EP2A70B724I-9 - APEX II FPGA 70K LE, BGA-724, -9 Speed | Altera / Intel
MPN： EP2A70B724I-9 ✗ 停產EP2A70B724I-9 概覽
APEX II (Advanced Programmable Element Matrix II) is Altera's second-generation MultiCore architecture FPGAs that combine look-up-table (LUT) logic, embedded system blocks (ESBs) for memory, and a hierarchical row/column interconnect for predictable timing closure. They are positioned in Altera's product hierarchy as APEX II -> APEX family -> SRAM-based programmable logic -> FPGA -> programmable logic device -> semiconductor. APEX II devices were widely adopted in high-density glue logic, data-path processing, and pre-SOC prototyping designs of the late 1990s and early 2000s.
Key features include high-density fine-grained logic with 70K typical LEs, 4,290 Kbits of embedded system block (ESB) memory for distributed RAM and FIFO applications, and the MultiCore interconnect that provides predictable row-and-column based routing. The -9 speed grade targets higher clock-frequency designs versus the slower -10 bin. The 'I' suffix designates the industrial temperature range (-40C to +100C operating), making it suitable for harsh-environment deployments. The BGA-724 package with 1.27 mm pitch is the largest in the APEX II family and supports maximum user I/O for dense interconnect.
Typical applications include high-performance data-path processing, telecom protocol engines, network switch fabric, and legacy high-density glue-logic replacement. The large embedded memory count makes it suitable for FIFO-intensive designs such as ATM/SDH framers and base-station channel cards. APEX II devices retain an installed base in industrial control and military/aerospace systems where long lifecycle support and ITAR/legacy compatibility matter more than raw modern Fmax.
When designing with the EP2A70B724I-9, engineers must use the legacy Altera Quartus II design tool (versions 4.x-9.x recommended) since later Quartus versions dropped APEX II device support after Altera's 2010+ portfolio refresh. Configuration requires an EPC4, EPC8, or EPC16 enhanced configuration device or a passive serial/PROM-based boot. Decoupling guidelines call for at least 12 bulk + 24 high-frequency capacitors distributed around the BGA power pins to control simultaneous switching noise.
直接替換替代品，適用於 EP2A70B724I-9 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP2A70B724I-9 （相同外形與佔位） — 差異在於 Package, Speed Grade, Process Technology, Logic Elements, I/O Standards Supported.
EP2A70B724I-8
✅ 直接替換聯絡詢價
查看資料表 →EP2A70B724I-7
✅ 直接替換聯絡詢價
查看資料表 →EP2A70B724C9
✅ 直接替換聯絡詢價
查看資料表 →EP2A70B724C9N
✅ 直接替換聯絡詢價
查看資料表 →EP2A70B724C9ES
✅ 直接替換聯絡詢價
查看資料表 →EP2A40B724I-9
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP2A40B724I-8
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP2A70B724I-9 最大額定值與電氣特性
| Family | APEX II |
| Logic Elements (typical) | 70,000 |
| Embedded RAM (ESB bits) | 4,290 Kbit |
| 封裝 | BGA-724 |
| Speed Grade | -9 |
| 工作溫度 | -40C to +100C (industrial, 'I' suffix) |
| Supply Voltage Core | 1.5 V (typical) |
| Supply Voltage I/O | 3.3 V (typical, multi-voltage I/O banks supported) |
| Configuration Method | Passive Serial, Passive Parallel, EPC4/EPC8/EPC16 enhanced configuration devices |
| Peak Reflow Temperature | 220 C |
| 安裝類型 | Surface Mount (BGA) |
| RoHS 狀態 | unknown |
EP2A70B724I-9 bga-724 腳位配置指南
EP2A70B724I-9（bga-724 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP2A70B724I-9.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP2A70B724I-9 適用於 7 應用s: Telecom Protocol Engine, High-Density Data-Path Processing, Network Switch Fabric Interface, Legacy Industrial Control, Test and Measurement Instrumentation, Military / Aerospace Legacy Programs, Pre-SOC Prototyping.
Telecom Protocol Engine
The EP2A70B724I-9 fits telecom protocol engines because its 70K logic elements and 4,290 Kbits of embedded system block (ESB) RAM enable parallel processing of cell/packet headers, CRC generation/checking, and FIFO buffering across high-bandwidth links. In SDH/SONET framer and ATM switch fabric designs, the FPGA's MultiCore interconnect provides the predictable row/column routing essential for meeting tight ATM cell- and SDH frame-timing budgets. Industrial-grade temperature operation supports outdoor cabinet deployments where commercial-grade parts would thermally fail. Designers chain the EP2A70B724I-9 to an EPC8 configuration device to boot at power-on without external MCU intervention.
推薦
High-Density Data-Path Processing
The EP2A70B724I-9's combination of 70K LUT-based logic elements and 4,290 Kbits of distributed ESB memory makes it well matched to wide-bit data-path designs such as HDLC framers, video encoders, and DSP pre-processors. The MultiCore interconnect distributes registers and ALU-like logic across multiple MegaLAB structures, supporting 32-bit and 64-bit datapath pipelining at 100+ MHz clock frequencies in the -9 speed grade. Industrial temperature support lets the part ride in chassis-side blade systems with elevated airflow temperatures. Compared to early-2000s ASIC NRE, the APEX II offers similar logic density with field-upgradable bitstreams.
推薦
Network Switch Fabric Interface
Switch fabric cards of the late 1990s and early 2000s relied on APEX II-class FPGAs like the EP2A70B724I-9 to bridge multiple PHYs/MACs to the central switching ASIC. The BGA-724's high pin count exposes enough user I/O for 8-16 simultaneous Gigabit Ethernet MAC interfaces, while 4,290 Kbits of ESB memory buffers packet bursts between line-rate ingress and the switching core. Industrial temperature supports line-card deployments in thermally loaded chassis. Configuration via passive serial with an EPC8 keeps the BOM small for cost-sensitive line cards.
推薦
Legacy Industrial Control
Many factory-automation controllers continue to use APEX II FPGAs like the EP2A70B724I-9 because the installed base, certified firmware, and long-life replacement stocks are mature. The industrial -40C to +100C temperature range meets IEC 60068-2 cold and hot-soak test requirements for shop-floor deployment, while the BGA-724's high I/O count allows direct glue-logic replacement of multiple discrete CPLDs on legacy boards. The -9 speed grade supports deterministic scan-time implementation for PLC backplanes where microsecond jitter is unacceptable.
推薦
Test and Measurement Instrumentation
Test-and-measurement platforms (logic analyzers, protocol testers, ATE pin cards) historically used the EP2A70B724I-9 for stimulus generation, response capture, and protocol-decoder logic. Its 4,290 Kbits of ESB memory holds deep capture buffers, while the -9 speed grade meets timing margins of 200 MHz+ parallel interfaces such as LVDS and PCI. Industrial temperature operation supports bench and lab environments without active cooling. Multi-voltage I/O banks interface directly to 1.8 V, 2.5 V, 3.3 V, and 5 V DUT rails without level shifters.
推薦
Military / Aerospace Legacy Programs
Long-lifecycle defense and aerospace programs retain the EP2A70B724I-9 because re-design certification of a replacement FPGA in avionics, radar signal conditioning, or electronic warfare subsystems can cost millions and delay deployment by years. The industrial -40C to +100C range supports MIL-STD-810 environmental envelopes, while the BGA-724 package is compatible with long-qualified PCB layouts. Altera has historically supported APEX II in long-life-buy programs for defense customers. The -9 speed grade delivers deterministic timing for radar DSP pre-processing and serial-bus bridging.
推薦
Pre-SOC Prototyping
Before ASIC/SOC fabrication, designers prototype the system in APEX II-class FPGAs such as the EP2A70B724I-9 because the 70K LE count and embedded memory provide enough headroom for an entire SOC's peripheral set plus a soft processor. The MultiCore interconnect offers realistic timing closure that closely predicts ASIC synthesis results, improving pre-tapeout sign-off confidence. BGA-724 high I/O count exposes ample pins for ASIC boundary-signal breakout. Industrial temperature rating lets engineers validate prototypes in the actual deployment chassis before ASIC silicon returns.
推薦
推薦產品摘要
工程參考資料，適用於 EP2A70B724I-9 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP2A70B724I-8 | EP2A70B724I-7 | EP2A70B724C9 | EP2A70B724C9N | EP2A40B724I-9 |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | BGA-724 | BGA-724 - same | BGA-724 - same | BGA-724 - same | BGA-724 - same | BGA-724 - same |
| Logic Elements | 70,000 | 70,000 | 70,000 | 70,000 | 70,000 | 40,000 |
| Speed Grade | -9 | -8 (slower) | -7 (slowest) | -9 | -9 | -9 |
| Operating Temperature | -40C to +100C (industrial) | -40C to +100C (industrial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) |
| RoHS / Lead-Free | unknown | unknown | unknown | unknown | RoHS / lead-free (N suffix) | unknown |
| Approx. Unit Price (USD, qty 1) | 1,450 | ~1,250 | ~1,150 | ~1,400 | ~1,420 | ~1,200 |
主要差異化特點
- Faster speed grade within same BGA-724 footprint (對比EP2A70B724I-8)
- Industrial temperature vs commercial-temperature -9 alternatives (對比EP2A70B724C9)
- Highest density drop-in vs the EP2A40 family (對比EP2A40B724I-9)
設計說明
Estimated: at VCCINT=1.5V, full 70K-LE utilisation at 50% toggle rate, the EP2A70B724I-9 dissipates approximately 3-5 W. The BGA-724 thermal resistance is design-dependent on PCB stack-up and copper area - target at least 4-layer FR-4 with continuous inner-plane copper under the BGA to keep junction temperature below 100C. Add a thermal pad array under the package and consider aluminium heatsinks for high-ambient (>70C) industrial cabinets.
The EP2A70B724I-9 requires separate VCCINT (1.5 V core), VCCIO (3.3 V typical, with bank-selectable 1.8/2.5/3.3 V I/O voltages), and VCCPD (3.3 V) supplies. Decoupling guidelines call for 100 nF X7R capacitors on every VCC pin pair and at least four 47 uF bulk capacitors around the BGA perimeter. Sequence VCCINT before VCCIO/VCCPD to avoid I/O latch-up during power-up; add a soft-start controller if hot-plugging is required.
BGA-724 with 1.27 mm pitch requires PCB microvia stack-ups (laser-drilled 0.30-0.45 mm vias on 1.27 mm grid) on at least 6-layer stack-up. Fan-out routing must respect 50 ohm impedance-controlled traces for clock and high-speed I/O such as LVDS. Place configuration EPC8/EPC16 device within 50 mm of the FPGA to minimise passive-serial trace length, and route nSTATUS/nCONFIG/CONF_DONE as 4-wire impedance-matched buses with series-termination resistors near the FPGA end.
Newer Quartus versions (10.0+) dropped APEX II device support - use Quartus II 9.1 SP2 or earlier for bitstream generation. Programming files generated by Quartus Prime or Quartus Pro will NOT support the EP2A70B724I-9. Pin descriptions in the APEX II Pin Information file (.pin) must be cross-checked against the EP2A70B724I-9 device pinout, since the EP2A40 and EP2A70 in the same BGA-724 package share most but not all user I/O assignments on dedicated clock pins.
APEX II LVDS inputs require external 100-ohm differential termination across the receiver pair - the FPGA does NOT include on-die termination. For DDR-style source-synchronous interfaces, route data and clock traces on the same layer with matched length tolerance of +/-25 mils. Simultaneous switching noise (SSN) on the 33 x 33 BGA can corrupt clocks; use internal VREF pins for SSTL/HSTL standards and add 0.1 uF + 10 uF decoupling stacks within 100 mils of each switching I/O bank.
合規資訊
Part is obsolete - original Altera/Intel compliance documentation no longer published on the manufacturer's current site. RoHS/REACH data not available in the verified web data set; verify with distributor documentation if compliance is required.
