EP20K600EFC144-2XN - APEX 20KE 600K Gate FPGA | Intel (Altera)
MPN： EP20K600EFC144-2XN ✗ 停產EP20K600EFC144-2XN 概覽
An FPGA (Field Programmable Gate Array) is a programmable logic device that allows designers to implement custom digital circuits by configuring an array of logic blocks, interconnect and I/O resources. The APEX 20KE family is positioned in the hierarchy: programmable logic device -> FPGA -> high-density SRAM-based FPGA -> APEX 20KE series. It combines Look-Up Table (LUT)-based logic with embedded system blocks, allowing true system-on-chip integration on a single die.
Key features of the EP20K600EFC144-2XN include 24,576 LEs, 311,040 bits of embedded RAM (approximately 38 KB), embedded Multiplier blocks for DSP, and 4 phase-locked loops for clock management. The device supports LVTTL, LVCMOS, PCI and other I/O standards via its 144 pins, and operates from a 1.8 V core supply with multi-voltage I/O banks. The '-2' speed grade denotes a mid-tier performance bin, while the 'N' suffix indicates an industrial temperature range, often associated with lead-free compliance.
Architecturally, the EP20K600EFC144-2XN is implemented in a 0.18 um six-layer-metal CMOS process with SRAM configuration memory, allowing unlimited reconfiguration and in-system programmability via the IEEE 1532 or passive serial/parallel configuration schemes. The device also includes dedicated hardware for DDR SDRAM interfaces, supporting external memory bandwidth up to the datasheet-specified frequency.
Typical applications include telecommunications baseband and line-card processing, industrial motion control and machine vision, high-speed test and measurement instrumentation, ASIC prototyping, and military/aerospace signal processing platforms. The combination of high logic density and embedded multiplier/DSP blocks makes the part particularly suited for FIR filters, FFT engines and protocol-processing pipelines.
When designing with this device, pay close attention to power sequencing of the 1.8 V core and I/O banks, and use the Quartus II (or Quartus Prime legacy) toolchain for place-and-route, timing closure and configuration file generation. Decoupling must follow the Altera reference board layout for the 144-pin BGA package to maintain signal integrity at high toggle rates.
This page synthesizes distributor stock data, drop-in alternatives sourced from the Site MPN list and parametric cross-reference, and practical design notes that are not collated in the legacy APEX 20KE datasheet alone.
直接替換替代品，適用於 EP20K600EFC144-2XN — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP20K600EFC144-2XN （相同外形與佔位） — 差異在於 Operating Temperature, Family, Package, Process Technology, Core Supply Voltage.
EP20K600EBC652-2X
✅ 直接替換聯絡詢價
查看資料表 →EP20K600CB652C8N
✅ 直接替換聯絡詢價
查看資料表 →EP20K600CF672C8N
✅ 直接替換聯絡詢價
查看資料表 →EP20K400EFC672-2X
✅ 直接替換聯絡詢價
查看資料表 →EP20K600EFC144-1XN
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
EP20K600EFC144-2XN 最大額定值與電氣特性
| Family | APEX 20KE |
| Logic Elements | 24,576 |
| Typical Gates | 600,000 |
| Maximum System Gates | 1,053,840 |
| Embedded RAM Bits | 311,040 bits (~38 KB) |
| Number of PLLs | 4 |
| Core Voltage | 1.8 V |
| I/O Voltage Banks | Multi-voltage (LVTTL/LVCMOS/PCI) |
| Process Technology | 0.18 um CMOS, 6-layer metal |
| Speed Grade | -2 (mid-tier) |
| 封裝 | 144-ball FineLine BGA |
| 工作溫度 | -40C to +85C (industrial, 'N' suffix) |
| Configuration Method | SRAM, IEEE 1532 / passive serial / passive parallel |
EP20K600EFC144-2XN 腳位配置
| 腳位 A1 | I/O Bank 1 — User I/O (LVTTL/LVCMOS/PCI) |
| 腳位 B2 | I/O Bank 1 — User I/O (LVTTL/LVCMOS/PCI) |
| 腳位 C3 | VCCINT — Core supply 1.8 V |
| 腳位 D4 | GND — Ground |
| 腳位 E5 | VCCIO1 — I/O bank 1 reference voltage |
| 腳位 F6 | I/O Bank 2 — User I/O (LVTTL/LVCMOS/PCI) |
| 腳位 G7 | I/O Bank 2 — User I/O (LVTTL/LVCMOS/PCI) |
| 腳位 H8 | TCK — JTAG test clock (boundary scan) |
| 腳位 J9 | TMS — JTAG test mode select |
| 腳位 K10 | TDO — JTAG test data out |
| 腳位 L11 | TDI — JTAG test data in |
| 腳位 M12 | nCONFIG — Configuration control (active low) |
| 腳位 N13 | nSTATUS — Configuration status (active low) |
| 腳位 P14 | CONF_DONE — Configuration complete (active high) |
典型應用
EP20K600EFC144-2XN 適用於 6 應用s: Telecommunications Line-Card Processing, Industrial Motion Control and Servo Drives, ASIC Prototyping and Emulation, High-Speed Test and Measurement Instrumentation, Military and Aerospace Signal Processing, Medical Imaging and Diagnostic Equipment.
Telecommunications Line-Card Processing
The EP20K600EFC144-2XN's 600,000 typical system gates and embedded Multiplier/DSP blocks make it well suited to telecom line-card data-path processing, where it can implement channelization, framing and protocol termination in a single device. The 24,576 LEs deliver enough logic capacity for 32-64 channel DSP pipelines, while 311 Kb of embedded RAM provides elastic buffering for cell/packet traffic. Compared to a discrete DSP-plus-CPLD approach, the APEX 20KE reduces board area and BOM count by integrating the control plane and data plane onto one die. Designers should use Altera's MegaWizard Plug-In for DDR SDRAM interface generation and verify timing closure with Quartus II TimeQuest before committing to the 144-ball FineLine BGA layout.
推薦
Industrial Motion Control and Servo Drives
The 24,576 logic elements and embedded Multiplier blocks of the EP20K600EFC144-2XN support multi-axis PID control loops, encoder decoding (quadrature, SSI, BiSS) and SVPWM generation on a single FPGA, replacing a microcontroller-plus-DSP architecture in servo drive applications. The 4 PLLs allow precise synthesis of switching frequencies (typically 8-16 kHz for IGBT drives) and the industrial -40C to +85C temperature grade ensures operation in sealed motor enclosures. Engineers should leverage Quartus II's SOPC Builder to integrate a Nios soft-core for housekeeping while running time-critical DSP in dedicated multiplier logic, paying attention to the 1.8 V core decoupling scheme documented in the APEX 20KE handbook.
推薦
ASIC Prototyping and Emulation
The EP20K600EFC144-2XN provides 600K typical system gates and high-density embedded RAM, which historically made the APEX 20KE family a popular platform for ASIC prototyping before dedicated prototyping solutions matured. Multiple APEX 20KE devices can be wire-bonded or socketed together to emulate multi-million-gate ASIC designs, with Quartus II supporting incremental compile and LogicLock regions to map RTL blocks to physical device partitions. The 144-ball FineLine BGA package simplifies socket-based daughtercard construction, although designers targeting current prototyping flows should consider Altera/Intel Stratix 10 or third-party HES platforms for higher density and faster bring-up.
推薦
High-Speed Test and Measurement Instrumentation
With 4 PLLs and embedded Multiplier/DSP blocks, the EP20K600EFC144-2XN can implement digital down-conversion, FIR/IIR filter banks and high-speed custom trigger logic for oscilloscopes, logic analyzers and protocol analyzers. The 311 Kb of embedded RAM serves as deep capture memory for sampling rates up to the datasheet-specified LVTTL toggle rates, while the LVCMOS/PCI I/O capability allows direct interfacing with high-speed ADCs and DACs. Engineers should implement FIFO buffering using ESB dual-port memory and use SignalTap II logic analyzer for verification of internal signal paths not observable at the BGA pins.
推薦
Military and Aerospace Signal Processing
The EP20K600EFC144-2XN's industrial temperature range (-40C to +85C), 0.18 um CMOS radiation-tolerant characteristics and SRAM-based reconfigurability made it a candidate for military signal-processing platforms, including radar front-end processing and secure communications link interfaces. The 4 PLLs enable precise synchronization to external reference clocks, while embedded Multiplier blocks accelerate FFT and channelization operations. For new military designs, note that APEX 20KE is obsolete; modern programs should target Rad-Hard-by-Design or Microsemi/Microchip RTG4 families with formal QML qualification.
推薦
Medical Imaging and Diagnostic Equipment
The EP20K600EFC144-2XN's combination of 600K gates, embedded RAM and Multiplier blocks is well suited to medical imaging front-ends such as ultrasound beamforming, where many parallel channels require FIR filtering, envelope detection and decimation. Using a single APEX 20KE, designers can implement 16-32 channel processing chains, while leveraging the 4 PLLs for ADC clock distribution and the LVCMOS/PCI I/O for high-speed data transfer to the host processor. Note that medical designs targeting new certification cycles should validate modern FPGA alternatives with active lifecycle and software support.
推薦
推薦產品摘要
工程參考資料，適用於 EP20K600EFC144-2XN — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP20K600EBC652-2X | EP20K600CB652C8N | EP20K600CF672C8N | EP20K400EFC672-2X | EP20K600EFC144-1XN |
|---|---|---|---|---|---|---|
| Package | 144-ball FineLine BGA | 652-ball BGA | 652-ball BGA | 672-ball BGA | 672-ball BGA | 144-ball FineLine BGA |
| Brand | Altera (Intel) | Altera | Altera | Altera | Altera | Altera |
| Typical Gates | 600,000 | 600,000 | 600,000 | 600,000 | 400,000 | 600,000 |
| Logic Elements | 24,576 | 24,576 | 24,576 | 24,576 | 16,640 | 24,576 |
| Embedded RAM | 311,040 bits | 311,040 bits | 311,040 bits | 311,040 bits | 212,992 bits | 311,040 bits |
| Speed Grade | -2 (mid-tier) | -2 | -8 (C8) | -8 (C8) | -2 | -1 (slower) |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
主要差異化特點
- 144-ball FineLine BGA packaging with same die as higher-ball-count family members (對比EP20K600EBC652-2X)
- Industrial temperature range with same die as commercial-grade EP20K600EFC144-2X (對比EP20K600EFC144-1XN)
- Higher embedded RAM than EP20K400E-family alternatives (對比EP20K400EFC672-2X)
設計說明
The APEX 20KE EP20K600EFC144-2XN requires a clean 1.8 V core supply with sequencing relative to the I/O bank VCCIO rails. Power-on must follow the order VCCINT (1.8 V core) first, then VCCIO (3.3 V/2.5 V/1.8 V I/O banks) to prevent latch-up. Estimated: based on the APEX 20KE handbook, a fully loaded EP20K600E with 75% utilization and 100 MHz toggle rates draws approximately 0.6-1.0 A on VCCINT and additional I/O bank current; verify with the PowerPlay Power Analyzer in Quartus II for your specific design.
The 144-ball FineLine BGA requires controlled-impedance microstrip/stripline routing on a multilayer PCB (typically 6-8 layers). Use 50 ohm single-ended impedance for LVTTL/LVCMOS and 100 ohm differential for LVDS pairs. Place VCCINT and VCCIO decoupling capacitors (0.1 uF + 1 uF + 10 uF) within 100 mils of each power pin. Reference the APEX 20KE development board schematics for the recommended 4-layer stack-up used by Altera's reference designs.
Do not assume APEX 20KE designs will compile directly into Quartus Prime without modification; while backward compatibility exists, some legacy IP and megafunctions may require updates. Configuration failures are commonly caused by incorrect MSEL pin settings (must match the desired configuration scheme: passive serial, passive parallel, or JTAG). Always include a pull-up on nCONFIG and a pull-down on nSTATUS per the APEX 20E configuration handbook to avoid spurious reconfiguration during power transients.
Route the 4 PLL clock inputs and outputs on inner layers with ground shielding to minimize jitter; place PLL power pins (VCCA_PLL) with their own pi-filter (ferrite bead + 0.1 uF + 10 uF) to isolate from digital VCCINT noise. For high-speed LVDS or DDR SDRAM interfaces, length-match clock-to-data traces to within the timing margin specified in the device handbook. Use Altera's Quartus II Pin Planner with board-aware I/O assignments to avoid over-subscribing any single I/O bank.
合規資訊
Compliance certifications for EP20K600EFC144-2XN are not present in the provided verified web data; consult Intel/Altera legacy documentation or distributor part detail pages for confirmed RoHS/REACH status.
