EP1SGX25DF1020C7 - Stratix GX FPGA 25K LE, 607 I/O | Intel
MPN： EP1SGX25DF1020C7 ✗ 停產EP1SGX25DF1020C7 概覽
A Field-Programmable Gate Array (FPGA) is a type of programmable logic device that combines configurable logic blocks (LABs/CLBs), programmable interconnect, and dedicated silicon resources such as block RAM, DSP blocks, and high-speed transceivers. Within the broader semiconductor hierarchy, an FPGA belongs to the family of programmable logic devices, sits alongside ASICs as a flexible hardware-acceleration alternative, and is widely used in digital signal processing, communications, and high-speed serial interfaces. The Stratix GX series specifically targets applications requiring embedded multi-gigabit transceivers.
Key differentiating features of the EP1SGX25DF1020C7 include 2,566 LABs, a 130 nm process node, 24 transceiver channels supporting up to 3.125 Gbps, dedicated hardware multipliers for DSP, and a flip-chip BGA package that maximizes signal integrity and thermal performance for high-pin-count designs. The 'C7' speed grade and 'D' temperature indicator map to the commercial 0-85 C operating window with a moderate performance bin.
This part targets high-bandwidth telecommunications infrastructure, including SONET/SDH framer designs, multi-gigabit serial backplanes, and base-station baseband processing, where embedded transceivers and substantial logic capacity are required in a single device. The architecture supports both hardware description language (HDL) and C/C++ design entry through Quartus II / Quartus Prime toolchains, and the device is pin-compatible with other Stratix GX variants, enabling seamless migration.
Typical applications include high-end serial-interface bridges, telecom line cards, radar and signal-intelligence front ends, and high-throughput ASIC prototyping. The choice of FC-FBGA-1020 with 1 mm pitch ensures low-impedance power delivery and controlled-impedance differential routing for multi-gigabit links.
When designing with this device, the 33 x 33 mm footprint and 1020 balls require a multilayer PCB with high-density interconnect (HDI) stack-up and microvia technology. Multiple ground and power balls are used for decoupling; place 0.1 uF and 0.01 uF ceramic capacitors within 5 mm of each power pin to meet the transceiver jitter budget.
This page synthesizes real-time distributor pricing, drop-in alternatives within the same Stratix GX family, and practical design notes that complement the manufacturer datasheet.
直接替換替代品，適用於 EP1SGX25DF1020C7 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP1SGX25DF1020C7 （相同外形與佔位） — 差異在於 Operating Temperature, Package Type, Speed Grade, Package, RoHS Status.
EP1SGX25DF1020C6N
✅ 直接替換聯絡詢價
查看資料表 →EP1SGX25DF1020C6
✅ 直接替換聯絡詢價
查看資料表 →EP1SGX25DF1020C5N
✅ 直接替換聯絡詢價
查看資料表 →EP1SGX25DF1020C5
✅ 直接替換聯絡詢價
查看資料表 →EP1SGX25DF1020C6ES
✅ 直接替換聯絡詢價
查看資料表 →EP1SGX25DF1020C7 最大額定值與電氣特性
| Series | Stratix GX |
| Logic Elements | 25,660 |
| Number of LABs/CLBs | 2,566 |
| Total RAM Bits | 1,944,576 |
| Number of I/Os | 607 |
| 工作溫度 | 0 C to 85 C |
| Supply Voltage (Core) | 1.425 V to 1.575 V |
| Process Technology | 130 nm CMOS |
| Internal Performance | 4385.97 MHz |
| 封裝 | 1020-BBGA, FCBGA (33 x 33 mm, 1 mm pitch) |
| Logic Family | CMOS |
| 安裝類型 | Surface Mount |
| RoHS 狀態 | Lead-Free, Compliant |
| Device Family | Stratix GX |
| Transceivers | Embedded multi-gigabit transceivers |
EP1SGX25DF1020C7 1020-bbga, fcbga (33 x 33 mm, 1 mm pitch) 腳位配置指南
EP1SGX25DF1020C7（1020-bbga, fcbga (33 x 33 mm, 1 mm pitch) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP1SGX25DF1020C7.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP1SGX25DF1020C7 適用於 6 應用s: Telecom Line Card (SONET/SDH Framer), Multi-Gigabit Serial Backplane Bridge, ASIC Prototyping Platform, Wireless Base Station Baseband, Video Broadcast and Imaging Processing, Industrial High-Speed Data Acquisition.
Telecom Line Card (SONET/SDH Framer)
The EP1SGX25DF1020C7 fits SONET/SDH framer and mapper designs because it integrates 24 multi-gigabit transceivers at up to 3.125 Gbps, matching OC-48/STM-16 line rates, plus 25,660 logic elements for framer/mapper state machines. The 1.5 V core and 607 user I/Os support large parallel datapaths for STS-1/AU-3 cross-connect fabrics. Placed on the line card between the optical module and the network processor, it absorbs the SERDES function and the framer pipeline in a single device, eliminating external PHY chips.
推薦
Multi-Gigabit Serial Backplane Bridge
For proprietary backplanes running Serial RapidIO or XAUI at 3.125 Gbps, the EP1SGX25DF1020C7 provides ample transceiver channels for multiple XAUI lanes plus the logic fabric for protocol bridging. The 33 x 33 mm FCBGA-1020 package offers low-inductance power delivery and matched-impedance routing required for jitter budgets under 0.35 UI. Embedded 1,944,576 RAM bits buffer protocol conversion, and the Quartus II IP library provides ready-made XAUI, RapidIO, and PCIe soft cores that target this silicon.
推薦
ASIC Prototyping Platform
ASIC designers use the EP1SGX25DF1020C7 as a hardware prototyping vehicle for mid-density ASICs in the 100K to 300K gate range. The 25,660 logic elements and embedded RAM allow RTL mapping with reasonable utilization, and the 607 I/Os expose the prototype's external interface for in-system validation. Placed on a custom prototype motherboard with breakout headers for ASIC pin exposure, it enables software teams to begin driver development in parallel with ASIC tape-out, typically cutting the schedule by 3 to 6 months.
推薦
Wireless Base Station Baseband
Wireless base-station baseband processing benefits from the EP1SGX25DF1020C7's dedicated hardware multipliers and embedded transceivers for CPRI links to remote radio heads. The 25,660 logic elements accommodate the chip-rate processing for 3G/4G channels, while 1,944,576 RAM bits hold the symbol data and equalizer coefficients. The 130 nm process delivers sufficient performance at low enough power for fan-cooled shelf designs, and the 0-85 C commercial temperature range covers most indoor base-station installations.
推薦
Video Broadcast and Imaging Processing
Broadcast video routers and medical imaging systems use the EP1SGX25DF1020C7 for real-time SDI/HD-SDI aggregation and pixel-pipeline processing. The 24 transceivers aggregate multiple SDI streams while the logic fabric implements de-interlacing, scaling, and color-space conversion. The 607 user I/Os connect to large DDR memory banks for frame buffering, and 1,944,576 embedded RAM bits provide line and block caches. The 1020-ball FCBGA supports controlled-impedance routing for the multi-gigabit SDI links.
推薦
Industrial High-Speed Data Acquisition
Industrial data-acquisition systems in test-and-measurement, RADAR, and signal-intelligence use the EP1SGX25DF1020C7 to aggregate multiple ADC/DAC channels running at hundreds of MSPS. The 24 transceivers stream digitized IF data to downstream processors over XAUI or Serial RapidIO, and 25,660 logic elements implement digital down-conversion and FFT pre-processing. The 1.5 V core and FC-BGA package provide clean power and ground for low-jitter ADC clock distribution, critical for SFDR above 70 dB.
推薦
推薦產品摘要
工程參考資料，適用於 EP1SGX25DF1020C7 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP1SGX25DF1020C6N | EP1SGX25DF1020C6 | EP1SGX25DF1020C5N | EP1SGX25DF1020C5 | EP1SGX25DF1020C6ES |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1020-BBGA, FCBGA (33 x 33 mm, 1 mm pitch) | 1020-BBGA, FCBGA - same | 1020-BBGA, FCBGA - same | 1020-BBGA, FCBGA - same | 1020-BBGA, FCBGA - same | 1020-BBGA, FCBGA - same |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| Number of LABs/CLBs | 2,566 | 2,566 | 2,566 | 2,566 | 2,566 | 2,566 |
| Total RAM Bits | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 |
| Number of I/Os | 607 | 607 | 607 | 607 | 607 | 607 |
| Speed Grade | C7 (fastest) | C6 | C6 | C5 | C5 | C6 |
| Operating Temperature | 0 C to 85 C (commercial) | 0 C to 85 C (commercial) | 0 C to 85 C (commercial) | 0 C to 85 C (commercial) | 0 C to 85 C (commercial) | 0 C to 85 C (commercial) |
| Supply Voltage | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V |
| RoHS Status | Lead-Free | Lead-Free | Lead-Free | Lead-Free | Lead-Free | Lead-Free |
主要差異化特點
- C7 speed grade (fastest in Stratix GX family) (對比EP1SGX25DF1020C6)
- Drop-in pin-compatible across C5, C6, C7 speed grades (對比EP1S25F1020C7 (Stratix II))
- Maximum 607 I/Os in 33 x 33 mm FCBGA (對比EP1SGX25CF672C7 (672-ball))
設計說明
The 1020-ball FC-BGA package with 1 mm ball pitch requires a multilayer PCB (at least 8 layers) with 1 oz copper outer layers and microvia-in-pad (VIP) technology. Escape routing from inner-row balls demands a stack-up with 4 mil trace width and 4 mil spacing. Use of high-Tg FR-4 (Tg >= 170 C) or low-loss mid-loss PCB laminates (e.g. Isola FR408HR) ensures reliable reflow at peak 245 C without warping.
Each VCCINT ball requires a 0.1 uF X7R ceramic decoupling capacitor within 5 mm, plus a 10 uF bulk capacitor per power rail. Transceiver power (VCCA, VCCP) demands separate filtering with ferrite beads to isolate switching noise. Power-on sequencing must follow the datasheet-specified order: VCCIO first, then VCCINT, then VCCA/VCCP, with maximum 100 ms delay between rails to prevent latch-up.
Estimated: at full transceiver utilization (24 lanes at 3.125 Gbps) and high logic toggle rate, the EP1SGX25DF1020C7 dissipates approximately 8 to 12 W. The FC-BGA package has theta_JC of approximately 0.3 C/W and theta_JA of approximately 10 C/W with a proper heatsink. Without forced airflow, a heatsink with thermal interface material rated at 0.5 C/W or better is mandatory. Compute junction temperature rise from Theta_JA and ambient; ensure Tj stays below 100 C for commercial-grade reliability.
Differential transceiver pairs must be routed as 100 ohm differential lines with intra-pair skew under 1 ps per cm. Use length-matched serpentine tuning on long routes and avoid 90-degree bends - all turns must use 45-degree angles. Reference planes for the transceivers should be continuous GND with no plane splits across the routing region. Maintain at least 4W (4 x dielectric thickness) spacing to other signals.
合規資訊
Lead-Free per Altera/Intel packaging documentation. Not AEC-Q100 qualified - this is a commercial-grade FPGA. For automotive applications, consult Intel automotive-grade Stratix variants separately.
