EP1S40F780C7N - Stratix FPGA 41,250 LE 780-FBGA | Intel
MPN: EP1S40F780C7N ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $165 | $1,650.00 |
| 100 | $140 | $14,000.00 |
| 500 | $118 | $59,000.00 |
| 1,000 | $99.5 | $99,500.00 |
Drop-in alternatives for EP1S40F780C7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1S40F780C5N
✅ Drop-In📋 Reference alternative (not in catalog)
EP1S40F780C6N
✅ Drop-In📋 Reference alternative (not in catalog)
EP1S40F780C7
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View Datasheet →EP1S40F780C
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View Datasheet →EP1S40F780C6
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View Datasheet →EP1S40F780C7N Maximum Ratings & Electrical Characteristics
| Family | Stratix |
| Logic Elements | 41,250 |
| Embedded Memory (bits) | 3,423,744 |
| Maximum User I/O | 615 |
| Operating Supply Voltage (Core) | 1.5 V |
| Process Technology | 130 nm CMOS |
| Speed Grade | 7 |
| Operating Temperature | 0 C to +85 C (Commercial) |
| Package | 780-BBGA, FC-FBGA, 29 x 29 mm, 1.0 mm pitch |
| Mounting Type | Surface Mount (BGA) |
| DSP Blocks | 14 |
| Maximum Performance | 420 MHz |
| PLLs | Up to 12 |
| LVDS Data Rate (max) | 840 Mbps per channel |
| Configuration Modes | PS, PPA, PPS, JTAG |
| I/O Standards | LVDS, LVPECL, PCI-X, HSTL, SSTL, LVTTL, LVCMOS |
| TriMatrix Memory | Yes (three block sizes) |
EP1S40F780C7N 780-bbga, fc-fbga, 29 x 29 mm, 1.0 mm pitch Pin Configuration Guide
Complete pinout information for EP1S40F780C7N (780-bbga, fc-fbga, 29 x 29 mm, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1S40F780C7N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1S40F780C7N is suitable for 6 applications: High-Speed Communications Line Cards, Parallel DSP Pipelines, ASIC Prototyping Platform, High-End Image and Video Processing, Industrial Test and Measurement, Storage and Datacenter Coprocessors.
High-Speed Communications Line Cards
The EP1S40F780C7N's 41,250 logic elements, 3,423,744 bits of TriMatrix embedded memory, and 615 user I/Os make it well suited to telecommunications line cards running multiple SERDES-backed links and packet-processing pipelines. Its LVDS capability up to 840 Mbps per channel and 12 PLLs provide ample clocking flexibility for backplane and front-panel serializer/deserializer functions. The 1.5 V core on a 130 nm CMOS process delivers the timing margin needed for STS-12/STM-4 fabric and OC-48 class forwarding engines. BGA signal-integrity design with controlled-impedance traces and matched-length matching is required to sustain the full data rate.
Recommended
Parallel DSP Pipelines
With 14 dedicated DSP blocks rated for 420 MHz performance and TriMatrix memory providing fast block-RAM access, the EP1S40F780C7N is an excellent fit for parallel DSP workloads such as digital up- and down-converters, channelisers for software-defined radio, and beamformers for phased-array radar. Each DSP block can implement 8-bit by 8-bit or smaller multipliers and 9-bit accumulators, freeing logic elements for control-plane logic. The combination of distributed and block RAM at 3.4 Mbits supports deep coefficient tables for FIR filters and FFT twiddle factors. Designers can pair it with high-speed ADCs and DACs for direct-IF sampling architectures.
Recommended
ASIC Prototyping Platform
The EP1S40F780C7N provides 41,250 logic elements - sufficient for partitioning and validating mid-complexity ASIC RTL blocks before tapeout. Its deterministic timing model and Quartus II compilation flow let engineers slice a multi-million-gate ASIC across multiple Stratix FPGAs, with LVDS forming high-speed chip-to-chip bridges between partitions. TriMatrix memory blocks emulate ASIC SRAM macros and register files with matching byte-write enables. JTAG-based configuration enables rapid bring-up and incremental compilation. Use a Stratix-based prototyping platform to validate firmware weeks before silicon is back from the fab.
Recommended
High-End Image and Video Processing
Video pipelines at SDI, Camera Link, or DVI/HDMI resolutions benefit from the EP1S40F780C7N's 615 user I/Os for parallel video buses and its 3,423,744 bits of RAM for line buffers and frame-store FIFOs. The 14 DSP blocks accelerate 2-D convolution, motion estimation, and color-space conversion operations in real time. Color subsampling, scaling, and deinterlacing can be implemented entirely in fabric with deterministic latency suitable for broadcast environments. The 780-BGA package supports the high pin-count needed to capture 48-bit parallel video plus auxiliary metadata lanes simultaneously.
Recommended
Industrial Test and Measurement
Automated test equipment, protocol analyzers, and logic-analyzer front-end designs leverage the EP1S40F780C7N's parallel logic, generous user I/O count, and 12 PLLs to manage multiple synchronous sampling domains. TriMatrix memory captures deep waveform traces for offline analysis while DSP blocks perform real-time FFT, statistics, and pattern recognition. The commercial 0 C to +85 C operating range covers most lab and factory environments. Pairing it with high-speed comparators and ADCs yields a flexible multi-channel measurement front end.
Recommended
Storage and Datacenter Coprocessors
The EP1S40F780C7N can act as a hardware-accelerated RAID engine, encryption preprocessor, or compression co-processor in storage subsystems. Its TriMatrix memory provides low-latency buffer space for sector reassembly and AES S-boxes while the DSP blocks handle Reed-Solomon or LDPC coding. LVDS links up to 840 Mbps aggregate directly to SAS/SATA expander chips or inter-FPGA bridges in clustered storage arrays. With 615 I/Os the device can manage many disk channels in parallel while maintaining deterministic throughput under bursty IO patterns.
Recommended
Recommended Products Summary
Engineering reference data for EP1S40F780C7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S40F780C5N | EP1S40F780C6N | EP1S40F780C7 | EP1S40F780C | EP1S40F780C6 |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 780-BBGA, FC-FBGA, 29x29 mm, 1.0 mm pitch | 780-BBGA, FC-FBGA, 29x29 mm - same | 780-BBGA, FC-FBGA, 29x29 mm - same | 780-BBGA, FC-FBGA, 29x29 mm - same | 780-BBGA, FC-FBGA, 29x29 mm - same | 780-BBGA, FC-FBGA, 29x29 mm - same |
| Speed Grade | 7 | 5 (slower) | 6 (slightly slower) | 7 (same) | [DATA_NEEDED: speed grade unspecified] | 6 (slightly slower) |
| Logic Elements | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 |
| Embedded Memory (bits) | 3,423,744 | 3,423,744 | 3,423,744 | 3,423,744 | 3,423,744 | 3,423,744 |
| Maximum User I/O | 615 | 615 | 615 | 615 | 615 | 615 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Operating Temperature | 0 C to +85 C (Commercial) | 0 C to +85 C | 0 C to +85 C | 0 C to +85 C | 0 C to +85 C | 0 C to +85 C |
Key Differentiators
- Higher timing margin at the same density tier (vs EP1S40F780C5N)
- Pb-free tray packaging (vs EP1S40F780C7 (without N suffix))
- Faster speed grade than C6 family variants (vs EP1S40F780C6N)
Design Notes
The Stratix EP1S40F780C7N requires four supply rails: VCCINT (1.5 V core), VCCIO (per-bank, 1.5/1.8/2.5/3.3 V), VCC_PLL (1.5 V analog PLL), and VCCPD (pre-driver, 3.3 V). Use low-ESR decoupling with at least 10 x 0.1 uF + 4 x 10 uF ceramic per rail plus a bulk tantalum or polymer cap of 220 uF minimum. Power-on reset requires VCCINT to ramp monotonically before VCCPD; Altera recommends power sequencing to avoid JTAG instability. Run the Stratix PowerPlay early power estimator before layout to size regulators and PCB copper.
The 780-BGA 29 x 29 mm 1.0 mm pitch package requires microvia or via-in-pad PCB construction for reliable breakout. Use a 6-layer stack-up with dedicated ground and power planes adjacent to the BGA. Maintain 50 ohm single-ended and 100 ohm differential trace impedance for LVDS pairs; match LVDS trace lengths within 50 mil for the 840 Mbps data rate. Place decoupling capacitors on the bottom side of the PCB directly under the BGA footprint, using short fan-out stubs.
Common pitfalls when designing with EP1S40F780C7N: (1) confusing the EP1S40F780 (780-BGA) and EP1S40F1020 (1020-BGA) packages - they are not pin-compatible, vertical migration is not supported; (2) using Quartus II 6.x or later without ensuring the legacy EP1S40 device support is installed; (3) leaving unused LVDS pairs floating instead of tying them to a defined logic level; (4) ignoring the I/O bank VCCIO constraints when mixing 3.3 V LVTTL with 1.5 V HSTL on the same device; (5) omitting the configuration EPROM or relying solely on JTAG for production programming.
Compliance Information
Pb-free / RoHS-compliant per the 'N' suffix designation. AEC-Q100 not applicable for this FPGA. Halogen-free and conflict-mineral status not explicitly stated in the verified data - flagged as unknown.
