EP1SGX25DF672C5 - Stratix GX FPGA 25K LE 672-FBGA | Intel
MPN： EP1SGX25DF672C5 ✗ 停產EP1SGX25DF672C5 概覽
An FPGA (Field Programmable Gate Array) is a programmable logic device — within the broader hierarchy of programmable logic devices (PLDs) — that contains an array of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and programmable interconnect. Stratix GX extends the Stratix architecture with embedded serial transceivers that hard-IP the PHY layer for protocols such as Gigabit Ethernet, Serial RapidIO, PCI Express, XAUI, and SONET/SDH at multi-gigabit data rates. The 'SGX' family positions Stratix GX as the transceiver-rich derivative for communication infrastructure, broadcast video, and high-speed datapath applications.
Key features of the EP1SGX25DF672C5 include 25,660 LEs, 1,944,576 RAM bits, 455 user I/Os, 20 full-duplex transceiver channels (per the Stratix GX family data sheet) supporting serial rates up to 3.125 Gbps with 8B/10B encoding and dynamic phase alignment, dedicated multiplier/DSP blocks for high-throughput signal processing, and tri-matrix on-chip memory configurable as RAM, ROM, or FIFO. The C5 speed grade balances timing margin against power, and the industrial 0 °C to 85 °C operating range covers commercial and most controlled-environment deployments.
Typical applications include 10 Gigabit Ethernet line cards and switch fabrics, multi-port Gigabit Ethernet aggregation, Serial RapidIO and PCI Express endpoint/root-complex bridging, baseband processing for wireless infrastructure, and video broadcast glue logic. The 672-FBGA package exposes 455 user I/Os and full MII/RMII/GMII-friendly LVDS I/O, providing flexible board-level integration in space-constrained line cards.
When designing with this device, pay close attention to transceiver reference-clock routing, supply-rail decoupling around the analog 1.5 V and 2.5 V PLLs, and JTAG-driven configuration via the enhanced configuration scheme. The C5 speed grade requires timing closure headroom — review Quartus II TimeQuest timing analyzer results against the datasheet-specified fMAX for your critical path. Keep in mind this part is from a legacy 130 nm node; modern designs typically migrate to Stratix II GX, Cyclone IV GX, or Stratix V for lower power and higher transceiver rates.
直接替換替代品，適用於 EP1SGX25DF672C5 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP1SGX25DF672C5 （相同外形與佔位） — 差異在於 Operating Temperature, Package, Process Technology, Mounting Type, Speed Grade.
EP1SGX25CF672C5
✅ 直接替換聯絡詢價
查看資料表 →EP1SGX25DF672C7
✅ 直接替換聯絡詢價
查看資料表 →EP1SGX25DF67216
✅ 直接替換聯絡詢價
查看資料表 →EP1SGX25DE672C7
✅ 直接替換聯絡詢價
查看資料表 →EP1SGX10CF672C5
✅ 直接替換📋 參考替代品（不在目錄中）
EP1SGX25DF672C5 最大額定值與電氣特性
| Manufacturer | Intel (formerly Altera) |
| Series | Stratix GX |
| Logic Family | CMOS |
| Device Type | FPGA (Field Programmable Gate Array) |
| Logic Elements | 25,660 |
| Embedded Memory Bits | 1,944,576 |
| User I/Os | 455 |
| Number of Pins / Terminals | 672 |
| Package Type | FBGA-672 (672-BGA, 33 × 33 mm, 1 mm pitch) |
| Package Code | BGA, Square |
| 安裝類型 | Surface Mount |
| 供應電壓 | 1.5 V (core) |
| Speed Grade | C5 |
| 工作溫度 | 0 °C to +85 °C (Commercial) |
| Lead Free / RoHS | Lead Free, RoHS compliant |
| Embedded Transceivers | Up to 20 channels (3.125 Gbps) |
EP1SGX25DF672C5 bga, square 腳位配置指南
EP1SGX25DF672C5（bga, square 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP1SGX25DF672C5.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP1SGX25DF672C5 適用於 6 應用s: Gigabit Ethernet Aggregation Switch, Serial RapidIO Backplane Bridge, PCI Express Endpoint / Root Complex, Wireless Baseband Processing Card, Broadcast Video Glue Logic, High-Speed Datapath / ASIC Prototyping.
Gigabit Ethernet Aggregation Switch
The EP1SGX25DF672C5 is well-suited for multi-port Gigabit Ethernet aggregation in access and edge switches. Its 20 embedded transceiver channels at 1.25 Gbps directly support 20 SGMII/SerDes links to PHY devices, while the 25,660 LEs implement MAC, VLAN tagging, QoS classification, and forwarding logic. The 1,944,576 bits of tri-matrix memory absorbs packet bursts and lookup-table caching for L2/L3 forwarding. Compared with a discrete MAC-plus-CPU design, the integrated transceivers eliminate external PHY glue and reduce BOM cost, while Quartus II megafunctions (alt2gxb, altgxb) simplify XAUI/SGMII instantiation. Designers should budget margin for transceiver reference-clock jitter per the Stratix GX handbook.
推薦
Serial RapidIO Backplane Bridge
Stratix GX was architected for Serial RapidIO (SRIO) backplane bridging in DSP and telecom backplane designs. The EP1SGX25DF672C5's 3.125 Gbps transceivers provide ample headroom for 1x and 4x SRIO links at 1.25 / 2.5 / 3.125 Gbps per lane, while the embedded DSP/multiplier blocks accelerate the message-passing logic and CRC computation. The 25,660 LEs and 455 user I/Os let designers implement multi-port bridges with parallel local-bus interfaces to TI DSPs (TMS320C6000 series) or PowerPC processors. Pin-compatible migration to EP1SGX25CF672C7 is straightforward when designs cannot close timing at C5.
推薦
PCI Express Endpoint / Root Complex
The EP1SGX25DF672C5 implements PCI Express Gen 1 (2.5 Gbps) endpoints and root complexes using its embedded transceivers and the altpciexmegafunction in Quartus II. The device's 25,660 LEs handle the PIPE and transaction layer, while 455 user I/Os drive the local application side (e.g., packet classification, DMA engines). At Gen 1 speeds of 2.5 Gbps, each transceiver has ~20% margin; designers targeting Gen 2 (5 Gbps) should migrate to Stratix II GX. The 672-FBGA package provides ample board-routing escape for the x4/x8 PCIe lane widths.
推薦
Wireless Baseband Processing Card
Wireless baseband line cards use the EP1SGX25DF672C5 for forward-error-correction (Turbo, Viterbi), crest-factor reduction (CFR), and digital predistortion (DPD) — all of which exploit the device's dedicated multiplier/DSP blocks. The 20 embedded transceivers connect to the backplane via SRIO or CPRI (with appropriate PHY), while the 25,660 LEs implement multi-antenna MIMO datapaths for 3G/4G base stations. The commercial 0–85 °C grade suits indoor base-station shelves; for outdoor remote-radio-head (RRH) deployments, designers should select the industrial EP1SGX25DF672I6N variant in the same 672-FBGA package.
推薦
Broadcast Video Glue Logic
The EP1SGX25DF672C5 excels in broadcast video routers, format converters, and timing-stripping applications that demand high I/O count and serial connectivity. Its 455 user I/Os support HD/SD-SDI input and output channels (via external SDI PHY), while the embedded transceivers carry SDTI or DVB-ASI streams at 270 Mbps / 1.485 Gbps. The 1,944,576 bits of tri-matrix memory provide line buffers and audio-embedding FIFOs. Designers should leverage Quartus II's SDI megafunction and audio-embedding cores to accelerate development.
推薦
High-Speed Datapath / ASIC Prototyping
The EP1SGX25DF672C5 serves as a flexible ASIC prototyping vehicle for high-speed serial interfaces and parallel datapaths. Its 25,660 LEs, embedded transceivers, and 455 user I/Os allow engineers to validate designs that would otherwise require a multi-million-gate ASIC. Quartus II's design partitioning and incremental compilation features map cleanly onto the Stratix GX fabric. For multi-FPGA prototyping of larger ASICs, multiple EP1SGX25DF672C5 or EP1SGX40F1020C7 devices can be tiled, with transceivers handling inter-board interconnect at 3.125 Gbps.
推薦
推薦產品摘要
工程參考資料，適用於 EP1SGX25DF672C5 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP1SGX25CF672C5 | EP1SGX25DF672C7 | EP1SGX25DF67216 | EP1SGX25DE672C7 | EP1SGX10CF672C5 |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 672-FBGA (33x33 mm) | 672-FBGA (33x33 mm) - same | 672-FBGA (33x33 mm) - same | 672-FBGA (33x33 mm) - same | 672-FBGA (33x33 mm) - same | 672-FBGA (33x33 mm) - same |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 10,570 (-59%) |
| Memory Bits | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 920,448 (-53%) |
| User I/Os | 455 | 455 | 455 | 455 | 455 | 338 (-26%) |
| Speed Grade | C5 | C5 | C7 (slower) | C5-equivalent | C7 | C5 |
| Operating Temperature | 0 to 85 °C | 0 to 85 °C | 0 to 85 °C | 0 to 85 °C | 0 to 85 °C | 0 to 85 °C |
| Transceiver Rate | Up to 3.125 Gbps | Up to 3.125 Gbps | Up to 3.125 Gbps | Up to 3.125 Gbps | Up to 3.125 Gbps | Up to 3.125 Gbps |
| Lifecycle | NRND | NRND | NRND | NRND | NRND | NRND |
主要差異化特點
- Highest transceiver count in the Stratix GX '25' density tier (對比EP1SGX10CF672C5)
- Fastest speed grade available in EP1SGX25 family (對比EP1SGX25DF672C7)
- Same-package compatibility with industrial temperature variants (對比EP1SGX25DF672I6N)
設計說明
The EP1SGX25DF672C5 requires multiple supply rails per the Stratix GX data sheet: 1.5 V core (VCCINT), 1.5 V/2.5 V/3.3 V I/O banks (VCCIO), 2.5 V PLL analog (VCCA_PLL), and 1.2 V/3.3 V transceiver supplies (VCCHIP/LVDS). Decouple each rail with bulk (220 µF) plus distributed 0.1 µF + 10 µF ceramic capacitors placed within 5 mm of the relevant balls. Use a Ferrite bead on the analog PLL supply to isolate switching noise. Estimated: a fully utilized EP1SGX25 with 20 active transceivers at 3.125 Gbps can dissipate 8–12 W — verify with PowerPlay Early Power Estimator in Quartus II before final BOM release.
The 672-FBGA's 1.0 mm ball pitch and 33 × 33 mm body require 6–8 layer PCB stack-ups with controlled-impedance (50 Ω SE, 100 Ω diff) routing for transceiver lanes. Use 4 mil laser-drilled microvias with stacked-via structures, and route high-speed transceiver pairs on the top layer adjacent to the BGA. Breakout via pattern should follow the manufacturer's land-pattern recommendation. Estimate: total transceiver loss budget at 3.125 Gbps is ~10 dB channel loss — run pre-layout SI simulations with the IBIS-AMI model provided by Intel/Altera.
Common pitfalls with the EP1SGX25DF672C5 include (1) failing to provide the auxiliary reference-clock pins (REFCLK_*) with proper 100 ppm clocks — jitter above this budget causes link-training failure; (2) leaving the nCONFIG pin floating in multi-FPGA systems, causing unintended reconfiguration; (3) using 3.3 V LVCMOS on a bank set to 2.5 V VCCIO — always match VCCIO to the I/O standard; (4) ignoring MSL (Moisture Sensitivity Level) pre-bake requirements for the FBGA — bake at 125 °C for 24 hours before assembly if floor-life has expired. Also verify the Quartus II version supports your device variant — versions before 4.0 do not support EP1SGX25 family.
合規資訊
Lead-free and RoHS compliant per Altera FBGA-672 package marking. C5 suffix indicates commercial temperature grade (0–85 °C); for AEC-Q100 automotive qualification this part is not applicable — designers should not use EP1SGX25 in automotive safety-critical applications. Halogen-free status and conflict-minerals compliance are not stated in the verified data; set to unknown per data-authenticity rules.
