Intel

EP1S10F484C7N - Stratix FPGA 10,570 LEs, 484-FBGA | Intel

MPN： EP1S10F484C7N ✗ 停產

1.5 V Vdss 484-ball FineLine BGA (FBGA-484), 23 x 23 mm, 1 mm pitch Package C7 (-7) Speed 920,448 bits Memory

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EP1S10F484C7N 概覽

The Intel (formerly Altera) EP1S10F484C7N is a member of the original Stratix FPGA family fabricated on a 1.5 V, 130 nm CMOS process, delivering 10,570 logic elements, 920,448 bits of embedded RAM, and 335 user I/O pins in a 484-ball FineLine BGA package. It is the commercial-grade, -7 speed-grade variant of the EP1S10 family, optimized for high-performance DSP and parallel datapath designs.

An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs) connected by a programmable interconnect fabric. FPGAs occupy a tier above general-purpose microcontrollers for workloads that demand deterministic parallel processing: DSP pipelines, high-speed serial interfaces, custom datapaths, and ASIC prototyping. Modern FPGAs typically embed block RAM, DSP blocks, PLLs, and high-speed transceivers; the Stratix family was the first to integrate dedicated TriMatrix memory and DSP blocks at this scale.

Key features include 10,570 logic elements (LEs) organized as 1,057 Logic Array Blocks (LABs), 920 Kbits of TriMatrix embedded RAM split into M512/M4K/M-RAM blocks, and 48 embedded DSP blocks for fixed- and floating-point signal processing. The device also integrates up to 12 PLLs, 335 user I/O pins with support for multiple I/O standards (LVTTL, LVCMOS, SSTL, LVDS, PCI), and 4 phase-locked loops dedicated to high-speed clock management. Configuration is supported via JTAG, Passive Serial, Passive Parallel, or via a configuration device such as the EPC16 or EPCS.

Architecturally, the Stratix fabric places 10 LEs into each LAB with a dedicated carry chain and a shared register chain for fast arithmetic. The TriMatrix memory blocks are tightly coupled to the DSP blocks, enabling single-cycle multiply-accumulate operations. The 130 nm process and 1.5 V core deliver a typical internal operating frequency in the range of hundreds of MHz for registered designs, with maximum internal performance cited in the family data sheet as 420 MHz in benchmark datapaths.

Typical applications include telecommunications line cards, baseband signal processing, video and image processing, military and aerospace prototyping, ASIC and ASIP emulation, and high-end industrial control. The large logic and RAM capacity also suits networking equipment such as routers and switches that require custom packet-processing pipelines. The wide I/O count and flexible I/O standard support make EP1S10 devices a common fit for legacy parallel bus interfaces that are no longer well served by smaller Cyclone or MAX families.

When designing with this part, ensure the Quartus II design toolchain (version 13.0 or earlier is recommended for legacy Stratix support) is selected, since later Quartus releases dropped the original Stratix device support. Pay attention to decoupling on each VCCINT, VCCIO bank, and PLL supply pin, and follow the Intel/Altera Stratix FPGA Hardware Design Guidelines for power rail sequencing and JTAG chain termination.

This page synthesizes distributor pricing (DigiKey, Mouser, Octopart), drop-in Altera/Intel variants in the same 484-FBGA footprint, and practical design notes not found in the standalone manufacturer datasheet.

直接替換替代品，適用於 EP1S10F484C7N — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。

此系列的變體

與下列產品可直接替換的同系列型號： EP1S10F484C7N （相同外形與佔位） — 差異在於 Package, Family, Operating Temperature, Mounting Type, Configuration Method.

EP1S10F484C5N

Intel

Package: 484-ball FCBGA (F484), 23 x 23 mm, 1.0 mm pitch

Family: Stratix (original)

Mounting Type: Surface Mount

比較對象 EP1S10F484C7N →

EP1S10F484C6N

Intel

Package: 484-FBGA (23 × 23 mm, 1.0 mm pitch)

Family: Stratix

Operating Temperature: 0 °C to 85 °C (TJ)

比較對象 EP1S10F484C7N →

EP1S10F484C7

Altera

Package: 484-BBGA, FCBGA (FBGA-484, 23 x 23 mm, 1.0 mm pitch)

Family: Stratix-I (EP1S10)

Operating Temperature: 0 C to 85 C (Commercial Extended)

比較對象 EP1S10F484C7N →

EP1S10F484I6N

Intel

Package: 484-ball FBGA (FCBGA), 23 x 23 mm, 1 mm pitch

Family: Stratix

Operating Temperature: 0C to +85C (Industrial)

比較對象 EP1S10F484C7N →

EP1S20F484C6N

Intel

Package: 484-Ball FCBGA (23 x 23 mm, 1.0 mm pitch)

Family: Stratix

Operating Temperature: 0 C to 85 C (Commercial)

比較對象 EP1S10F484C7N →

EP1S10F484C7

✅ 直接替換

Altera

📦 484-ball FBGA

Stratix · Stratix-I (EP1S10) · 10,570 · 1,057 · 920,448 · 335 · 6 · 4

聯絡詢價

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EP1S10F484C6N

Intel

📦 484-ball FBGA

Stratix · 10,570 · 1,057 · 920,448 · 335 · 484-FBGA (23 × 23 mm, 1.0 mm pitch) · 130 nm CMOS · 1.425 V to 1.575 V (core 1.5 V)

聯絡詢價

查看資料表 →

EP1S10F484C5N

✅ 直接替換

Intel

📦 484-ball FBGA

Stratix · Stratix (original) · 10,570 · 1,057 · 920,448 · 14 · 6 (≈48 9-bit multipliers) · 4

聯絡詢價

查看資料表 →

ℹ️ 2 跨封裝零件已隱藏 — 不同封裝需重新加工 PCB，並非真正的直接替換品。聯絡我們如果您需要跨封裝建議。

EP1S10F484C7N 最大額定值與電氣特性

Family	Stratix (EP1S)
Manufacturer	Intel (formerly Altera)
Process Technology	130 nm CMOS
Core Voltage	1.5 V
Logic Elements	10,570
Logic Array Blocks (LABs)	1,057
Embedded Memory (Total)	920,448 bits
Embedded Memory Blocks	TriMatrix (M512/M4K/M-RAM)
Embedded DSP Blocks	48
Maximum User I/O	335
PLLs	12
封裝	484-ball FineLine BGA (FBGA-484), 23 x 23 mm, 1 mm pitch
Speed Grade	C7 (-7)
Operating Temperature (Commercial)	0 C to +85 C
Configuration Methods	JTAG, Passive Serial, Passive Parallel

EP1S10F484C7N 484-ball fineline bga (fbga-484), 23 x 23 mm, 1 mm pitch 腳位配置指南

EP1S10F484C7N（484-ball fineline bga (fbga-484), 23 x 23 mm, 1 mm pitch 封裝）的腳位配置。此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。

EP1S10F484C7N 的 484-ball fineline bga (fbga-484), 23 x 23 mm, 1 mm pitch 封裝腳位圖

無詳細腳位定義資料： EP1S10F484C7N.

請參閱資料表以查看完整腳位配置。

典型應用

EP1S10F484C7N 適用於 6 應用s: Telecommunications Line Card, ASIC and ASIC Prototyping, Digital Signal Processing (DSP), Video and Image Processing, Industrial Control and Networking, Legacy Migration and Bridging.

🌐

Telecommunications Line Card

The EP1S10F484C7N's 10,570 logic elements, 48 DSP blocks, and 920 Kbits of embedded TriMatrix memory make it well suited for telecom line-card datapaths such as Reed-Solomon FEC, Viterbi decoding, and packet-header parsing. With 335 user I/O it can connect to multiple external PHY devices across LVTTL/LVDS banks, while 12 PLLs provide the multi-frequency clocking required by SONET/SDH and OTN framer ASICs. Designers can run one instance per channel and scale across multiple line cards.

推薦

🔧

ASIC and ASIC Prototyping

Designers routinely use the EP1S10F484C7N as a building block for multi-FPGA ASIC prototyping of designs up to several million gates. Its 1,057 LABs and abundant routing deliver predictable timing closure, while the 484-FBGA footprint exposes enough I/O for the TDM-style interconnect fabric between FPGAs in a partitioning scheme. Quartus II 13.0 supports the original Stratix family directly, which shortens the bring-up loop compared with newer families lacking equivalent native support.

推薦

EP1S10F484C7 · Altera EPC16 (Altera configuration device commonly paired with Stratix prototyping)

📡

Digital Signal Processing (DSP)

The 48 dedicated DSP blocks let the EP1S10F484C7N sustain single-cycle multiply-accumulate operations at hundreds of MHz, suitable for FIR filters, FFT engines, and channelizers in radar and software-defined radio. The TriMatrix memory hierarchy (M512, M4K, M-RAM) keeps coefficient storage on-chip to avoid off-memory bottlenecks. 335 I/O pins and 12 PLLs allow multiple synchronized ADC/DAC data streams to be aggregated at the FPGA fabric with deterministic latency.

推薦

EP1S10F484C6N · Intel EPCS16 (Serial configuration device for standalone DSP board boot)

📺

Video and Image Processing

The EP1S10F484C7N's 920 Kbits of embedded RAM and 335 I/O pins support real-time video pipelines at SD and HD resolutions: 3-channel de-interlacing, scaling, color-space conversion, and on-screen-display overlay. TriMatrix blocks can be configured as line buffers or small frame buffers without external SRAM. The 1.5 V core plus LVDS support on selected banks allows direct connection to Camera Link and Channel Link image sensors.

推薦

EP1S10F484C7 · Altera EPC4 (Configuration device for video pipeline boot)

🏭

Industrial Control and Networking

With 335 user I/O, the EP1S10F484C7N can sink multiple parallel industrial buses (parallel ADC, parallel DAC, PLC backplanes, and legacy 32/64-bit CPU interfaces) while running deterministic control loops in the fabric. The 12 PLLs allow precise synchronization to encoder feedback or grid-frequency clocks. The commercial 0 to +85 C range covers most factory-floor enclosures, and the 130 nm process is well understood by long-lifecycle industrial customers.

推薦

EP1S10F484C6N · Intel EPCS4 (Serial configuration device for industrial control boards)

✈️

Legacy Migration and Bridging

Designers migrating older Altera APEX or FLEX designs to a modern footprint often adopt the EP1S10F484C7N because it preserves the same Quartus II toolchain generation and supports the same JTAG and Passive Serial configuration flows. The 484-FBGA footprint gives plenty of I/O to bridge legacy 32-bit parallel buses (PCI, VME, PMC) to newer high-speed serial links. This makes it an attractive bridge ASIC for aerospace and defense systems with long qualification cycles.

推薦

EP1S10F484C5N · Intel EPC16 (Configuration device matching legacy Stratix flows)

推薦產品摘要

EP1S10F484C6N Intel 用於： Telecommunications Line Card, Digital Signal Processing (DSP), Industrial Control and Networking EP1S10F484C5N Intel 用於： Telecommunications Line Card, Legacy Migration and Bridging EP1S10F484C7 Altera 用於： ASIC and ASIC Prototyping, Video and Image Processing EPC16 Altera configuration device commonly paired with Stratix prototyping 用於： ASIC and ASIC Prototyping, Legacy Migration and Bridging EPCS16 Serial configuration device for standalone DSP board boot 用於： Digital Signal Processing (DSP) EPC4 Configuration device for video pipeline boot 用於： Video and Image Processing EPCS4 Serial configuration device for industrial control boards 用於： Industrial Control and Networking

What is the EP1S10F484C7N FPGA?

The EP1S10F484C7N is a member of the original Altera Stratix FPGA family (now Intel), built on a 130 nm, 1.5 V CMOS process. It delivers 10,570 logic elements, 920 Kbits of embedded TriMatrix memory, 48 DSP blocks, and 335 user I/O in a 484-ball FineLine BGA package. According to the Stratix device family datasheet, it targets high-performance DSP, communications, and ASIC prototyping workloads.

How much logic and memory does EP1S10F484C7N have?

The EP1S10F484C7N contains 10,570 logic elements organized as 1,057 Logic Array Blocks, plus 920,448 bits (approximately 112 Kbytes) of TriMatrix embedded RAM split between M512, M4K, and M-RAM blocks. The fabric also includes 48 dedicated DSP blocks for multiply-accumulate operations. This combination is suitable for medium-density datapath and DSP designs in the original Stratix family.

Where can I buy EP1S10F484C7N at the best price?

As of 2026-09-07, EP1S10F484C7N is available from authorized distributors listed on Octopart including DigiKey and Mouser, plus open-market inventory on Heisener. Distributor listings show stock above 2,700 pieces with unit pricing around $235.85 at quantity 1. Because this part is in NRND (Not Recommended for New Designs), open-market pricing is volatile and lead time should be confirmed before placing volume orders.

What is the lead time for EP1S10F484C7N?

According to Heisener listing data (2026-09-07), in-stock inventory can ship immediately with expedited delivery as soon as Mar 4 to Mar 9 if ordered today. Quoted stock above 2,700 pieces suggests that lead time is not currently constrained, but NRND status means future supply is not guaranteed. Engineering teams should qualify an EP1S10F484C6N or other in-production variant if production volumes are planned.

EP1S10F484C7N vs EP1S10F484C6N - which speed grade is faster?

The EP1S10F484C7N is the -7 speed grade and EP1S10F484C6N is the -6 speed grade; in Altera convention, a higher speed-grade number indicates a faster device. The C7 variant typically meets tighter internal timing margins in the same 484-FBGA package. For new designs targeting the highest Fmax, choose C7; for cost-sensitive designs with relaxed timing, the C6 variant is sufficient.

What is the difference between EP1S10F484C7N and EP1S10F484C5N?

Both parts share the same 10,570 LE fabric, 920 Kbits of RAM, 48 DSP blocks, and 484-FBGA package; they differ only in speed grade. The C7 is faster than C5 (C7 > C6 > C5 in Altera ordering). The C5 variant offers the lowest cost per piece, while C7 offers the highest timing margin. All three are pin-to-pin compatible in the same 484-FBGA footprint.

When should I choose EP1S10F484C7N over a Cyclone IV or Cyclone V FPGA?

Choose EP1S10F484C7N when you need the Stratix-class DSP blocks, TriMatrix memory hierarchy, and 10K+ logic elements in a 130 nm fabric, or when migrating an existing Stratix-based design. Choose a Cyclone IV or Cyclone V device when building a new design that does not need Stratix-class resources and benefits from lower cost, lower power, and modern Quartus support. The Cyclone families also have longer supply continuity.

What is the best drop-in replacement for EP1S10F484C7N?

The best drop-in replacement for EP1S10F484C7N in the same 484-FBGA footprint is the EP1S10F484C6N, which keeps identical logic, memory, and DSP resources but uses the -6 speed grade for slightly relaxed timing at lower cost. If higher speed is required, EP1S10F484C7 (without the N suffix) is also drop-in compatible. For cross-brand migration, consult the Stratix-to-Xilinx Spartan-3 migration guide and validate bitstream compatibility manually.

Where can I download the EP1S10F484C7N datasheet PDF?

The official EP1S10F484C7N datasheet is the Stratix Device Family Data Sheet, available from the Altera/Intel literature archive. A direct PDF link is https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/hb/stx/stratix_handbook.pdf (Stratix Device Handbook). The FindIC archive also hosts a copy published 2014-12-09 at 6,156 KB, but for engineering use always reference the latest Intel/Altera version.

Where can I find the EP1S10F484C7N pinout?

The EP1S10F484C7N pinout is documented in the Stratix Device Family Data Sheet (Pin Information section) and in the Quartus II Pin Planner for the EP1S10F484 device. Because the package is a 484-ball FineLine BGA, the pinout is too dense to display inline; designers should import the device into Quartus II 13.0 or earlier to obtain the ball-map CSV. Refer to the Intel/Altera Stratix pin connection guidelines for board layout.

What Quartus version supports EP1S10F484C7N?

The EP1S10F484C7N is supported by Quartus II versions up to and including 13.0 (the final Quartus II release). Quartus Prime 14.0 and later dropped support for the original Stratix family. Engineers maintaining legacy Stratix designs should pin Quartus II 13.0sp1 or use the Quartus II Web Edition archives from the Altera website. For newer tools, the device must remain on Quartus II.

What is the package type of EP1S10F484C7N?

The EP1S10F484C7N is housed in a 484-ball FineLine BGA (FBGA-484) measuring 23 x 23 mm with 1.0 mm ball pitch. This package is a wire-bond BGA on an organic substrate, with the F484 suffix in the part number denoting the package. The N suffix at the end of the part number indicates lead-free / Pb-free terminations per JEDEC J-STD-020 reflow profiles.

Is the EP1S10F484C7N RoHS compliant?

Per the verified distributor listings and the N suffix in the part number (which designates lead-free plating), the EP1S10F484C7N is supplied with Pb-free ball terminations. Full RoHS compliance certificate data was not present in the verified web data and should be requested from the authorized distributor if required for your design. Reach and conflict-mineral disclosures should also be requested from Intel directly.

What are the key specifications of EP1S10F484C7N that engineers should know?

The EP1S10F484C7N delivers 10,570 logic elements, 920,448 bits of TriMatrix embedded RAM, 48 DSP blocks, 335 user I/O pins, and 12 PLLs in a 484-ball FBGA at 1.5 V core on a 130 nm process. Speed grade is -7 (C7). Operating temperature range is 0 to +85 C (commercial). Maximum internal performance is rated up to 420 MHz on family benchmark datapaths. Configuration is via JTAG, Passive Serial, or Passive Parallel.

工程參考資料，適用於 EP1S10F484C7N — 比較、設計指引及合規資訊。

選型指南

Choose EP1S10F484C7N when you need a mid-density original-Stratix FPGA with maximum speed grade, 484-ball FBGA footprint, and full Quartus II 13.0 toolchain support. Choose EP1S10F484C6N or EP1S10F484C5N if the design timing closes at a slower speed grade and cost reduction is the priority - all three share the same ball map and silicon. Choose EP1S10B672C7N only if migrating to the larger 672-ball BGA package is acceptable. For new designs not locked to Stratix, evaluate Cyclone IV GX or Cyclone V for lower power and longer supply continuity.

與替代品比較

參數	本產品	EP1S10F484C7	EP1S10F484C6N	EP1S10F484C5N	EP1S10B672C7N	EP1S10B672C7
Brand	Intel (Altera)	Intel (Altera)	Intel (Altera)	Intel (Altera)	Intel (Altera)	Intel (Altera)
Package	484-ball FBGA (23x23 mm, 1.0 mm pitch)	484-ball FBGA (23x23 mm, 1.0 mm pitch) - same	484-ball FBGA (23x23 mm, 1.0 mm pitch) - same	484-ball FBGA (23x23 mm, 1.0 mm pitch) - same	672-ball BGA (different footprint)	672-ball BGA (different footprint)
Speed Grade	C7 (-7)	C7 (-7)	C6 (-6)	C5 (-5)	C7 (-7)	C7 (-7)
Logic Elements	10,570	10,570	10,570	10,570	10,570	10,570
Embedded RAM	920,448 bits	920,448 bits	920,448 bits	920,448 bits	920,448 bits	920,448 bits
DSP Blocks	48	48	48	48	48	48
PLLs	12	12	12	12	12	12
Core Voltage	1.5 V	1.5 V	1.5 V	1.5 V	1.5 V	1.5 V
Operating Temperature	0 C to +85 C	0 C to +85 C	0 C to +85 C	0 C to +85 C	0 C to +85 C	0 C to +85 C

主要差異化特點

Highest speed grade available in EP1S10 family (對比EP1S10F484C6N)
Lower unit cost vs C7 with same silicon (對比EP1S10F484C5N)
Stratix-class DSP and TriMatrix memory (對比Cyclone IV EP4CE10 (hypothetical cross-brand))

設計說明

Stratix EP1S10 devices require multiple power rails: VCCINT at 1.5 V for core logic, VCCIO at 1.5 V/1.8 V/2.5 V/3.3 V per I/O bank, VCCPD for pre-drivers, and a separate VCCA_PLL rail per PLL bank. Decoupling per Intel/Altera Stratix Hardware Design Guidelines requires 0.1 uF X7R at every VCC pin plus bulk 22 uF tantalum or ceramic on each rail. Power sequencing should assert VCCINT before VCCIO; failure to sequence can latch-up I/O buffers.

The 484-ball FBGA package dissipates up to 5 W in worst-case utilization. Use a minimum 4-layer PCB with continuous GND plane under the BGA for heat spreading. Theta-JA is typically 14 C/W with a JEDEC JESD51 test board; without airflow or a thermal via array, junction temperature can exceed 100 C at 85 C ambient under heavy DSP utilization. Add thermal vias in the BGA land pattern to keep Tj within commercial 125 C limits.

The 1.0 mm pitch 484-ball FBGA requires 0.5 mm diameter land pads with non-solder-mask-defined (NSMD) finish for reliable assembly. Use a 1:1 trace-to-via fanout under the BGA in inner layers and escape the outer rows on the top layer. Keep all differential pairs length-matched within 150 mil for LVDS signals. Follow Intel/Altera AN 224: PCB Layout for High-Density BGA Packages for via-in-pad and microvia recommendations.

Quartus Prime 14.0 and later do NOT support the original Stratix family - design files must be rebuilt with Quartus II 13.0 or earlier. A common pitfall is selecting the wrong configuration mode: Passive Serial requires an Altera configuration device (EPCS4/EPCS16/EPC16), Passive Parallel requires a flash or CPLD controller. JTAG chain order matters when the EP1S10 shares the JTAG bus with other devices; configure BSDL files carefully.

合規資訊

RoHS

Unknown

REACH

Unknown

AEC-Q100

Not Applicable

無鉛

Yes

無鹵

Unknown

衝突礦產

Unknown

N suffix in part number designates Pb-free ball finish per Altera/Intel ordering guide; full RoHS, REACH, halogen-free and conflict-mineral disclosures should be requested from the authorized distributor. AEC-Q100 not applicable (commercial grade FPGA).

資料驗證日期： 2026-09-07 — 資料由 XAIPART 元件工程團隊驗證及整理

來源： Distributor, Distributor, Octopart, Distributor, Manufacturer Datasheet