EP2AGX45DF25I5G - Arria II GX 45K FPGA, 252 I/O, 572-FBGA | Intel
MPN： EP2AGX45DF25I5G ✗ 停產EP2AGX45DF25I5G 概覽
An FPGA (Field-Programmable Gate Array) is a programmable logic device containing an array of configurable logic blocks (CLBs), embedded memory blocks, DSP slices, programmable interconnect, and a periphery of user I/O. FPGAs sit at the top of the programmable logic hierarchy alongside CPLDs, and below ASICs in performance-per-watt but above them in flexibility and time-to-market. The Arria II GX family specifically integrates multi-gigabit transceivers and hard PCI Express blocks, positioning the device between pure logic fabrics (Cyclone) and high-end DSP/ transceiver families (Stratix).
Key features include dedicated 3.125 Gbps transceivers, embedded hard IP for PCI Express Gen1 (×1, ×4, ×8), 2.7 Mbits of on-chip memory, 156 embedded 18×18 multipliers, and a 500 MHz fabric performance. The -I5 speed/temperature grade delivers industrial temperature range support and a moderate speed bin suitable for cost-sensitive transceiver designs. The 0.9 V core supply supports enhanced low-power operation versus earlier 90/65 nm generations.
The architecture combines logic fabric, embedded memory, DSP blocks, and transceivers in a single die, with hard IP blocks for PCIe, memory controllers, and the CDR/PCS that back the multi-gigabit serial links. Designers use the Quartus II design suite (or later Quartus Prime) with the Arria II Device Handbook for implementation, timing closure, and transceiver configuration.
Typical applications include wireless baseband processing, broadcast and professional video equipment, radar and signal-intelligence front ends, high-speed serial protocol bridging (PCIe, Serial RapidIO, CPRI), and industrial imaging pipelines. The transceiver count and PCIe Gen1 hard IP make the part especially attractive for wireless remote radio heads and video capture cards.
When designing with the EP2AGX45DF25I5G, allocate adequate PCB layers for the FC-FBGA break-out, follow Intel's transceiver reference design for the 25 mm × 25 mm footprint, and validate signal-integrity for any SERDES link running above 1 Gbps. The -I5 grade is suitable for industrial-temperature deployments but is not automotive-grade; for automotive use, migrate to an AEC-Q100-qualified equivalent.
This page synthesizes distributor pricing, same-package drop-in alternatives, and application design notes that complement (and in places extend) the information found in the manufacturer datasheet and Arria II GX handbook.
直接替換替代品，適用於 EP2AGX45DF25I5G — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP2AGX45DF25I5G （相同外形與佔位） — 差異在於 Package, Speed Grade, Operating Temperature, Logic Elements, PCIe Hard IP.
EP2AGX45DF25I5
✅ 直接替換聯絡詢價
查看資料表 →EP2AGX45DF25C5G
✅ 直接替換聯絡詢價
查看資料表 →EP2AGX45DF25I3G
✅ 直接替換聯絡詢價
查看資料表 →EP2AGX65DF25I5G
✅ 直接替換聯絡詢價
查看資料表 →EP2AGX125DF25I5G
✅ 直接替換聯絡詢價
查看資料表 →EP2AGX45DF25I5G 最大額定值與電氣特性
| Family | Arria II GX |
| Logic Elements (LE) | 42,959 |
| User I/O Count | 252 |
| 封裝 | 572-FBGA (FC-FBGA, 25 mm × 25 mm, 1.0 mm pitch) |
| Process Technology | 40 nm |
| Core Voltage | 0.9 V |
| Maximum Fabric Frequency | 500 MHz |
| Transceivers | Up to 3.125 Gbps |
| Embedded Memory | 2.7 Mbits |
| Embedded 18×18 Multipliers | 156 |
| PCIe Hard IP | PCI Express Gen1 (×1, ×4, ×8) |
| Speed Grade | I5 |
| 工作溫度 | -40 °C to +100 °C (industrial) |
| 安裝類型 | Surface Mount |
| RoHS 狀態 | Compliant (Pb-free) |
EP2AGX45DF25I5G 572-fbga (fc-fbga, 25 mm × 25 mm, 1.0 mm pitch) 腳位配置指南
EP2AGX45DF25I5G（572-fbga (fc-fbga, 25 mm × 25 mm, 1.0 mm pitch) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP2AGX45DF25I5G.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP2AGX45DF25I5G 適用於 6 應用s: Wireless Baseband Processing, Broadcast and Professional Video Equipment, Radar and Signal-Intelligence Front Ends, PCIe Gen1 Endpoint and Bridge Cards, High-Speed Serial Protocol Bridging, Industrial Imaging and Machine Vision.
Wireless Baseband Processing
The EP2AGX45DF25I5G's 42,959 logic elements, 156 embedded 18×18 multipliers, and 2.7 Mbits of on-chip memory provide sufficient DSP fabric for LTE and WiMAX baseband channel cards, while the integrated multi-gigabit transceivers deliver CPRI/OBSAI links to remote radio heads at up to 3.125 Gbps. Placed on a baseband card with a 10-layer PCB and matched-impedance SERDES routing, the -I5 industrial temperature grade supports outdoor-mounted base stations. Unlike ASIC-based baseband solutions, the FPGA fabric enables late-binding protocol updates and multi-standard support.
推薦
Broadcast and Professional Video Equipment
The 3.125 Gbps transceivers on EP2AGX45DF25I5G handle SDI, HDMI, and DisplayPort multi-lane serialization for broadcast video routers, format converters, and production switchers. The 252 user I/Os support multiple parallel video interfaces simultaneously, and the embedded memory buffers full-HD frames without external DDR in many configurations. The industrial temperature grade enables deployment in uncooled broadcast cabinets and outside-broadcast trucks where temperature swings are common.
推薦
Radar and Signal-Intelligence Front Ends
The 156 embedded 18×18 multipliers deliver the DSP throughput needed for digital down-conversion, pulse compression, and beamforming in radar and SIGINT receivers. The transceivers digitize RF outputs directly from ADC devices at multi-gigabit sample rates, while the 42K-LE fabric implements FFT engines and adaptive filters. The industrial temperature grade supports ruggedized defense and avionics enclosures, and the 572-FBGA package enables dense PCB layouts for size-constrained platforms.
推薦
PCIe Gen1 Endpoint and Bridge Cards
The EP2AGX45DF25I5G includes hard PCI Express Gen1 IP supporting ×1, ×4, and ×8 lane configurations, enabling direct PCIe endpoint implementations without external bridge chips. This is ideal for data acquisition cards, software-defined radio cards, and protocol bridge boards that interface to host CPUs through PCIe. The transceivers provide additional SERDES for SATA, Serial RapidIO, or custom serial links alongside the PCIe interface, eliminating multiple protocol bridge ASICs.
推薦
High-Speed Serial Protocol Bridging
The multi-gigabit transceivers and PCIe Gen1 hard IP make EP2AGX45DF25I5G ideal for bridging between incompatible serial protocols, such as Serial RapidIO to PCIe, CPRI to Ethernet, or Aurora to custom backplanes. The 42K-LE fabric implements protocol adaptation logic, while the transceivers handle physical-layer serialization up to 3.125 Gbps per channel. Industrial temperature grade supports deployment in factory floors, outdoor cabinets, and industrial control systems.
推薦
Industrial Imaging and Machine Vision
The EP2AGX45DF25I5G's high user I/O count (252) accepts multiple Camera Link, CoaXPress, or LVDS camera inputs simultaneously, while the transceivers support CoaXPress and 10 GigE Vision over a single cable. The embedded memory buffers raw Bayer frames before compression, and the DSP multipliers accelerate JPEG, H.264, or custom image-processing pipelines. The industrial temperature grade and surface-mount FC-BGA package suit factory-floor vision systems with continuous operation.
推薦
推薦產品摘要
工程參考資料，適用於 EP2AGX45DF25I5G — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP2AGX45DF25I5 | EP2AGX45DF25C5G | EP2AGX45DF25I3G | EP2AGX65DF25I5G | EP2AGX125DF25I5G |
|---|---|---|---|---|---|---|
| Package | 572-FBGA (DF25, 25x25 mm, 1.0 mm pitch) | 572-FBGA (DF25, 25x25 mm) - same | 572-FBGA (DF25, 25x25 mm) - same | 572-FBGA (DF25, 25x25 mm) - same | 572-FBGA (DF25, 25x25 mm) - same | 572-FBGA (DF25, 25x25 mm) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 42,959 | 42,959 | 42,959 | 42,959 | ~56,400 (+31%) | ~118,500 (+176%) |
| User I/Os | 252 | 252 | 252 | 252 | 252 | 252 |
| Speed Grade | I5 (industrial, -40 to +100 °C) | I5 (industrial) | C5 (commercial, 0 to +85 °C) | I3 (slower industrial) | I5 (industrial) | I5 (industrial) |
| Transceivers | Up to 3.125 Gbps | Up to 3.125 Gbps | Up to 3.125 Gbps | Up to 3.125 Gbps | Up to 3.125 Gbps | Up to 3.125 Gbps (more channels) |
| Embedded Memory | 2.7 Mbits | 2.7 Mbits | 2.7 Mbits | 2.7 Mbits | ~4.0 Mbits | ~8.0 Mbits |
| Embedded 18×18 Multipliers | 156 | 156 | 156 | 156 | ~264 | ~488 |
| Pb-free / RoHS | Yes (G suffix) | No (leaded) | Yes (G suffix) | Yes (G suffix) | Yes (G suffix) | Yes (G suffix) |
主要差異化特點
- Industrial temperature grade with -I5 speed bin in 572-FBGA package (對比EP2AGX45DF25C5G)
- Pin-compatible with higher-density EP2AGX65 and EP2AGX125 variants (對比EP2AGX65DF25I5G)
- Pb-free / RoHS compliant packaging with G suffix (對比EP2AGX45DF25I5)
設計說明
Estimated: The 572-ball FC-BGA at 1.0 mm pitch requires a high-density PCB stack-up - use at least 10 layers with microvia (laser-drilled) technology for breakout. Per Intel's Arria II GX Handbook, route all transceiver differential pairs on the top layers with matched impedance (100 Ω differential for 3.125 Gbps), and keep total SERDES trace length under 100 mm to maintain signal-integrity margin. Use a continuous ground plane under the BGA balls and stitch ground vias around the periphery.
Estimated: At maximum fabric utilization with 3.125 Gbps transceivers active, the EP2AGX45DF25I5G core power draw typically reaches 5-8 W. Provide separate 0.9 V core, 1.2 V transceiver, 2.5 V auxiliary, and 3.3 V I/O rails with high-frequency decoupling (10 nF + 100 nF + 10 µF combinations) placed as close as possible to each supply ball. Use at least 4 decoupling capacitors per supply pin group per Intel's pin connection guidelines.
Do not assume any I/O bank can operate at any voltage - the Arria II GX has separate banks for LVDS, LVCMOS, and SERDES with strict VCCIO compatibility. Verify pin assignments with the Quartus pin planner before layout. Also note that the -I5 industrial temperature grade is NOT automotive-qualified; do not deploy in automotive applications without an AEC-Q100-qualified variant.
Estimated: At 7 W total power dissipation, the FC-BGA package requires thermal management. With theta_JA typically around 12-15 °C/W for the 25×25 mm FC-BGA, junction temperature rises approximately 84-105 °C above ambient without forced airflow. Implement a heatsink or thermal pad with at least 2 cfm airflow for industrial-temperature deployments where ambient may reach +85 °C.
For 3.125 Gbps SERDES channels, follow Intel's transceiver layout guidelines strictly: maintain 100 Ω differential impedance, length-match P/N within 0.5 mm, keep AC-coupling capacitors close to the transmitter side, and provide a continuous reference ground plane. Series-of-emphasis and pre-emphasis settings should be tuned per channel using the Transceiver Toolkit in Quartus II.
合規資訊
RoHS compliance indicated by 'G' suffix in MPN. Not AEC-Q100 qualified; the -I5 industrial grade is suitable for non-automotive industrial applications. Halogen-free status not explicitly stated in provided data.
