EP2AGX125DF25I5G - Arria II GX FPGA 118K LE, 8.3Mb, 572-FCBGA
MPN： EP2AGX125DF25I5G ✓ 啟用中EP2AGX125DF25I5G 概覽
A field-programmable gate array (FPGA) is a reprogrammable semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as transceivers, DSP blocks, and embedded RAM. FPGAs sit within the programmable logic hierarchy as cousins to CPLDs and ASICs, and they are widely used to implement custom digital signal processing, high-speed serial interfaces, and glue logic without the NRE cost of an ASIC. The Arria II GX family targets mid-range applications that need a balance of logic density, transceiver bandwidth, and power efficiency.
Key features of the EP2AGX125DF25I5G include 8.315 Mbits of on-chip memory (about 8.3 Mb), 576 (9-bit) embedded multiplier blocks, and 12 full-duplex transceivers with CMU, PMA, and PCS support up to 3.75 Gbps. The -I5 speed grade and industrial -40C to +100C junction temperature rating make it suitable for harsh environments, while the 572-pin FC-FBGA package supports high signal integrity for dense, multi-gigabit designs.
The architecture combines a fine-grained logic fabric with dedicated hard IP blocks, reducing power versus a soft-only implementation and freeing fabric resources for user logic. Designers use Quartus II to compile, place-and-route, and program the device via JTAG or active serial configuration, allowing rapid design iteration.
Typical applications include wireless baseband processing, high-speed serial protocol bridging (PCIe Gen1/Gen2, CPRI, OBSAI, XAUI, SDI), video and imaging pipelines, and industrial control planes that demand deterministic latency. The transceiver-rich fabric is particularly well matched to telecom fronthaul and backhaul.
When designing with this device, plan the PCB for FC-FBGA fan-out, thermal management (multiple GND balls for the exposed die), and reference-clock distribution, because transceivers require very clean, low-jitter clocks to meet eye-mask compliance.
直接替換替代品，適用於 EP2AGX125DF25I5G — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP2AGX125DF25I5G （相同外形與佔位） — 差異在於 Package, Speed Grade, Mounting Type, DSP Blocks, Transceivers.
EP2AGX125DF25I3G
✅ 直接替換聯絡詢價
查看資料表 →EP2AGX125DF25C6G
✅ 直接替換聯絡詢價
查看資料表 →EP2AGX125DF25C5G
✅ 直接替換聯絡詢價
查看資料表 →EP2AGX125DF25C4G
✅ 直接替換聯絡詢價
查看資料表 →EP2AGX125EF29I5G
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查看資料表 →EP2AGX125DF25I5G 最大額定值與電氣特性
| Family | Arria II GX |
| Logic Elements | 118,143 |
| Embedded Memory (Bits) | 8,315,904 |
| User I/O Count | 260 |
| Number of Transceivers | 12 |
| Transceiver Data Rate (max) | 3.75 Gbps |
| Embedded Multipliers (9-bit) | 576 |
| Core Voltage | 0.9 V |
| 工作溫度 | -40C to +100C (Industrial) |
| Speed Grade | I5 |
| 封裝 | 572-BGA, FC-FBGA |
| 安裝類型 | Surface Mount |
| MSL 等級 | 3 |
| RoHS 狀態 | Compliant |
| Lead-Free | Yes |
EP2AGX125DF25I5G 572-bga, fc-fbga 腳位配置指南
EP2AGX125DF25I5G（572-bga, fc-fbga 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP2AGX125DF25I5G.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP2AGX125DF25I5G 適用於 6 應用s: Wireless Baseband Processing, High-Speed Serial Protocol Bridging, Video and Imaging Pipelines, Industrial Control and Automation, Telecom Fronthaul and Backhaul, Test and Measurement Instrumentation.
Wireless Baseband Processing
The EP2AGX125DF25I5G fits wireless baseband processing because it combines 118,143 logic elements with 576 9-bit embedded multipliers and 8.3 Mb of block RAM, providing the DSP fabric needed for LTE, WiMAX, and similar OFDM baseband pipelines. The 12 transceivers running up to 3.75 Gbps support CPRI and OBSAI fronthaul links between baseband units and remote radio heads. Industrial -40C to +100C operation enables outdoor base-station and small-cell deployment without derating.
推薦
High-Speed Serial Protocol Bridging
For PCIe Gen1/Gen2 endpoint or root-complex bridging, XAUI, SDI, or CPRI aggregation, the EP2AGX125DF25I5G offers 12 integrated transceivers at up to 3.75 Gbps each - enough lanes for x4 PCIe plus auxiliary serial links on a single device. Its dedicated PMA/PCS hard IP simplifies PHY compliance work, and the 8.3 Mb of embedded memory acts as packet buffering between the bridge and host CPU. The 572-ball FC-FBGA preserves signal integrity on multi-gigabit traces.
推薦
Video and Imaging Pipelines
The EP2AGX125DF25I5G suits broadcast video and machine-vision pipelines thanks to its 576 DSP multipliers (driving pixel-rate processing) and 260 user I/Os (supporting wide parallel camera buses, HDMI/DVI interfaces, and SDI serializer/deserializer companion chips). The 8.3 Mb block RAM buffers line-scan and frame buffers without external SRAM, simplifying PCB layout and reducing BOM cost. Industrial temperature rating is valuable for outdoor surveillance and factory imaging systems.
推薦
Industrial Control and Automation
In PLC, motor-control, and deterministic industrial networks, the EP2AGX125DF25I5G provides reliable programmable logic with industrial temperature operation from -40C to +100C. Designers can integrate multiple EtherCAT, PROFINET, or SERCOS III slaves alongside proprietary deterministic protocols using the FPGA fabric, while the 12 transceivers carry high-speed backplane or inter-module links. The robust FC-FBGA package handles vibration and thermal-cycling environments typical of factory floors.
推薦
Telecom Fronthaul and Backhaul
The EP2AGX125DF25I5G is a strong fit for CPRI/OBSAI fronthaul aggregation and small-cell backhaul routers because it pairs 12 transceivers up to 3.75 Gbps with enough logic for layer-1/2 forwarding, encryption, and timing distribution. Its industrial temperature range and 572-ball FC-FBGA signal-integrity package suit outdoor enclosures and high-density line cards. The 8.3 Mb of embedded memory also enables substantial packet queuing without external SSRAM.
推薦
Test and Measurement Instrumentation
The EP2AGX125DF25I5G supports high-channel-count T&M instruments by combining 260 user I/Os for parallel ADC/DAC interfaces, 576 DSP multipliers for real-time FFT/channelization, and 12 transceivers for fast data offload to host processors over PCIe or XAUI. The 8.3 Mb of block RAM captures deep time-domain windows without external memory. Industrial temperature operation makes the device usable in lab and field-portable equipment alike.
推薦
推薦產品摘要
工程參考資料，適用於 EP2AGX125DF25I5G — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP2AGX125DF25I3G | EP2AGX125DF25C6G | EP2AGX125DF25C5G | EP2AGX125DF25C4G |
|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera |
| Package | 572-BGA, FC-FBGA | 572-BGA, FC-FBGA | 572-BGA, FC-FBGA | 572-BGA, FC-FBGA | 572-BGA, FC-FBGA |
| Logic Elements | 118,143 | 118,143 | 118,143 | 118,143 | 118,143 |
| Embedded Memory (Bits) | 8,315,904 | 8,315,904 | 8,315,904 | 8,315,904 | 8,315,904 |
| Transceivers | 12 | 12 | 12 | 12 | 12 |
| Transceiver Max Data Rate | 3.75 Gbps | 3.75 Gbps | 3.75 Gbps | 3.75 Gbps | 3.75 Gbps |
| Speed Grade | I5 (industrial) | I3 (industrial, faster) | C6 (commercial, faster) | C5 (commercial) | C4 (commercial, slower) |
| Operating Temperature | -40C to +100C | -40C to +100C | 0C to +85C | 0C to +85C | 0C to +85C |
| User I/O Count | 260 | 260 | 260 | 260 | 260 |
主要差異化特點
- Industrial temperature rating in a mid-density Arria II GX device (對比EP2AGX125DF25C6G)
- Balanced speed grade (I5) vs fastest option (對比EP2AGX125DF25I3G)
- 12 transceivers at 3.75 Gbps in mid-power family (對比EP2C50F672I8N (Cyclone II))
設計說明
Estimated: Arria II GX FPGAs in the 572-ball FC-FBGA package dissipate roughly 6-10 W typical and can reach 12-15 W at high transceiver utilization, based on Altera PowerPlay early estimator assumptions for the EP2AGX125 device. The FC-FBGA exposes the die through the package top, so a heatsink with thermal interface material is recommended, plus generous PCB copper thermal vias under the central GND ball grid to keep junction temperature within the 100C industrial limit.
Lay out the 572-ball FC-FBGA with microvia stack-up (laser-drilled microvias to inner escape layers) and matched-length differential pairs for the 12 transceiver channels. Reference-clock traces must be length-matched within 25 mil and isolated from noisy switching nets; place a clean, low-jitter clock source within 2 inches of the CLK inputs and follow Altera's Arria II GX board design guidelines for via-in-pad and decoupling (place 0.1 uF + 10 uF capacitors within 100 mil of each power pin).
Provide at least three independent supplies - core (0.9 V), PLL analog (VCCA_PLL), and transceiver supplies (VCCA_TX/RX) - each with its own ferrite bead and bulk decoupling per Altera's Arria II GX pin connection guidelines. Sequence supplies per Altera's recommended power-on/-off order to avoid latch-up; failing to sequence can permanently damage the device. Use a multi-rail controller such as the LTM4675 or similar to simplify compliance.
Do not migrate between speed grades (I5 to C6, etc.) without re-running Quartus II timing analysis, because the same design may fail timing closure on a slower grade. Industrial vs commercial temperature grades also affect junction thermal models and may change PowerPlay estimates. Always re-fit the design in Quartus whenever any ordering-code field changes.
合規資訊
RoHS compliance per Altera/Intel Arria II GX product page; AEC-Q100 not applicable (FPGAs are typically not AEC-Q100 qualified at the -I5 industrial level); conflict-minerals compliant per Intel supplier disclosures.
