C20 or Cyclone III EP3C10 with minimal RTL changes, gaining lower power, lead-free packaging, and a longer supply horizon. This makes the F1256 ACEX 1K a useful bridge part for sustaining production of legacy industrial and aerospace systems.
推薦
推薦產品摘要
工程參考資料，適用於 EP1K100F1256-2 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP1K100F1256-3 | EP1K100F1256-1 | EP1K100FI1256-2 | EP1K100FI1256-3 | EP1K100EFI484-2 |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 256-ball FineLine BGA (F1256) | 256-ball FineLine BGA (F1256) | 256-ball FineLine BGA (F1256) | 256-ball FineLine BGA (F1256) | 256-ball FineLine BGA (F1256) | 484-ball Enhanced FineLine BGA (FI484) |
| Speed Grade | -2 (mid) | -3 (fastest) | -1 (slowest) | -2 (mid, industrial temp) | -3 (fastest, industrial temp) | -2 (mid) |
| Typical Gates | 100,000 | 100,000 | 100,000 | 100,000 | 100,000 | 100,000 |
| Embedded Array Blocks (EABs) | 12 | 12 | 12 | 12 | 12 | 12 |
| Total RAM Bits | 49,152 | 49,152 | 49,152 | 49,152 | 49,152 | 49,152 |
主要差異化特點
- Mid-density ACEX 1K with 333 user I/Os in a compact F1256 BGA (對比EP1K100EFI484-2)
- Mid -2 speed grade balances Fmax and dynamic power (對比EP1K100F1256-3)
- Commercial temperature grade offers the broadest second-source availability (對比EP1K100FI1256-2)
設計說明
The EP1K100F1256-2 operates from a 2.5 V core supply and requires a separate 3.3 V supply for the PCI-capable I/O banks. Estimated: with all 333 I/Os switching at 25 MHz and 50% utilization of LEs, total power draw is typically 1.2-1.8 W. Decouple the core rail with 100 uF bulk plus 0.1 uF and 0.01 uF ceramics placed within 5 mm of each VCCINT ball pair.
The F1256 1.0 mm-pitch FineLine BGA demands a 4-layer PCB minimum with a continuous ground plane under the package to control simultaneous-switching-noise (SSN). Use a 0.5 mm via-in-pad or dogbone fan-out for breakout routing, and assign signal layers adjacent to the ground plane rather than the power plane to minimize loop inductance on the high-speed user I/O banks.
Because ACEX 1K is SRAM-based, the device loses its configuration on every power-down and must reload from an external EPC2, EPCS1, or EPCS4 configuration memory on every boot - plan for a 50-300 ms boot latency depending on bitstream size. Do not assume JTAG retention of the design; in-system programming does not replace a non-volatile boot source. Also avoid using the JTAG TCK as a general-purpose I/O - it is mandatory for boundary-scan.
合規資訊
Compliance information for the EP1K100F1256-2 was not present in the verified web data. Original Altera ACEX 1K devices were typically lead-bearing BGA packages pre-RoHS-mandate; RoHS-compliant variants may exist in the secondary market but cannot be confirmed without lot-specific documentation.
