EP1S10F672C6 - 10K LE Stratix FPGA 672-BGA | Intel (Altera)
MPN: EP1S10F672C6 ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $95 | $95.00 |
| 10 | $88.5 | $885.00 |
| 100 | $82 | $8,200.00 |
| 500 | $76.5 | $38,250.00 |
| 1,000 | $72 | $72,000.00 |
Drop-in alternatives for EP1S10F672C6 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1S10F672C6N
✅ Drop-In📋 Reference alternative (not in catalog)
EP1S10B672C6
✅ Drop-In✓ In Stock
$185 / Unit
View Datasheet →EP1S10F672C7
✅ Drop-In✓ In Stock
$158 / Unit
View Datasheet →EP1S10B672C7
✅ Drop-In✓ In Stock
$140 / Unit
View Datasheet →EP1S10F672C7N
✅ Drop-In✓ In Stock
$171 / Unit
View Datasheet →EP1S10F672I6
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EP1S10F672C6 Maximum Ratings & Electrical Characteristics
| Series | Stratix® I |
| Family | Stratix FPGA |
| Logic Elements (LE) | 10,570 |
| Logic Array Blocks (LABs) | 1057 |
| Total Memory Bits | 920,448 bits |
| Embedded Memory | TriMatrix (MRAM/M4K) |
| DSP Blocks | 6 |
| Number of I/Os | 345 |
| Number of PLLs | 12 (6 per device side) |
| Core Voltage | 1.5 V |
| Process Technology | 130 nm CMOS |
| Package | 672-ball FineLine BGA (FBGA) |
| Operating Temperature | 0C to +85C (Commercial) |
| Maximum Core Frequency | 420.17 MHz |
| Configuration Modes | Passive Serial (PS), Fast Passive Parallel (FPP), Active Serial (AS) |
| JTAG Support | IEEE 1149.1 boundary-scan |
| Mounting Type | Surface Mount (BGA) |
EP1S10F672C6 672-ball fineline bga (fbga) Pin Configuration Guide
Complete pinout information for EP1S10F672C6 (672-ball fineline bga (fbga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1S10F672C6.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1S10F672C6 is suitable for 6 applications: Digital Signal Processing, Telecommunications Infrastructure, ASIC Prototyping, High-Speed Data Acquisition, Embedded Control Platforms, Legacy System Sustainment.
Digital Signal Processing
The EP1S10F672C6 is well suited to mid-density DSP applications such as real-time FIR/IIR filtering, FFT engines, and software-defined radio baseband processing. Its 6 embedded DSP blocks deliver hardware multiplier-accumulator throughput that competes with dedicated DSP processors, while 10,570 LEs and 920 Kbits of TriMatrix memory absorb the surrounding control and buffering logic. The 1.5 V Stratix I architecture supports sustained sample rates into the hundreds of MHz when designs target the device's 420 MHz core limit. Place DSP cores in the dedicated DSP blocks (versus soft logic) to maximize throughput; the 12 PLLs route phase-aligned clocks to these blocks for multi-channel synchronization.
Recommended
Telecommunications Infrastructure
In telecom line-card and backhaul designs, the EP1S10F672C6 serves as a multi-protocol bridge, framer, or packet processor in space-constrained 672-FBGA footprints. Its 345 user I/Os support parallel LVTTL/SSTL interfaces to external PHY devices, network processors, and SRAM banks, while 920 Kbits of embedded memory handle protocol headers and queue descriptors without external SRAM. The commercial temperature grade suits indoor equipment racks. Designers typically pair the Stratix I device with external PHY transceivers; use the dedicated PLLs to generate per-port clocks and the JTAG interface for in-system firmware updates via the Altera Quartus toolchain.
Recommended
ASIC Prototyping
Engineers commonly use the EP1S10F672C6 as an ASIC prototyping vehicle for designs targeting 5K-15K gate ASICs, because its 10,570 logic elements map most small-to-mid ASICs with timing fidelity better than CPLDs. The 672-ball FBGA provides sufficient I/O density to mirror peripheral ASIC pinouts, while the Quartus synthesis flow supports ASIC-style Verilog/VHDL entry with timing constraints. Designers map ASIC clock domains onto the 12 PLLs to validate metastability, reset distribution, and asynchronous boundary crossings before committing to silicon. The commercial 0C-85C rating is acceptable for lab validation; for full-speed validation across temperature, the EP1S10F672I6 industrial variant is recommended.
Recommended
High-Speed Data Acquisition
The EP1S10F672C6 supports high-speed ADC/DAC interface logic, channel multiplexing, and on-chip FIFO buffering for data acquisition systems sampling in the 100-400 MSPS range. Its 345 user I/Os route LVDS/LVTTL data from external ADCs into the FPGA fabric, where 920 Kbits of TriMatrix memory provides buffer space before transferring to external SDRAM via the parallel I/O banks. The 6 DSP blocks enable on-chip decimation filtering, reducing downstream processor load. Place FIFO buffers in M-RAM blocks (large 32 Kbit banks) and use the dedicated PLLs to generate precise ADC sampling clocks with sub-100 ps jitter.
Recommended
Embedded Control Platforms
In embedded industrial controllers, the EP1S10F672C6 implements custom glue logic, motor control loops, and HMI drivers on a single FPGA, replacing discrete microcontrollers plus logic ICs. Its 12 PLLs generate the multiple clock domains typical of motor control systems (PWM, encoder sampling, communications), while the 345 I/Os drive incremental encoder inputs, HMI displays, and fieldbus transceivers. The 1.5 V core and 130 nm process yield robust transient immunity for industrial environments. Designers use the soft-core Nios II embedded processor in Quartus to integrate control tasks directly in the FPGA fabric, eliminating external MCUs.
Recommended
Legacy System Sustainment
Many defense, aerospace, medical, and industrial OEMs still maintain deployed systems built around the EP1S10F672C6 because the design is in-service and validated. For sustainment programs, the EP1S10F672C6N (lead-free) and EP1S10B672C6 (B-suffix lead-free) are the primary drop-in replacement options. As Intel winds down last-time-buy inventory, OEMs may also consider migration to EP1S10F672C7 or EP1S10F672C7N (speed grade 7) parts that share the 672-FBGA footprint but offer slightly slower timing margins. Verify timing closure before substituting speed-grade variants, and lock supply chain sources early to manage last-time-buy pricing.
Recommended
Recommended Products Summary
Engineering reference data for EP1S10F672C6 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S10F672C6N | EP1S10B672C6 | EP1S10F672C7 | EP1S10B672C7 | EP1S10F672C7N | EP1S10F672I6 |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 672-FBGA | 672-FBGA - same | 672-FBGA - same | 672-FBGA - same | 672-FBGA - same | 672-FBGA - same | 672-FBGA - same |
| Logic Elements | 10,570 | 10,570 | 10,570 | 10,570 | 10,570 | 10,570 | 10,570 |
| Embedded Memory (Kbits) | 920 | 920 | 920 | 920 | 920 | 920 | 920 |
| DSP Blocks | 6 | 6 | 6 | 6 | 6 | 6 | 6 |
| User I/Os | 345 | 345 | 345 | 345 | 345 | 345 | 345 |
| Speed Grade | 6 | 6 | 6 | 7 | 7 | 7 | 6 |
| Temperature Grade | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Industrial -40C to +100C |
| Lead-Free / RoHS | [DATA_NEEDED] | Yes (N suffix) | Yes (B suffix) | [DATA_NEEDED] | Yes (B suffix) | Yes (N suffix) | [DATA_NEEDED] |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
Key Differentiators
- Industry-proven Stratix I architecture with mature Quartus toolchain (vs EP1S10F672C6N)
- Pin-compatible speed grade variants allow timing-margin trade-offs (vs EP1S10F672C7)
- Industrial-temperature equivalent for harsh-environment drop-in (vs EP1S10F672I6)
Design Notes
The EP1S10F672C6 requires multiple supply rails: VCCINT (1.5 V core), VCCIO (1.5 V/1.8 V/2.5 V/3.3 V per bank), VCCPD (configuration-related supply), and VREF for SSTL/HSTL I/O standards. Per Stratix I Handbook recommendations, place at least one 100 uF bulk + 10 x 0.1 uF ceramic decoupling capacitors distributed around the 672-FBGA perimeter, with one 0.1 uF + 10 uF pair per VCCIO bank. Estimated core current at 420 MHz with full logic utilization can exceed 1 A; size the VCCINT regulator with 30% headroom.
The 672-ball FineLine BGA requires a multilayer PCB with microvia stack-ups for breakout routing. Use a 1.0 mm pitch BGA land pattern matching the Altera reference footprint. Power and ground planes should occupy entire PCB layers with no signal traces crossing them. Place configuration devices (EPCS or compatible serial flash) within 6 inches of MSEL[2:0] and DATA0/DATA1/DCLK/nCONFIG/nSTATUS pins. Differential clock pairs (CLK0/CLK1) require 100 ohm differential routing with length matching to within 50 mil.
Common pitfalls when using the EP1S10F672C6: (1) misconfiguring MSEL[2:0] pins for the wrong configuration scheme - they select AS, PS, FPP, or JTAG-only modes; (2) leaving VCCPD unpowered during configuration, which prevents the device from entering user mode; (3) using unsupported I/O standards in a given bank - check bank-VCCIO compatibility before assigning pins; (4) ignoring the configuration CRC check at startup - configure the device to enable CRC error detection so corrupted bitstreams are detected reliably.
Estimated: at 100% logic utilization and 420 MHz clock, the EP1S10F672C6 dissipates approximately 1.5-2 W. The 672-FBGA package's exposed-pad underside provides primary thermal relief via thermal vias to inner PCB ground planes. For sustained high-utilization operation in enclosed chassis, route at least 4 thermal vias per thermal pad ball, and consider an attached heatsink for >85C ambient environments. Industrial-grade EP1S10F672I6 variant is recommended for -40C to +100C ambient operation.
Compliance Information
RoHS status of EP1S10F672C6 was not specified in the verified web data; lead-free variants (C6N, B672C6) are explicitly lead-free. AEC-Q100 not applicable for FPGAs. For automotive applications, verify compliance with manufacturer documentation.
