EP20K60EFC144-2XN - APEX-20KE FPGA 60K Gates 93 I/O 144-BGA | Intel/Altera
MPN： EP20K60EFC144-2XN ✗ 停產EP20K60EFC144-2XN 概覽
What is an FPGA? A Field Programmable Gate Array is a type of programmable logic device (PLD) that contains an array of configurable logic blocks (CLBs), programmable interconnects, and I/O cells - all of which can be reconfigured after manufacturing to implement arbitrary digital logic. The APEX-20KE family specifically introduced MultiCore architecture combining look-up tables (LUTs), embedded system blocks (ESBs) for memory, and a high-bandwidth interconnect fabric. In the broader taxonomy, the EP20K60EFC144-2XN is a PLD -> programmable logic -> FPGA -> SRAM-based LUT FPGA -> system-on-a-programmable-chip (SOPC) device.
Key features include 2,560 embedded array blocks / logic elements, 32,768 bits of embedded SRAM, 93 maximum user I/Os, and in-system programmability via an IEEE 1149.1 (JTAG) interface or the passive serial configuration scheme. The device supports a propagation delay in the nanosecond range and is specified for commercial temperature operation (0 C to 85 C TJ). The 144-FBGA package provides high I/O density in a small footprint suitable for space-constrained board designs.
The APEX-20KE architecture combines logic, memory, and a high-speed interconnect, allowing designers to implement datapath, control logic, and on-chip RAM in a single device. The MultiCore architecture integrates MegaLAB structures that contain LABs (Logic Array Blocks), ESBs (Embedded System Blocks), and a local interconnect, with row/column interconnect resources enabling high fanout signal distribution.
Typical applications for the EP20K60EFC144-2XN include telecommunications infrastructure (line cards, protocol bridges), industrial automation and motor control, glue logic and bus interfacing in legacy system upgrades, prototyping of ASIC designs, and embedded DSP front-ends. The combination of moderate gate count, embedded memory, and 93 I/O pins makes it appropriate for designs that exceed the capacity of CPLDs but do not require a modern high-density FPGA.
When designing with this device, ensure that the configuration scheme (passive serial, JTAG, or parallel) is correctly selected to match the system boot requirements. The 144-FBGA package requires careful PCB layout with microvia or via-in-pad technology and controlled-impedance routing to maintain signal integrity on high-speed I/O. Note that the APEX-20KE family has been classified as a mature/legacy product by Altera/Intel - verify long-term availability before committing to new designs.
This page synthesizes distributor pricing, drop-in same-package alternatives (including tape-and-reel and speed-grade variants of the same die), and practical design notes not found in the manufacturer datasheet alone, helping engineers sourcing or qualifying this legacy FPGA.
直接替換替代品，適用於 EP20K60EFC144-2XN — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP20K60EFC144-2XN （相同外形與佔位） — 差異在於 Operating Temperature, Speed Grade, Package, Process Technology, Family.
EP20K60EFC144-2X
✅ 直接替換聯絡詢價
查看資料表 →EP20K60EFC144-1XN
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
EP20K600EFC144-2XN
✅ 直接替換聯絡詢價
查看資料表 →EP20K60EFC144-2XN 最大額定值與電氣特性
| Series | APEX-20KE |
| Family | APEX-20K (MultiCore Architecture) |
| Typical Gate Count | 60,000 gates |
| Logic Elements / Embedded Array Blocks | 2,560 |
| Embedded Memory (Bits) | 32,768 |
| Maximum User I/O | 93 |
| Core Supply Voltage (VCCINT) | 1.71 V to 1.89 V |
| Package Type | 144-BGA (Fine-pitch Ball Grid Array) |
| Package Code (per MPN suffix) | FBGA / LBGA, 13x13 mm |
| 安裝類型 | Surface Mount |
| Operating Temperature (TJ) | 0 C to +85 C (commercial) |
| Speed Grade | -2 (per MPN suffix) |
| Configuration Method | JTAG (IEEE 1149.1), Passive Serial, Parallel |
| Logic Family | CMOS, SRAM-based LUT |
EP20K60EFC144-2XN fbga / lbga, 13x13 mm 腳位配置指南
EP20K60EFC144-2XN（fbga / lbga, 13x13 mm 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP20K60EFC144-2XN.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP20K60EFC144-2XN 適用於 6 應用s: Telecommunications Line Card Glue Logic, Industrial Motor Control and Automation, ASIC Prototyping and Emulation Platform, Legacy System Upgrade and Bridge Logic, Embedded DSP Front-End Processing, Display and Video Interface Bridging.
Telecommunications Line Card Glue Logic
The EP20K60EFC144-2XN fits telecommunications line card glue logic because its 60K-gate capacity, 93 user I/Os, and JTAG-based in-system programmability support protocol bridging, framing, and bus-interface functions between line-side PHYs and network processors. With 32 Kbits of embedded SRAM it can host small FIFOs and lookup tables without an external memory device, and the 144-FBGA package concentrates 93 I/Os in a 13x13 mm footprint suitable for dense line-card PCB layouts. Designers typically pair it with serializer/deserializer (SERDES) devices and use its MultiCore LABs to implement ATM/SONET framing, UTOPIA/POS-PHY interfaces, or simple TDM switching fabrics in legacy telecom equipment.
推薦
Industrial Motor Control and Automation
For industrial motor-control and PLC applications, the EP20K60EFC144-2XN provides the logic capacity to implement PWM modulators, encoder decoding, and fieldbus interfaces in a single device. Its 1.71-1.89 V core supply enables low-heat operation in factory-floor enclosures, while the 93 I/Os accommodate multi-axis servo control, encoder inputs, and opto-isolated digital I/O channels. The 32 Kbits of embedded memory support commutation tables and PID-loop coefficient storage without external RAM. The commercial 0-85 C junction temperature range covers most factory-automation environments, and the BGA package suits the dense multi-axis controller PCBs common in modern servo drives.
推薦
ASIC Prototyping and Emulation Platform
Engineers commonly use the EP20K60EFC144-2XN as an ASIC prototyping vehicle because its 2,560 logic elements and 32 Kbits of embedded SRAM map cleanly onto mid-complexity ASIC netlists for functional verification. The 93 user I/Os provide ample breakout to bring ASIC signals to test fixtures, and the JTAG configuration interface allows rapid design-iteration cycles using the Quartus II 13.0 programmer. Multiple EP20K60EFC144-2XN devices can be cascaded on a prototype board to validate larger ASICs, with the APEX-20K family supporting a coherent interconnect scheme. This application relies on the device's mature toolchain support for synthesis from VHDL/Verilog sources.
推薦
Legacy System Upgrade and Bridge Logic
Designers tasked with maintaining or upgrading legacy systems commonly deploy the EP20K60EFC144-2XN as glue-logic between older microprocessors, peripheral buses, and newer memory or interface standards. Its 93 I/Os and 1.71-1.89 V core support mixed-voltage bridging - the I/O banks can interface 5 V and 3.3 V legacy buses - and its MultiCore architecture allows a single chip to replace multiple discrete PAL/GAL devices and 74-series glue logic. The 60K-gate capacity suits complex state machines for bus arbitration, address decoding, and protocol translation in legacy mainframe, industrial controller, and military-aerospace retrofit designs.
推薦
Embedded DSP Front-End Processing
The EP20K60EFC144-2XN suits embedded DSP front-end applications - particularly preprocessing of sensor or audio data before a dedicated DSP or microcontroller - because its 32 Kbits of embedded SRAM can implement small coefficient buffers and delay lines. The MultiCore LAB architecture supports fast carry-chain arithmetic for accumulators and FIR filter taps, and the 93 user I/Os allow direct connection to multi-channel ADC front-ends. For audio systems, the device can implement sample-rate conversion or equalization; for instrumentation, it handles front-end decimation or digital filtering before handing data to a downstream processor.
推薦
Display and Video Interface Bridging
The EP20K60EFC144-2XN can serve as a video or display-interface bridge for legacy flat-panel controllers, format converters, and timing generators. Its 93 user I/Os provide ample pins to bring in parallel RGB or LVDS data paths and drive multiple output formats simultaneously, while the embedded 32 Kbits of SRAM can buffer scan-line data and lookup-table color spaces. Designers implement horizontal/vertical timing generators, gamma-correction tables, and format scalers in the MultiCore LABs, using the BGA package to keep trace lengths short on high-speed pixel clocks. The commercial temperature grade suits indoor kiosk, signage, and instrumentation display applications.
推薦
推薦產品摘要
工程參考資料，適用於 EP20K60EFC144-2XN — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP20K60EFC144-2X | EP20K60EFC144-1XN | EP20K60EFC144-2 | EP20K600EFC144-2XN |
|---|---|---|---|---|---|
| Package | 144-FBGA (13x13 mm) | 144-FBGA (13x13 mm) - same | 144-FBGA (13x13 mm) - same | 144-LQFP - different footprint | 144-FBGA (13x13 mm) - same |
| Brand | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel |
| Family / Series | APEX-20KE | APEX-20KE | APEX-20KE | APEX-20K (base) | APEX-20KE |
| Typical Gates | 60,000 | 60,000 | 60,000 | 60,000 | 600,000 |
| User I/O | 93 | 93 | 93 | 92 | 93 |
| Speed Grade | -2 | -2 | -1 (slower) | -2 | -2 |
主要差異化特點
- Identical die in different lead-finish options (對比EP20K60EFC144-2X)
- Lower-speed-grade option for cost-sensitive designs (對比EP20K60EFC144-1XN)
- Same-package upgrade path to 10x more logic (對比EP20K600EFC144-2XN)
設計說明
The 144-FBGA package has a 1.0 mm or finer ball pitch and requires PCB fabrication with microvia (laser-drilled or staggered via) technology to route signals out from the inner balls. Use via-in-pad with filled and plated-over vias for the inner-row balls that would otherwise break out only through dog-bone fan-outs. Maintain a continuous ground plane under the BGA and use 50 ohm controlled-impedance traces for clock and high-speed I/O signals. Allow at least 4 PCB layers (signal/ground/power/signal) for the BGA breakout region, with decoupling capacitors placed on the outer layer directly adjacent to the corresponding power/ground balls.
The EP20K60EFC144-2XN requires two supply rails: VCCINT (1.71-1.89 V) for the core logic and VCCIO (per-bank, up to 3.3 V) for the I/O banks. Estimated: at 100 MHz internal operation with 70% I/O toggling, the device draws approximately 300-500 mA from VCCINT and a smaller amount from VCCIO - designers should budget 1 A for VCCINT to cover inrush during configuration. Place 0.1 uF ceramic decoupling capacitors adjacent to every VCCINT and VCCIO ball pair, and add bulk 33-100 uF tantalum or polymer capacitors near the supply pins. Power-on sequencing should hold the device in reset until both VCCINT and VCCIO are stable.
Common pitfalls include: (1) attempting to use a newer Quartus version - APEX-20KE support ended with Quartus II 13.0sp1, and Quartus Prime does not support this family; (2) confusing the EP20K60EFC144-2 (LQFP, APEX-20K base, 92 I/Os) with the -2XN (FBGA, APEX-20KE, 93 I/Os); (3) omitting the configuration device - APEX-20KE requires an external EPC configuration PROM or JTAG programmer to load the bitstream; (4) not planning for JTAG chain access - bring TMS/TCK/TDO/TDI to a header for in-system programming and boundary-scan test.
合規資訊
The 'N' suffix in the MPN typically denotes a RoHS-compliant or lead-free finish per Altera/Intel part-numbering convention, but the Verified Web Data does not explicitly state RoHS, REACH, lead-free, or halogen-free status. AEC-Q100 does not apply to FPGAs of this family.
