EP1SGX25DF672C7 - Stratix GX FPGA, 25K LE, 672-BGA | Intel / Altera
MPN： EP1SGX25DF672C7 ✗ 停產EP1SGX25DF672C7 概覽
A Field-Programmable Gate Array (FPGA) is a reprogrammable semiconductor device consisting of an array of configurable logic blocks (CLBs), embedded memory, DSP slices, and programmable interconnect fabric. FPGAs sit at the hierarchy: programmable logic -> logic IC -> integrated circuit. They are widely used as hardware accelerators, custom I/O bridges, and prototyping platforms for ASICs, providing ASIC-like performance with field-reprogrammability.
Key features of the EP1SGX25DF672C7 include 25,660 logic elements (2,566 LABs), 1,944,576 total RAM bits (~237 Kbytes), 14 embedded DSP blocks for hardware multiplication and MAC operations, multi-gigabit transceivers, and a Phase-Locked Loop (PLL) clock management network. The 672-FBGA (27 × 27 mm) package provides 455 user I/Os and supports surface-mount assembly with lead-free (Pb-free) ball terminations.
The device is fabricated on a 1.5 V, 0.13 µm CMOS SRAM-based process. The 'GX' suffix indicates the integrated high-speed transceiver tier (versus the non-transceiver Stratix family). The speed grade 'C7' indicates a commercial temperature grade (0 °C to 85 °C) with a moderate Fmax speed bin. The 'DF' position in the part number refers to the 672-pin FineLine BGA package code.
Typical applications include 10 Gbps Ethernet line cards, SONET/SDH framer ASIC replacement, custom protocol bridging (SPI 4.2, SFI-4, XAUI), high-performance DSP pre-processing, and test & measurement front-ends. The integrated transceivers and DSP blocks reduce external PHY and DSP component count, enabling higher board density for telecom and datacom line cards.
When designing with this part, ensure the 1.5 V core and 3.3 V/2.5 V auxiliary supplies are decoupled with low-ESR ceramic capacitors placed close to each power pin. The transceiver reference clock must meet the jitter specification in the Stratix GX Handbook, and the JTAG chain must include the device in BSDL-defined order to enable in-system programming.
This page synthesizes distributor pricing, drop-in alternatives from the same Altera/Intel Stratix GX family, and practical design notes that go beyond a simple datasheet restatement.
直接替換替代品，適用於 EP1SGX25DF672C7 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP1SGX25DF672C7 （相同外形與佔位） — 差異在於 Package, Operating Temperature, Process Technology, Logic Elements, Family.
EP1SGX25CF672C7
✅ 直接替換聯絡詢價
查看資料表 →EP1SGX25CF672C7N
✅ 直接替換聯絡詢價
查看資料表 →EP1SGX25DF672C6N
✅ 直接替換聯絡詢價
查看資料表 →EP1SGX25DF672C6
✅ 直接替換聯絡詢價
查看資料表 →EP1SGX25DF672C5N
✅ 直接替換聯絡詢價
查看資料表 →EP1SGX25DF672C5
✅ 直接替換聯絡詢價
查看資料表 →EP1SGX10CF672C7
✅ 直接替換聯絡詢價
查看資料表 →EP1SGX25DF672C7 最大額定值與電氣特性
| Series | Stratix GX |
| Family | Stratix GX |
| Logic Elements (LE) | 25,660 |
| Logic Array Blocks (LABs) | 2,566 |
| Total RAM Bits | 1,944,576 |
| User I/O Count | 455 |
| Embedded DSP Blocks | 14 |
| Embedded Transceivers | Yes (GX family) |
| Process Technology | 0.13 µm CMOS, SRAM-based |
| Core Supply Voltage | 1.425 V to 1.575 V (1.5 V nominal) |
| 工作溫度 | 0 °C to +85 °C (Commercial) |
| 封裝 | 672-FBGA (27 × 27 mm, 1.0 mm pitch) |
| 安裝類型 | Surface Mount |
| Lead Free / RoHS | Lead-Free, RoHS Compliant |
| Speed Grade | C7 (moderate Fmax bin) |
EP1SGX25DF672C7 672-fbga (27 × 27 mm, 1.0 mm pitch) 腳位配置指南
EP1SGX25DF672C7（672-fbga (27 × 27 mm, 1.0 mm pitch) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP1SGX25DF672C7.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP1SGX25DF672C7 適用於 7 應用s: 10 Gigabit Ethernet Line Card, SONET/SDH Framer ASIC Replacement, Custom Protocol Bridge / SPI-4.2 to XAUI, Test & Measurement Front-End, DSP Pre-Processing / Wireless Baseband, High-Performance Industrial Imaging & Video Processing, Legacy Telecom Backplane Aggregation.
10 Gigabit Ethernet Line Card
The EP1SGX25DF672C7 is well-suited for 10 Gigabit Ethernet line cards and XAUI-to-XGMII protocol bridging. Its integrated multi-gigabit transceivers run up to 3.125 Gbps, allowing four-channel XAUI aggregation to a single 10 Gbps link without external PHY chips. With 25,660 logic elements and 1.9 Mbit of embedded RAM, the FPGA can implement the full XAUI PCS layer, MAC encoding (64b/66b), and frame buffering in fabric. The 455 user I/Os expose ample SPI-4.2 or SFI-4.1 interface bandwidth to network processors. Designers typically instantiate Altera's MAC and PHY IP cores to shorten development time and achieve line-rate throughput.
推薦
SONET/SDH Framer ASIC Replacement
Telecom framer designs traditionally done in ASICs can be replaced with the EP1SGX25DF672C7, leveraging its 3.125 Gbps transceivers to interface directly with OC-192/STM-64 optical modules. The FPGA's embedded DSP blocks (14 blocks total) handle clock-and-data recovery, scrambling/descrambling, and pointer processing in hardware. With 1.9 Mbit of TriMatrix memory, the device supports multi-frame FIFO buffering for jitter absorption and overhead processing. Field-programmability enables late-stage customization for regional telecom variations (e.g., SDH AU-4 vs SONET STS-192 mapping). The 672-FBGA package with 455 I/Os provides generous board-level interconnect for tributary side interfaces.
推薦
Custom Protocol Bridge / SPI-4.2 to XAUI
The EP1SGX25DF672C7 is ideal for bridging SPI-4.2 or SFI-4.1 interfaces from network processors to XAUI links on switch line cards. With 455 user I/Os it can drive LVTTL/LVDS SPI-4.2 interfaces at full 622 MHz data rate plus the four XAUI lanes simultaneously. The 1.9 Mbit of embedded RAM acts as a packet buffer for rate adaptation between SPI-4.2 and XAUI clock domains. Hardware flow-control credits are processed in fabric via state machines, while parity and CRC verification are offloaded to the DSP blocks. This application replaces discrete bridge ASICs that have become scarce or expensive.
推薦
Test & Measurement Front-End
Test and measurement equipment such as protocol analyzers, BERT testers, and logic analyzers use the EP1SGX25DF672C7 to provide reconfigurable front-end capture and pattern generation. The transceiver channels acquire serial data at up to 3.125 Gbps, while the 25K logic elements implement pattern matching, error counting, and protocol decoding in real time. The 1.9 Mbit embedded memory holds captured trace buffers, and 455 I/Os drive LCDs, keypads, and host interfaces (PCI, USB, Ethernet). Designers can re-purpose the same hardware platform for multiple protocol standards (PCI Express, Serial RapidIO, Fibre Channel) by recompiling the FPGA bitstream in Quartus II.
推薦
DSP Pre-Processing / Wireless Baseband
Wireless baseband pre-processing such as crest-factor reduction, digital predistortion, and beamforming benefits from the EP1SGX25DF672C7's 14 dedicated DSP blocks. Each DSP block implements hard multipliers and accumulators, achieving tens of GMACs of multiply-accumulate throughput without consuming general logic. With multi-gigabit transceivers, digitized IF samples from ADC/DAC boards can be transported at up to 3.125 Gbps directly into the FPGA for real-time processing. The 672-FBGA package dissipates moderate power at 1.5 V core, simplifying board thermal design. This part predates Cyclone V and Arria V families, so it suits legacy 3G/4G base station designs still in production.
推薦
High-Performance Industrial Imaging & Video Processing
Industrial imaging applications such as machine-vision cameras and high-speed video processors use the EP1SGX25DF672C7 to perform pixel-level processing, color-space conversion, and image statistics. The 455 user I/Os drive Camera Link, LVDS, or DVI/HDMI inputs at multi-megapixel rates. The 1.9 Mbit of embedded RAM acts as line buffers and frame accumulators, while the 14 DSP blocks accelerate convolution kernels for real-time filtering. The transceiver channels enable direct connection to SDI (SMPTE 259M/292M) or CoaXPress high-speed serial video standards. The 0–85 °C commercial temperature range is adequate for most factory-floor installations without requiring extended-temperature parts.
推薦
Legacy Telecom Backplane Aggregation
Legacy telecom equipment such as SONET Add-Drop Multiplexers (ADMs), digital cross-connects, and ATM switches continue to use the EP1SGX25DF672C7 as a backplane aggregator bridging lower-speed tributaries (DS3/E3, OC-3/12/48) to higher-speed uplinks. The FPGA's 455 user I/Os connect to many tributary framers simultaneously, while the transceivers carry aggregated traffic upward at 3.125 Gbps. Embedded RAM supports per-channel jitter attenuators, and DSP blocks accelerate Reed-Solomon and BCH forward-error-correction codes. Since this part is in long-term support by Rochester Electronics, it remains a viable BOM item for sustaining legacy telecom installations through the 2020s.
推薦
推薦產品摘要
工程參考資料，適用於 EP1SGX25DF672C7 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP1SGX25CF672C7 | EP1SGX25CF672C7N | EP1SGX25DF672C6N | EP1SGX10CF672C7 |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 672-FBGA (27x27) | 672-FBGA (27x27) - same | 672-FBGA (27x27) - same | 672-FBGA (27x27) - same | 672-FBGA (27x27) - same |
| Logic Elements | 25,660 | 25,660 | 25,660 | 10,570 | |
| Embedded RAM | 1,944,576 bits | 1,944,576 bits | 1,944,576 bits | 920,448 bits | |
| DSP Blocks | 14 | 14 | 14 | 6 | |
| User I/O | 455 | 455 | 455 | 455 | |
| Transceivers | Multi-Gbps (3.125 Gbps) | Multi-Gbps (3.125 Gbps) | Multi-Gbps (3.125 Gbps) | Multi-Gbps (3.125 Gbps) | |
| Speed Grade | C7 | C7 | C6 | C5 | |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete |
主要差異化特點
- Highest speed grade in the 672-FBGA family (對比EP1SGX25DF672C5)
- 25K logic element density vs 10K family (對比EP1SGX10CF672C7)
- DF package code (specific ball-pattern revision) (對比EP1SGX25CF672C7)
設計說明
The EP1SGX25DF672C7 requires a sequenced 1.5 V core supply plus 3.3 V and 2.5 V auxiliary rails. Place 0.1 µF X7R ceramic decoupling capacitors within 100 mils of every VCC/VCCINT/VCCIO/VCCA pin, with 10 µF bulk tantalum or polymer capacitors on each supply rail. Altera's PowerPlay early-power estimator should be run after place-and-route to size the regulator; transceivers at full utilization can draw an additional 1.5 A from the 2.5 V analog rail.
Estimated: at 1.5 V core, full transceiver utilization, and 50% logic toggle rate, junction power consumption reaches approximately 8 to 10 W. With a 672-FBGA package theta-JA of approximately 12 °C/W in still air, junction temperature could rise 100 °C above ambient. A 200 LFM airflow or a heatsink attached to the package lid is required for sustained operation. Use the Stratix GX PowerPlay tool to verify before finalizing the mechanical design.
Use a 12-layer PCB stackup with continuous GND and PWR planes adjacent to the top signal layer. Maintain 50 Ω single-ended and 100 Ω differential impedance on all transceiver channels. Length-match differential pairs within 5 mils for 3.125 Gbps signals, and route them over a solid GND plane with no splits. Place AC-coupling capacitors (0.1 µF X7R) within 200 mils of each transmitter output pin.
Common pitfalls include: (1) failing to configure unused I/O banks as LVCMOS with weak pull-ups rather than leaving them floating; (2) connecting the JTAG chain out of order, breaking in-system programming; (3) violating the maximum transceiver pre-emphasis and VOD settings; (4) using a non-validated reference-clock oscillator with jitter exceeding the Stratix GX specification, which causes link errors. Always validate the bitstream with the Quartus II PowerFit fitter before tape-out.
For multi-gigabit transceivers, use a stripline routing layer between two solid GND/PWR planes and avoid vias on differential-pair traces. Each channel should have its own reference-clock input routed with controlled impedance. The 672-FBGA breakout requires microvia or laser-drilled via technology; through-hole vias on transceiver channels add stubs that degrade signal integrity at 3.125 Gbps.
合規資訊
RoHS compliant per DigiKey/Mouser attributes. Lead-free ball finish. Not AEC-Q100 (automotive) qualified — operating temperature 0 to +85 °C commercial grade only.
