EP1SGX10CF672C6 - Stratix GX FPGA, 10K LEs, 672-FBGA | Intel
MPN： EP1SGX10CF672C6 ✗ 停產EP1SGX10CF672C6 概覽
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs/LABs), programmable interconnects, and dedicated I/O and memory resources that can be re-programmed to implement virtually any digital logic function. Stratix GX devices in particular are positioned for high-bandwidth serial connectivity, sitting within the broader hierarchy of programmable logic devices (PLD) and bridging toward ASIC-class performance in communication infrastructure.
Key features of the EP1SGX10CF672C6 include up to 20 full-duplex transceiver channels supporting 840 Mbps to 3.125 Gbps, embedded multiplier blocks for DSP, 16 global clock networks, and a typical core frequency performance class suitable for parallel and serial datapath co-processing. The 'C6' speed grade combined with the commercial 0°C to 85°C temperature rating balances timing margin and operating range for non-automotive applications.
Architecturally, the device combines a Lookup-Table (LUT)-based logic fabric with embedded transceiver circuitry, on-chip TriMatrix memory, and PLL-based clock management. The 672-pin FBGA package provides ample I/O for parallel interfaces while supporting the high-speed differential serial channels required in backplane and chip-to-chip links.
Typical applications include telecom line cards, baseband and protocol bridging hardware, broadcast video processing, high-speed serial interface bridging (XAUI, Serial RapidIO, PCI Express endpoint bridging), and ASIC prototyping. When designing with this part, pay close attention to transceiver reference clock jitter, decoupling on the 1.5 V core rail, and PCB signal-integrity routing for the high-speed serial lanes. This page synthesizes distributor pricing, drop-in alternatives, and engineering guidance not found on a typical distributor listing.
直接替換替代品，適用於 EP1SGX10CF672C6 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP1SGX10CF672C6 （相同外形與佔位） — 差異在於 Package, Family, Operating Temperature, RoHS Status, Series.
EP1S25F672C6
✅ 直接替換聯絡詢價
查看資料表 →EP1S20F672C6
✅ 直接替換聯絡詢價
查看資料表 →EP1S10F672C6
✅ 直接替換聯絡詢價
查看資料表 →EP1S10F672C7
✅ 直接替換聯絡詢價
查看資料表 →EP1SGX10CF672C6 最大額定值與電氣特性
| Family | Stratix GX |
| Logic Elements | 10,570 |
| Logic Array Blocks (LABs) | 1,057 |
| User I/Os | 362 |
| Total Memory Bits | 920,448 |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage | 1.5 V |
| 封裝 | 672-FBGA (FineLine BGA) |
| Package Dimensions | 33 mm x 33 mm, 1 mm pitch |
| 工作溫度 | 0°C to +85°C (Commercial) |
| Speed Grade | C6 |
| 安裝類型 | Surface Mount |
| Logic Family | CMOS |
EP1SGX10CF672C6 33 mm x 33 mm, 1 mm pitch 腳位配置指南
EP1SGX10CF672C6（33 mm x 33 mm, 1 mm pitch 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP1SGX10CF672C6.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP1SGX10CF672C6 適用於 6 應用s: Telecom Line Card Interface Bridging, Baseband Signal Processing and DSP Co-Processing, Broadcast Video Processing and Routing, High-Speed Serial Interface Bridging (XAUI / Serial RapidIO), ASIC Prototyping and Emulation, Industrial Control and Test Instrumentation.
Telecom Line Card Interface Bridging
The EP1SGX10CF672C6's integrated multi-gigabit serial transceivers and 362 user I/Os make it well-suited for telecom line cards that bridge between backplane serial links (such as SPI-4.2 or proprietary LVDS buses) and external SERDES lanes. Its 10K logic elements provide the datapath width needed for packet processing glue logic, while the 672-FBGA package supports dense parallel buses. Designers typically instantiate MAC layers, framer blocks, and rate-matching FIFOs in the fabric, with the hard transceivers handling the physical layer at 1-3 Gbps line rates.
推薦
Baseband Signal Processing and DSP Co-Processing
The Stratix GX fabric includes dedicated embedded multiplier blocks suitable for FFT and channelization co-processing in baseband units. With 10,570 LEs and 920 Kbits of on-chip memory, the EP1SGX10CF672C6 can host multi-channel filter banks, correlators, and channel estimators offloading the host DSP. The 1.5 V core enables low power per MAC, while the serial transceivers move digitized IF samples between boards at multi-gigabit rates.
推薦
Broadcast Video Processing and Routing
Broadcast video routers and format converters benefit from the EP1SGX10CF672C6's combination of high I/O count and embedded memory bandwidth. The device can perform SDI-to-HDMI bridging, color-space conversion, and frame-rate conversion while the parallel I/O banks handle uncompressed video buses. Its 362 user I/Os accommodate multiple SDI streams plus ancillary data and control interfaces within a single chip.
推薦
High-Speed Serial Interface Bridging (XAUI / Serial RapidIO)
With multiple 3.125 Gbps-capable transceivers, the EP1SGX10CF672C6 can bridge between ASIC-class devices using XAUI, Serial RapidIO, or proprietary serial protocols. The 672-FBGA ball map routes four differential transceiver channels plus the reference clock infrastructure needed for backplane-class link training, with the FPGA fabric implementing 8b/10b encoding, clock compensation, and link-layer state machines.
推薦
ASIC Prototyping and Emulation
The 10K logic elements and high I/O count make the EP1SGX10CF672C6 a usable prototyping vehicle for mid-complexity ASIC designs, especially those with serial I/O. Designers map ASIC blocks into the Stratix fabric and use the transceivers to emulate the production ASIC's SERDES interface, validating protocol behavior and timing before tape-out. Multi-FPGA partitioning can be supported by stacking multiple EP1SGX10CF672C6 or higher-density EP1S25F672C6 devices.
推薦
Industrial Control and Test Instrumentation
The EP1SGX10CF672C6's commercial 0-85°C range, generous I/O, and on-chip memory suit industrial test and measurement platforms such as protocol analyzers, ATE interface cards, and high-speed data recorders. The serial transceivers stream digitized samples to host processors, while the fabric implements stimulus generation, response comparison, and result aggregation. The 672-FBGA package provides mechanical robustness for vibration-prone test environments.
推薦
推薦產品摘要
工程參考資料，適用於 EP1SGX10CF672C6 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP1S25F672C6 | EP1S20F672C6 | EP1S10F672C6 | EP1S10F672C7 |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Package | 672-FBGA | 672-FBGA | 672-FBGA | 672-FBGA | 672-FBGA |
| Logic Elements | 10,570 | ~25,660 | ~20,000 | ~10,570 | ~10,570 |
| Speed Grade | C6 | C6 | C6 | C6 | C7 (faster) |
| Operating Temperature | 0°C to +85°C (Commercial) | 0°C to +85°C | 0°C to +85°C | 0°C to +85°C | 0°C to +85°C |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND |
主要差異化特點
- Pin-compatible density upgrade path within same 672-FBGA (對比EP1S10F672C6)
- Higher logic density in same footprint (對比EP1S25F672C6)
- Faster timing closure in same footprint (對比EP1S10F672C7)
- Family consistency with Quartus tool flow (對比Xilinx Virtex-II Pro XC2VP7)
設計說明
Estimated: at full utilization of 10K logic elements toggling at ~200 MHz with all 20 transceivers active at 3.125 Gbps, the EP1SGX10CF672C6 core power consumption can reach 8-12 W on the 1.5 V rail. Designers should allocate dedicated switching regulator headroom and follow Altera's reference decoupling network, including bulk capacitors on each supply pin group and a pi-filter on the analog transceiver supply. Power sequencing must follow Intel's documented order (core before I/O) to avoid latch-up damage during configuration.
The high-speed serial transceiver channels on the EP1SGX10CF672C6 require controlled-impedance differential routing (typically 100 ohm differential) with matched lengths within a transceiver group. The reference clock input must be routed with controlled impedance and isolated from noisy digital traces. Use the Altera/Intel Quartus pin planner to assign transceiver channels and the Transceiver Toolkit to validate signal integrity at the intended line rate.
The 672-FBGA package at 1 mm ball pitch requires multilayer PCB construction with microvia or via-in-pad technology for reliable BGA assembly. Power and ground planes should be placed on inner layers adjacent to the BGA escape traces. Provide a minimum 4-layer stack-up with continuous ground plane beneath the device for transceiver return-current integrity; 6-10 layer stack-ups are typical for production designs.
Estimated: at 10 W dissipation in the 672-FBGA (theta_JA approximately 15-20 C/W with adequate PCB thermal vias), junction temperature rises 150-200 C above ambient. The commercial 85°C operating ceiling leaves limited thermal headroom; designers must include thermal vias under the package center pad and connect them to internal ground/power planes. For enclosed chassis, active cooling may be necessary when all transceivers are active.
Do not exceed the maximum I/O voltage of 3.3 V on user I/O banks; mixing 5 V tolerant signals requires level-shifters. Configuration mode (AS, PS, JTAG) must be selected correctly via MSEL pins before power-up. The JTAG chain order matters in multi-device configurations - consult the Stratix GX configuration handbook to avoid configuration failures. As of 2026-09-07, the part is NRND so confirm long-term availability before committing to new designs.
合規資訊
Lifecycle status NRND per distributor data as of 2026-09-07. RoHS/REACH/lead-free status not confirmed in the provided web data - consult Intel's product compliance documentation for definitive certification. Not AEC-Q100 qualified - not intended for automotive applications.
