EP2AGX65DF29C4G - Arria II GX FPGA 65K LE FCBGA-780 | Intel
MPN： EP2AGX65DF29C4G ✓ 啟用中EP2AGX65DF29C4G 概覽
An FPGA (Field-Programmable Gate Array) is a programmable logic device built from an array of configurable logic blocks (CLBs), embedded block RAM, DSP slices, and programmable interconnect. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs), which include CPLDs and SPLDs. Arria II GX specifically targets mid-range applications needing transceivers, DSP blocks, and a balance of logic, memory, and I/O bandwidth without the power cost of Stratix-class devices.
Key features of the EP2AGX65DF29C4G include 4.8125 Kbits of M9K block RAM (effectively 536 blocks of M9K + M-RAM equivalents totaling the 5,371,904-bit figure), up to 16 global clock trees plus 96 peripheral PLLs, hard PCIe Gen1/Gen2 IP blocks, and dedicated 6.5536 Gbps-capable transceivers. The 0.9 V core voltage with adaptive voltage scaling reduces dynamic power, while the -4 speed grade places it in the mid-speed tier within the Arria II GX family. The 29 mm flip-chip BGA package supports high-density board designs but requires careful PCB stack-up planning.
Typical applications include wireless infrastructure baseband cards, broadcast video processing, military radar signal chains, and PCIe-based industrial control cards. The integrated transceivers and PCIe hard IP eliminate external SERDES for many designs, while the abundant block memory suits packet buffering and FFT scratchpad storage.
Designers should plan thermal dissipation carefully - the flip-chip BGA package couples heat directly into the PCB, so a multi-layer PCB with inner copper ground/thermal planes is recommended. The Quartus II software suite (16.1 and earlier; later Quartus Prime in compatibility mode) is the supported toolchain.
直接替換替代品，適用於 EP2AGX65DF29C4G — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP2AGX65DF29C4G （相同外形與佔位） — 差異在於 Package, Speed Grade, Operating Temperature, Mounting Type, RoHS Status.
EP2AGX45DF29C4G
✅ 直接替換聯絡詢價
查看資料表 →EP2AGX65DF29C3N
✅ 直接替換聯絡詢價
查看資料表 →EP2AGX65CU17C4G
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP2AGX95DF29C4G
✅ 直接替換📋 參考替代品（不在目錄中）
EP2AGX125EF29C6N
✅ 直接替換📋 參考替代品（不在目錄中）
EP2AGX65DF29C4G 最大額定值與電氣特性
| Family | Arria II GX |
| Logic Elements | 60,214 |
| Adaptive Logic Modules (ALMs) | 30,107 |
| Embedded Memory | 5,371,904 bits |
| Number of LABs/CLBs | 2,530 |
| User I/O Count | 364 |
| Number of Transceivers | 8 |
| Transceiver Data Rate | up to 3.75 Gbps (6.5536 Gbps with -4 grade using CPRI mode) |
| Core Voltage | 0.9 V |
| Operating Frequency | 500 MHz |
| 工作溫度 | 0C to +85C (commercial) |
| Speed Grade | -4 (mid-speed) |
| 封裝 | 780-BBGA, FCBGA (29 mm) |
| Process Node | 40 nm (Arria II generation) |
| 安裝類型 | Surface Mount |
| RoHS 狀態 | Compliant |
| Lead Free | Yes |
| MSL 等級 | 3 (per JEDEC J-STD-020) |
EP2AGX65DF29C4G 780-bbga, fcbga (29 mm) 腳位配置指南
EP2AGX65DF29C4G（780-bbga, fcbga (29 mm) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP2AGX65DF29C4G.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP2AGX65DF29C4G 適用於 6 應用s: Wireless Baseband Processing, Broadcast Video Processing, Industrial PCIe Control Cards, Military Radar Signal Chains, Medical Imaging Systems, Test & Measurement Instrumentation.
Wireless Baseband Processing
The EP2AGX65DF29C4G's 60,214 logic elements and 8 transceivers at 3.75 Gbps make it well-suited for LTE and WiMAX baseband cards. The 5,371,904 bits of embedded memory provides ample packet buffering for HARQ and MIMO processing, while the hard PCIe Gen1/Gen2 IP block enables clean interface to baseband SoCs over standard backplanes.
推薦
Broadcast Video Processing
With 364 user I/Os and abundant block RAM, the EP2AGX65DF29C4G handles multi-channel SDI video routing, format conversion, and color space conversion. The 0.9 V core voltage and adaptive voltage scaling reduce heat in dense video chassis, while the 3.75 Gbps transceivers support SD-SDI, HD-SDI, and 3G-SDI without external SERDES chips on most designs.
推薦
Industrial PCIe Control Cards
The hard PCIe Gen1/Gen2 IP block inside the EP2AGX65DF29C4G eliminates the need for external bridge chips, reducing BOM cost and latency for industrial PCIe cards. Combined with 364 user I/Os and 5 Mbits of block RAM, the device is well-matched to motor control, factory automation, and high-speed data acquisition card designs.
推薦
Military Radar Signal Chains
The 8 integrated transceivers and 60,214 LEs enable phased-array radar digital receiver designs where multiple ADC channels feed DSP processing on the FPGA. The 5 Mbit embedded memory supports FFT scratchpad storage, while the 780-ball FCBGA provides robust thermal performance for ruggedized military enclosures with conduction cooling.
推薦
Medical Imaging Systems
Ultrasound and digital X-ray front-ends leverage the EP2AGX65DF29C4G's parallel I/O bandwidth and block RAM for real-time beamforming and image reconstruction. The mid-range logic capacity suits 32-128 channel ultrasound carts, while the integrated transceivers simplify connection to back-end image processing servers over gigabit serial links.
推薦
Test & Measurement Instrumentation
The combination of 364 user I/Os, 8 high-speed transceivers, and 60,214 LEs makes the EP2AGX65DF29C4G ideal for protocol analyzers, BERT testers, and high-speed logic analyzers. Engineers can implement multi-standard protocol decoding in the FPGA fabric while using dedicated transceivers for 10GbE, USB 3.0, or PCIe Gen2 compliance test points.
推薦
推薦產品摘要
工程參考資料，適用於 EP2AGX65DF29C4G — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP2AGX45DF29C4G | EP2AGX65DF29C3N | EP2AGX95DF29C4G | EP2AGX125EF29C6N |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 780-BBGA, FCBGA (29 mm) | 780-BBGA, FCBGA (29 mm) - same | 780-BBGA, FCBGA (29 mm) - same | 780-BBGA, FCBGA (29 mm) - same | 780-BBGA, FCBGA (29 mm) - same |
| Logic Elements | 60,214 | 41,910 (-30%) | 60,214 (same) | ~95,000 (+58%) | 124,600 (+107%) |
| Embedded Memory | 5,371,904 bits | 2,457,600 bits (-54%) | 5,371,904 bits (same) | ~7 Mbits | 8,121,216 bits |
| User I/Os | 364 | 364 | 364 | 364 | 372 |
| Transceivers | 8 (up to 3.75 Gbps) | 8 | 8 | 12 | 12 |
| Speed Grade | -4 | -4 | -3 (slower) | -4 | -6 (faster) |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
主要差異化特點
- Balanced mid-range density with full transceiver support (對比EP2AGX45DF29C4G)
- Speed grade -4 balances Fmax and cost (對比EP2AGX125EF29C6N)
- Integrated 3.75 Gbps transceivers eliminate external SERDES (對比Cyclone IV E FPGAs)
設計說明
Estimated: At full utilization of 60,214 LEs at 500 MHz with 0.9 V core, the EP2AGX65DF29C4G can consume 5-8 W dynamic power. The 780-ball flip-chip BGA couples heat directly into the PCB - design a 6+ layer PCB with a dedicated inner ground/thermal plane and at least 50 thermal vias under the die for adequate dissipation. Without thermal planning, junction temperatures can exceed the 125C maximum under industrial workloads.
The 29 mm FCBGA package uses a 1.0 mm ball pitch - requires laser-drilled or precision mechanical-drilled microvias for breakout. Use a 1-2-1 or 1-2-2-1 PCB stack-up with low-loss dielectric (Df < 0.005 at 1 GHz) for transceiver signal integrity. Decoupling: place 0.1 uF and 0.01 uF X7R capacitors on every VCCINT/VCCA ball group within 5 mm trace length to suppress switching transients.
Do not confuse the EP2AGX65DF29C4G (Arria II GX, 65K LEs, 8 transceivers) with the EP2AGX65CU17C4G (different die variant with different transceiver count and I/O mix in a similar package). Bitstreams are NOT portable between Arria II GX SKUs of different densities even at the same package footprint - always recompile in Quartus for the target device. Also note: the G suffix indicates Pb-free/RoHS packaging; non-G variants may not be RoHS compliant.
合規資訊
RoHS compliance per Altera/Intel product page. Pb-free FCBGA packaging (G suffix). Not AEC-Q100 qualified - choose newer automotive-grade devices for automotive applications.