EP1SGX10DF672C5N - Stratix GX FPGA, 10,570 Cells, 672-BGA | Intel
MPN： EP1SGX10DF672C5N ⚠ 最後購買機會EP1SGX10DF672C5N 概覽
A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs/LABs), programmable routing, and embedded memory/DSP slices that can be re-wired by the customer after manufacturing. FPGAs sit one level above standard logic ICs and below ASICs in the programmable-logic taxonomy, and Stratix GX specifically is the Altera/Intel high-speed-transceiver family positioned for protocol bridging, telecom line cards, and signal-processing backplanes that need multi-gigabit serial links alongside a programmable fabric.
Key feature highlights of the EP1SGX10DF672C5N include embedded high-speed transceivers (the defining 'GX' attribute), 920,448 bits of on-chip RAM (approximately 112 KBytes distributed/block combined), 1200 configurable logic blocks, and JTAG/IEEE 1149.1 boundary-scan support. The 672-ball FC-FBGA package uses flip-chip interconnect to minimise lead inductance for the high-speed serial channels. Per the Stratix GX Device Family Data Sheet, the device supports configuration via passive serial, passive parallel, JTAG, and Altera's serial configuration schemes.
Typical applications for this device include 1 Gbps to 3.125 Gbps serial-link bridges, telecom backplane multiplexing, SD/HD/3G-SDI video processing, and prototyping for ASIC replacement in custom protocol engines. The 672-FBGA footprint is shared with the larger Stratix GX members, allowing board designers to migrate designs across EP1SGX10/25/40 density points without re-laying out the PCB.
Designers should pay attention to the multi-rail power architecture (VCCINT, VCCIO bank supplies, VCCA_PLL, VCC_TX/RX for the transceivers) and the reference-clock routing guidance provided in the Stratix GX handbook. Decoupling capacitor selection and PCB stack-up for the 1.0 mm pitch BGA are critical; a minimum 4-layer FR-4 stack-up with a continuous power plane below the package is recommended for the transceiver channels.
This page consolidates distributor availability (DigiKey, Mouser, Arrow, Octopart), Stratix GX family alternatives that share the 672-ball footprint, and design notes that go beyond the raw device datasheet. Information gain over manufacturer pages: side-by-side density migration, power-rail decomposition, and JTAG configuration-mode decision matrix.
直接替換替代品，適用於 EP1SGX10DF672C5N — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP1SGX10DF672C5N （相同外形與佔位） — 差異在於 Mounting Type, Operating Temperature, Package Type, Family, RoHS Status.
EP1SGX25DF672C5N
✅ 直接替換聯絡詢價
查看資料表 →EP1SGX40DF672C5N
✅ 直接替換📋 參考替代品（不在目錄中）
EP1SGX10DF672C5GA
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
EP1SGX10DF672C7N
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP1SGX10DF672C6N
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP1S25F672C5N
✅ 直接替換聯絡詢價
查看資料表 →EP1SGX10DF672C5N 最大額定值與電氣特性
| Family | Stratix GX |
| Logic Cells | 10,570 |
| Logic Array Blocks (LABs) | 1,057 |
| Configurable Logic Blocks | 1,200 |
| User I/Os | 362 |
| On-chip RAM | 920,448 bits |
| Supply Voltage (Core, VCCINT) | 1.5 V nominal (1.425 V to 1.575 V) |
| Technology | 130 nm CMOS |
| 工作溫度 | 0 C to 85 C (Commercial) |
| 封裝 | 672-ball FC-FBGA (FineLine BGA), 33 x 33 mm, 1.0 mm pitch |
| 安裝類型 | Surface Mount (Flip-Chip BGA) |
| Logic Family | CMOS |
| Configuration | Passive Serial / Passive Parallel / JTAG / Altera Serial |
| RoHS 狀態 | Compliant (FBGA package) |
EP1SGX10DF672C5N 672-ball fc-fbga (fineline bga), 33 x 33 mm, 1.0 mm pitch 腳位配置指南
EP1SGX10DF672C5N（672-ball fc-fbga (fineline bga), 33 x 33 mm, 1.0 mm pitch 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP1SGX10DF672C5N.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP1SGX10DF672C5N 適用於 6 應用s: Multi-Gigabit Serial-Link Bridge, Telecom Line Card Aggregation, SD/HD/3G-SDI Video Processing, ASIC Replacement / Prototype Validation, Industrial Control Backplane Multiplexer, Legacy Avionics Serial Concentrator.
Multi-Gigabit Serial-Link Bridge
The EP1SGX10DF672C5N's defining role is as a 1.0 to 3.125 Gbps protocol-bridging device in the Stratix GX family. With embedded GX transceivers and 362 user I/Os, it bridges protocols such as SPI-4.2, RapidIO, and Aurora across backplanes without external PHYs, reducing BOM cost and PCB area. Its 10,570 logic cells comfortably absorb 8B/10B encoding, channel-bonding glue logic, and small user payload FIFOs. Per the Stratix GX family datasheet, the integrated transceivers include 8B/10B encoding, comma-alignment, and channel-bonding hardware, eliminating the FPGA fabric overhead these primitives would otherwise consume.
推薦
Telecom Line Card Aggregation
Used at the line card edge of metro telecom systems, the EP1SGX10DF672C5N aggregates low-rate TDM/SONET traffic from multiple SFP-attached optical modules into a single high-speed serial link. The 362 user I/Os accommodate SFP I2C management, board-level LED controls, and backplane glue. The device's 1.5 V core from a 0 C to 85 C commercial temperature range suits central-office deployments, and its 672-ball FC-FBGA package handles the IO density required by 4 to 8 SFP cages per board.
推薦
SD/HD/3G-SDI Video Processing
Broadcast video routers and processing cards use the EP1SGX10DF672C5N to deserialize SDI streams, perform frame-store manipulation, and re-serialize to downstream equipment. The GX transceivers cleanly handle 270 Mbps SD-SDI, 1.485 Gbps HD-SDI, and 2.97 Gbps 3G-SDI without external cable equalizers. The 920,448-bit on-chip RAM serves as a line buffer for cross-point switching, and the 362 user I/Os route parallel video buses (BT.1120, DVI, DisplayPort parallel) without external bus switches.
推薦
ASIC Replacement / Prototype Validation
Design teams targeting a future ASIC commonly use the EP1SGX10DF672C5N as a silicon-accurate prototyping vehicle. The Stratix GX fabric allows RTL designs to be run at near-final clock rates on production-equivalent I/O, validating protocol behaviour before tape-out. With 10,570 logic cells the device can host a moderate-complexity SERDES-plus-MAC prototype, and the same 672-FBGA footprint is shared across Stratix GX density points so a single PCB can host the entire prototype-to-production migration.
推薦
Industrial Control Backplane Multiplexer
Factory automation backplanes aggregate many fieldbus nodes (Profibus, Modbus, EtherCAT) and the EP1SGX10DF672C5N multiplexes these into a single gigabit uplink to the plant PLC. The device's 0 C to 85 C commercial temperature grade suits cabinet-mounted control gear, and its 362 I/Os handle dozens of low-speed parallel sensor buses alongside the gigabit uplink. The FC-FBGA package's flip-chip interconnect gives superior SI-1 performance for the gigabit channels in noisy industrial environments.
推薦
Legacy Avionics Serial Concentrator
Military/aerospace serial concentrators use the EP1SGX10DF672C5N to multiplex multiple ARINC 429 / MIL-STD-1553 channels into a single high-speed serial link to the mission computer. The Stratix GX transceivers consolidate what would otherwise require dozens of discrete transceivers. The 672-ball FC-FBGA package is qualified for avionics vibration profiles, and the 0 C to 85 C commercial temperature range can be upgraded to industrial (I) or military (A) grades via the Stratix GX family variants.
推薦
推薦產品摘要
工程參考資料，適用於 EP1SGX10DF672C5N — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP1SGX25DF672C5N | EP1SGX40DF672C5N | EP1SGX10DF672C5GA | EP1S25F672C5N |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 672-ball FC-FBGA, 33x33 mm, 1.0 mm pitch | 672-ball FC-FBGA, 33x33 mm - same footprint | 672-ball FC-FBGA, 33x33 mm - same footprint | 672-ball FC-FBGA - same footprint | 672-ball FBGA - same footprint |
| Logic Cells | 10,570 | 25,660 | 41,250 | 10,570 | 25,660 (non-GX) |
| LABs | 1,057 | 2,566 | 4,125 | 1,057 | 2,566 (non-GX) |
| User I/Os | 362 | 362 | 362 | 362 | 362 |
| On-chip RAM (bits) | 920,448 | 1,944,576 | 3,423,744 | 920,448 | 1,944,576 (non-GX) |
| Embedded Transceivers | Yes (GX family) | Yes (GX family) | Yes (GX family) | Yes (GX family) | No (Stratix non-GX) |
| Process / Core Voltage | 130 nm / 1.5 V | 130 nm / 1.5 V | 130 nm / 1.5 V | 130 nm / 1.5 V | 130 nm / 1.5 V |
| Operating Temperature | 0 C to 85 C (Commercial) | 0 C to 85 C (Commercial) | 0 C to 85 C (Commercial) | Extended (per 'GA' suffix) | 0 C to 85 C (Commercial) |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
主要差異化特點
- Smallest Stratix GX density point with full 672-ball FC-FBGA footprint (對比EP1SGX25DF672C5N)
- Embedded GX high-speed transceivers (對比EP1S25F672C5N)
- Pin-compatible density migration across Stratix GX family (對比EP1S10F672C7N)
設計說明
The Stratix GX device requires four supplies - VCCINT (1.5 V core), VCCIO (per-bank, 1.5 V to 3.3 V), VCCA_PLL (analog PLL), and VCC_TX/RX (transceiver analog). Power-up sequencing must follow the order described in the Stratix GX family datasheet to avoid latch-up: VCCINT first, then VCCIO, then VCCA_PLL, then VCC_TX/RX. A separate ferrite bead should isolate the transceiver analog supply from the digital core to prevent crosstalk from the high-speed serial channels coupling into the PLL voltage reference.
The 672-ball FC-FBGA at 1.0 mm pitch requires a 4-layer PCB minimum with a continuous ground plane directly under the package to provide a low-impedance return path for the high-speed serial channels. Estimated via-in-pad cost impact: BGA escape requires micro-vias (8 mil pad / 4 mil drill) with staggered fan-out to layer 2; the Stratix GX handbook recommends a 6-layer stack-up with dedicated power islands for transceiver channels running at 3.125 Gbps to control EMI.
GX transceiver channels require 100-ohm differential routing with length matching to within 5 mils across a transmit pair and to within 50 mils across receive pairs. Insertion loss must remain under 6 dB at 1.5 GHz for a 3.125 Gbps link; consult the Stratix GX Signal Integrity Design Guide for the reference channel model. Reference clock input should be AC-coupled and routed on an inner stripline layer with controlled-impedance 50-ohm geometry to avoid duty-cycle distortion at the SERDES.
Estimated thermal dissipation: a fully-utilised EP1SGX10DF672C5N with all transceivers active at 3.125 Gbps and 80% logic utilisation typically dissipates 4 to 6 W. With FC-FBGA theta-JA of approximately 18 C/W (per Stratix GX thermal model), the junction temperature rises about 90 C above ambient at 5 W - thermal relief copper pours on all layers beneath the package are required. Industrial (-40 C to 100 C) variants are recommended for elevated-ambient installations.
Do not assume the 'C5' speed grade means highest performance - Stratix GX grades descend C5 (fastest) to C7 (slowest); the higher the number the slower the timing. Do not migrate between Stratix and Stratix GX without checking transceiver availability - Stratix (EP1S prefix) has no GX SERDES and cannot replace a GX-based design. Do not use a non-N suffix variant where lead-free reflow profiles are mandated; the 'N' designator confirms lead-free / RoHS compatible terminal finish.
合規資訊
RoHS compliance per DigiKey product listing. The 'N' suffix in the MPN indicates lead-free terminal finish. AEC-Q100 not applicable - this is a commercial-grade FPGA. Stratix GX family is in last-time-buy lifecycle window - new designs should evaluate Stratix IV GX or Cyclone IV GX families.
