EP1S40F780C7N - Stratix FPGA 41,250 LE 780-FBGA | Intel
MPN： EP1S40F780C7N ⚠ 最後購買機會EP1S40F780C7N 概覽
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that allows engineers to implement custom digital logic after manufacturing. FPGAs occupy a unique position in the system hierarchy between fixed-function ASICs (Application-Specific Integrated Circuits) and general-purpose microcontrollers: they offer ASIC-level performance and parallelism for high-throughput datapaths while retaining the flexibility of software-driven reconfiguration. Stratix-family devices specifically target high-performance digital signal processing, communications infrastructure, and parallel processing workloads where logic density and on-chip memory bandwidth dominate the design trade-off. Compared to the older APEX family, Stratix introduced TriMatrix embedded memory and dedicated DSP blocks to accelerate multipliers and FIFOs.
Key features of the EP1S40F780C7N include up to 3,423,744 bits of embedded RAM (TriMatrix memory architecture with three block sizes), 14 DSP blocks for high-speed multiply-accumulate operations, clock management via up to 12 PLLs, support for multiple I/O standards including LVDS, LVPECL, PCI-X, HSTL, and SSTL, and True-LVDS circuitry supporting up to 840 Mbps per channel. The integrated 420 MHz maximum performance rating and lockable phase-shift on each PLL simplify high-speed interface design.
Typical applications include high-speed communications line cards, parallel DSP pipelines such as digital up/down-converters and channelisers, ASIC prototyping, high-end image processing, and parallel data-path coprocessing. The 780-FBGA 29x29 mm, 1.0 mm pitch package offers substantial routing density while remaining compatible with conventional multilayer PCB BGA assembly processes, requiring controlled via-in-pad or microvia construction.
When designing with this Stratix device, plan power sequencing for the 1.5 V core, separate PLL analog supplies, and I/O banks at 1.5/1.8/2.5/3.3 V; use the Stratix PowerPlay early power estimator before layout. For configuration, route JTAG to a header for in-system reprogrammability. Note that the original Altera Cyclone-style vertical migration paths do not exist across Stratix packages - pin-compatible footprint upgrades must stay within the EP1S40F780 family.
This page synthesizes distributor pricing and stock data, drop-in alternative cross-references, and practical design notes not consolidated on the manufacturer datasheet homepage, giving procurement and FPGA design engineers a single-source reference for the EP1S40F780C7N.
直接替換替代品，適用於 EP1S40F780C7N — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP1S40F780C7N （相同外形與佔位） — 差異在於 Package, Operating Temperature, Speed Grade, Series, DSP Blocks.
EP1S40F780C5N
✅ 直接替換📋 參考替代品（不在目錄中）
EP1S40F780C6N
✅ 直接替換📋 參考替代品（不在目錄中）
EP1S40F780C7
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP1S40F780C
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP1S40F780C6
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP1S40F780C7N 最大額定值與電氣特性
| Family | Stratix |
| Logic Elements | 41,250 |
| Embedded Memory (bits) | 3,423,744 |
| Maximum User I/O | 615 |
| Operating Supply Voltage (Core) | 1.5 V |
| Process Technology | 130 nm CMOS |
| Speed Grade | 7 |
| 工作溫度 | 0 C to +85 C (Commercial) |
| 封裝 | 780-BBGA, FC-FBGA, 29 x 29 mm, 1.0 mm pitch |
| 安裝類型 | Surface Mount (BGA) |
| DSP Blocks | 14 |
| Maximum Performance | 420 MHz |
| PLLs | Up to 12 |
| LVDS Data Rate (max) | 840 Mbps per channel |
| Configuration Modes | PS, PPA, PPS, JTAG |
| I/O Standards | LVDS, LVPECL, PCI-X, HSTL, SSTL, LVTTL, LVCMOS |
| TriMatrix Memory | Yes (three block sizes) |
EP1S40F780C7N 780-bbga, fc-fbga, 29 x 29 mm, 1.0 mm pitch 腳位配置指南
EP1S40F780C7N（780-bbga, fc-fbga, 29 x 29 mm, 1.0 mm pitch 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP1S40F780C7N.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP1S40F780C7N 適用於 6 應用s: High-Speed Communications Line Cards, Parallel DSP Pipelines, ASIC Prototyping Platform, High-End Image and Video Processing, Industrial Test and Measurement, Storage and Datacenter Coprocessors.
High-Speed Communications Line Cards
The EP1S40F780C7N's 41,250 logic elements, 3,423,744 bits of TriMatrix embedded memory, and 615 user I/Os make it well suited to telecommunications line cards running multiple SERDES-backed links and packet-processing pipelines. Its LVDS capability up to 840 Mbps per channel and 12 PLLs provide ample clocking flexibility for backplane and front-panel serializer/deserializer functions. The 1.5 V core on a 130 nm CMOS process delivers the timing margin needed for STS-12/STM-4 fabric and OC-48 class forwarding engines. BGA signal-integrity design with controlled-impedance traces and matched-length matching is required to sustain the full data rate.
推薦
Parallel DSP Pipelines
With 14 dedicated DSP blocks rated for 420 MHz performance and TriMatrix memory providing fast block-RAM access, the EP1S40F780C7N is an excellent fit for parallel DSP workloads such as digital up- and down-converters, channelisers for software-defined radio, and beamformers for phased-array radar. Each DSP block can implement 8-bit by 8-bit or smaller multipliers and 9-bit accumulators, freeing logic elements for control-plane logic. The combination of distributed and block RAM at 3.4 Mbits supports deep coefficient tables for FIR filters and FFT twiddle factors. Designers can pair it with high-speed ADCs and DACs for direct-IF sampling architectures.
推薦
ASIC Prototyping Platform
The EP1S40F780C7N provides 41,250 logic elements - sufficient for partitioning and validating mid-complexity ASIC RTL blocks before tapeout. Its deterministic timing model and Quartus II compilation flow let engineers slice a multi-million-gate ASIC across multiple Stratix FPGAs, with LVDS forming high-speed chip-to-chip bridges between partitions. TriMatrix memory blocks emulate ASIC SRAM macros and register files with matching byte-write enables. JTAG-based configuration enables rapid bring-up and incremental compilation. Use a Stratix-based prototyping platform to validate firmware weeks before silicon is back from the fab.
推薦
High-End Image and Video Processing
Video pipelines at SDI, Camera Link, or DVI/HDMI resolutions benefit from the EP1S40F780C7N's 615 user I/Os for parallel video buses and its 3,423,744 bits of RAM for line buffers and frame-store FIFOs. The 14 DSP blocks accelerate 2-D convolution, motion estimation, and color-space conversion operations in real time. Color subsampling, scaling, and deinterlacing can be implemented entirely in fabric with deterministic latency suitable for broadcast environments. The 780-BGA package supports the high pin-count needed to capture 48-bit parallel video plus auxiliary metadata lanes simultaneously.
推薦
Industrial Test and Measurement
Automated test equipment, protocol analyzers, and logic-analyzer front-end designs leverage the EP1S40F780C7N's parallel logic, generous user I/O count, and 12 PLLs to manage multiple synchronous sampling domains. TriMatrix memory captures deep waveform traces for offline analysis while DSP blocks perform real-time FFT, statistics, and pattern recognition. The commercial 0 C to +85 C operating range covers most lab and factory environments. Pairing it with high-speed comparators and ADCs yields a flexible multi-channel measurement front end.
推薦
Storage and Datacenter Coprocessors
The EP1S40F780C7N can act as a hardware-accelerated RAID engine, encryption preprocessor, or compression co-processor in storage subsystems. Its TriMatrix memory provides low-latency buffer space for sector reassembly and AES S-boxes while the DSP blocks handle Reed-Solomon or LDPC coding. LVDS links up to 840 Mbps aggregate directly to SAS/SATA expander chips or inter-FPGA bridges in clustered storage arrays. With 615 I/Os the device can manage many disk channels in parallel while maintaining deterministic throughput under bursty IO patterns.
推薦
推薦產品摘要
工程參考資料，適用於 EP1S40F780C7N — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP1S40F780C5N | EP1S40F780C6N | EP1S40F780C7 | EP1S40F780C | EP1S40F780C6 |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 780-BBGA, FC-FBGA, 29x29 mm, 1.0 mm pitch | 780-BBGA, FC-FBGA, 29x29 mm - same | 780-BBGA, FC-FBGA, 29x29 mm - same | 780-BBGA, FC-FBGA, 29x29 mm - same | 780-BBGA, FC-FBGA, 29x29 mm - same | 780-BBGA, FC-FBGA, 29x29 mm - same |
| Logic Elements | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 |
| Embedded Memory (bits) | 3,423,744 | 3,423,744 | 3,423,744 | 3,423,744 | 3,423,744 | 3,423,744 |
| Maximum User I/O | 615 | 615 | 615 | 615 | 615 | 615 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Operating Temperature | 0 C to +85 C (Commercial) | 0 C to +85 C | 0 C to +85 C | 0 C to +85 C | 0 C to +85 C | 0 C to +85 C |
主要差異化特點
- Higher timing margin at the same density tier (對比EP1S40F780C5N)
- Pb-free tray packaging (對比EP1S40F780C7 (without N suffix))
- Faster speed grade than C6 family variants (對比EP1S40F780C6N)
設計說明
The Stratix EP1S40F780C7N requires four supply rails: VCCINT (1.5 V core), VCCIO (per-bank, 1.5/1.8/2.5/3.3 V), VCC_PLL (1.5 V analog PLL), and VCCPD (pre-driver, 3.3 V). Use low-ESR decoupling with at least 10 x 0.1 uF + 4 x 10 uF ceramic per rail plus a bulk tantalum or polymer cap of 220 uF minimum. Power-on reset requires VCCINT to ramp monotonically before VCCPD; Altera recommends power sequencing to avoid JTAG instability. Run the Stratix PowerPlay early power estimator before layout to size regulators and PCB copper.
The 780-BGA 29 x 29 mm 1.0 mm pitch package requires microvia or via-in-pad PCB construction for reliable breakout. Use a 6-layer stack-up with dedicated ground and power planes adjacent to the BGA. Maintain 50 ohm single-ended and 100 ohm differential trace impedance for LVDS pairs; match LVDS trace lengths within 50 mil for the 840 Mbps data rate. Place decoupling capacitors on the bottom side of the PCB directly under the BGA footprint, using short fan-out stubs.
Common pitfalls when designing with EP1S40F780C7N: (1) confusing the EP1S40F780 (780-BGA) and EP1S40F1020 (1020-BGA) packages - they are not pin-compatible, vertical migration is not supported; (2) using Quartus II 6.x or later without ensuring the legacy EP1S40 device support is installed; (3) leaving unused LVDS pairs floating instead of tying them to a defined logic level; (4) ignoring the I/O bank VCCIO constraints when mixing 3.3 V LVTTL with 1.5 V HSTL on the same device; (5) omitting the configuration EPROM or relying solely on JTAG for production programming.
合規資訊
Pb-free / RoHS-compliant per the 'N' suffix designation. AEC-Q100 not applicable for this FPGA. Halogen-free and conflict-mineral status not explicitly stated in the verified data - flagged as unknown.
