EP2SGX60EF1152C4K - 60K LEs Stratix II GX FPGA, 1152-BGA | Altera
MPN： EP2SGX60EF1152C4K ✗ 停產EP2SGX60EF1152C4K 概覽
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, embedded memory, DSP blocks, and high-speed transceivers that can be rewired after manufacturing. FPGAs sit at the top of the digital IC hierarchy: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor. The Stratix II GX family specifically extends this hierarchy with embedded transceivers, allowing single-chip implementation of multi-gigabit serial interfaces that previously required companion PHY chips.
Key features of the EP2SGX60EF1152C4K include 3022 Logic Array Blocks (LABs), 3,024 Kbit (2,544,192 bits) of TriMatrix embedded memory, up to 252 embedded 18x18 multipliers, dedicated DDR2 memory interfaces, and up to 12 full-duplex multi-gigabit transceivers supporting CPRI, OBSAI, Serial RapidIO, PCI Express, XAUI, and CEI-6G protocols. The device is rated for commercial (0C to 85C) ambient operating conditions.
The architecture uses Altera's adaptive logic module (ALM) combined with a hierarchical routing network, delivering up to 732.1 MHz fabric performance. The 1.2 V core supply and 90 nm CMOS process provide a balance of high logic density and low dynamic power, while the embedded transceiver blocks (6.375 Gbps) eliminate the need for external PHY silicon for high-speed serial links. The -C4 speed grade places this part in the mid-range performance tier of the family.
Typical applications include high-end telecommunications line cards, military radar and signal-intelligence platforms, broadcast video processing, ASIC prototyping, and PCI Express Gen1/Gen2 endpoint or root-complex designs. Engineers commonly use the EP2SGX60EF1152C4K as a system-on-chip integration device where multiple protocol bridges, DSP pipelines, and a soft processor core coexist.
When designing with the EP2SGX60EF1152C4K, plan power sequencing carefully - the core (VCC), analog (VCCA), and I/O banks (VCCIO) require specific ramp rates. Use the Quartus II design software (Altera) or Quartus Prime (Intel FPGA) for synthesis, place-and-route, and SignalTap II logic analysis.
This page synthesizes distributor pricing, drop-in same-package alternatives from the Stratix II GX family, and practical design notes not found in the manufacturer datasheet alone.
直接替換替代品，適用於 EP2SGX60EF1152C4K — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP2SGX60EF1152C4K （相同外形與佔位） — 差異在於 Package, Speed Grade, Operating Temperature, Mounting Type, Logic Elements.
EP2SGX60EF1152C4
✅ 直接替換聯絡詢價
查看資料表 →EP2SGX60EF1152C4N
✅ 直接替換聯絡詢價
查看資料表 →EP2SGX60EF1152C3N
✅ 直接替換聯絡詢價
查看資料表 →EP2SGX60EF1152C3
✅ 直接替換聯絡詢價
查看資料表 →EP2SGX60E1152C
✅ 直接替換聯絡詢價
查看資料表 →EP2SGX60EF1152C4K 最大額定值與電氣特性
| Manufacturer | Intel / Altera |
| Series | Stratix II GX |
| Device Family | Stratix II GX |
| Logic Elements | 60,440 |
| Logic Array Blocks (LABs) | 3022 |
| Adaptive Logic Modules (ALMs) | 24,176 |
| Embedded Memory (bits) | 2,544,192 |
| Embedded Memory (Kbits) | 3024 |
| Embedded 18x18 Multipliers | Up to 252 |
| User I/Os | 534 |
| Transceivers | Up to 12 (6.375 Gbps) |
| Maximum Fabric Frequency | 732.1 MHz |
| Process Technology | 90 nm CMOS |
| Core Voltage (VCC) | 1.2 V |
| Speed Grade | C4 |
| 工作溫度 | 0C to 85C (Commercial) |
| 封裝 | 1152-BBGA / FC-FBGA, Flip-Chip |
| 安裝類型 | Surface Mount |
| Configuration Mode | Enhanced Configuration (EPC) - K suffix |
EP2SGX60EF1152C4K 1152-bbga / fc-fbga, flip-chip 腳位配置指南
EP2SGX60EF1152C4K（1152-bbga / fc-fbga, flip-chip 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP2SGX60EF1152C4K.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP2SGX60EF1152C4K 適用於 6 應用s: Telecommunications Line Card, Military Radar and Signal Intelligence, PCI Express Endpoint Card, Broadcast Video Processing, ASIC Prototyping Platform, Industrial Automation and Machine Vision.
Telecommunications Line Card
The EP2SGX60EF1152C4K's 60,440 logic elements plus 12 integrated 6.375 Gbps transceivers make it ideal for multi-protocol telecom line cards. The fabric can implement CPRI or OBSAI fronthaul interfaces, a soft NPU, and traffic management in a single chip, replacing multi-chip ASIC + PHY designs. The 2,544,192-bit TriMatrix memory holds packet buffers and lookup tables directly on-die, while 252 embedded 18x18 multipliers accelerate Reed-Solomon and Turbo code FEC. Up to 534 user I/Os route to external SFP+ cages and backplane connectors, eliminating external glue logic.
推薦
Military Radar and Signal Intelligence
The 60,440-LE fabric and 252 DSP multipliers of the EP2SGX60EF1152C4K support beamforming, FFT processing, and pulse compression for radar and electronic-warfare platforms. The 6.375 Gbps transceivers move ADC data directly into the FPGA at sample rates above 1 GSPS, eliminating external demultiplexer chips. The -C4 commercial speed grade suits ground-based and shipboard installations; the military temperature variant EP2SGX60EF1152I4 is recommended for harsher environments. Pin compatibility with other Stratix II GX 60E 1152-BBGA devices allows straightforward migration if more DSP headroom is needed.
推薦
PCI Express Endpoint Card
The EP2SGX60EF1152C4K's integrated 6.375 Gbps transceivers enable PCI Express Gen1 (2.5 Gbps) and Gen2 (5.0 Gbps) endpoint or root-complex designs using Altera's hard PCIe IP core. A typical x8 Gen2 implementation consumes roughly 8,000 LEs and 4 transceivers, leaving the bulk of the 60,440-LE fabric for application logic. The 1152-BGA package provides ample I/O for downstream peripherals, DMA controllers, and local memory interfaces including DDR2. Quartus II includes verified PCIe reference designs and SignalTap II for runtime link-state debugging.
推薦
Broadcast Video Processing
The 60,440 logic elements plus 252 DSP blocks of the EP2SGX60EF1152C4K handle 3G-SDI and HD-SDI bridging, color-space conversion, scaling, and overlay composition for broadcast video routers and production switchers. The integrated 6.375 Gbps transceivers accept SMPTE 424M (3G-SDI) directly, while 534 user I/Os connect to HDMI, DisplayPort, and DVI companion chips. The 2,544,192-bit embedded memory provides line buffers and frame-store FIFOs without external SRAM, reducing BOM cost and PCB area in 1U rack-mount equipment.
推薦
ASIC Prototyping Platform
The 60,440-LE fabric and 534 I/Os of the EP2SGX60EF1152C4K let design teams prototype multi-million-gate ASICs at near-real-time speeds. The 90 nm Stratix II fabric supports per-LE granularity, allowing ASIC RTL to map directly without forced logic packing. The 12 transceivers replicate high-speed serializer/deserializer interfaces common in networking ASICs. The 1152-BGA package exposes enough I/Os to break out prototype ASIC pads at full visibility, and multiple FPGAs can be stacked with JTAG chains for larger-ASIC emulation.
推薦
Industrial Automation and Machine Vision
The 60,440 logic elements, 534 user I/Os, and 252 DSP multipliers of the EP2SGX60EF1152C4K support multi-camera machine-vision pipelines including GigE Vision, CoaXPress, and Camera Link aggregation. The 6.375 Gbps transceivers accept CoaXPress (up to 6.25 Gbps per lane) and 10 GigE Vision directly, while the 252 18x18 multipliers accelerate Bayer demosaicing, FFT-based defect detection, and convolutional filter pipelines. Industrial users benefit from long-life-cycle support and the ability to migrate to industrial-grade EP2SGX60EF1152I4N within the same 1152-BGA footprint.
推薦
推薦產品摘要
工程參考資料，適用於 EP2SGX60EF1152C4K — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP2SGX60EF1152C4 | EP2SGX60EF1152C4N | EP2SGX60EF1152C3N | EP2SGX60EF1152C3 | EP2SGX60E1152C |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 1152-BBGA FC-FBGA | 1152-BBGA FC-FBGA (same) | 1152-BBGA FC-FBGA (same) | 1152-BBGA FC-FBGA (same) | 1152-BBGA FC-FBGA (same) | 1152-BBGA FC-FBGA (same) |
| Logic Elements | 60,440 | 60,440 (same) | 60,440 (same) | 60,440 (same) | 60,440 (same) | 60,440 (same) |
| Speed Grade | C4 | C4 (same) | C4 (same) | C3 (slower ~15%) | C3 (slower ~15%) | C (base) |
| Enhanced Configuration (EPC) K-suffix | Yes (K suffix) | No | No | No | No | No |
| Transceivers (6.375 Gbps) | Up to 12 | Up to 12 (same) | Up to 12 (same) | Up to 12 (same) | Up to 12 (same) | None (Stratix II non-GX) |
| Embedded Memory (bits) | 2,544,192 | 2,544,192 (same) | 2,544,192 (same) | 2,544,192 (same) | 2,544,192 (same) | 2,544,192 (same) |
| User I/Os | 534 | 534 (same) | 534 (same) | 534 (same) | 534 (same) | 534 (same) |
主要差異化特點
- Enhanced Configuration (EPC) 'K' variant - factory-modified configuration options (對比EP2SGX60EF1152C4)
- Mid-tier C4 speed grade offering better Fmax than C3 variants (對比EP2SGX60EF1152C3)
- Stratix II GX integrates 12 high-speed transceivers vs none on Stratix II E (對比EP2SGX60E1152C)
設計說明
The EP2SGX60EF1152C4K requires carefully sequenced power rails. Core VCC at 1.2 V must ramp first, followed by VCCA (2.5/3.3 V for transceivers), then VCCIO per bank. Altera's PowerPlay Power Analyzer in Quartus II estimates typical VCCINT current around 1.5-2.5 A at full fabric utilization, but transceivers can add 0.5-1 A per active channel at 6.375 Gbps. Use at least four 100 uF bulk capacitors near the package plus 0.1 uF decoupling on every VCC pin. Estimated: at 100% toggle rate across 60K LEs and 12 active transceivers, total power consumption can exceed 25 W, requiring thermal management via heatsink or forced-air cooling.
The 1152-BGA FC-FBGA package demands a 1.0 mm ball pitch PCB with microvia (laser-drilled) stack-up. Altera's Stratix II GX Board Design Guidelines recommend 8-10 PCB layers with dedicated ground and power planes. The 6.375 Gbps transceiver channels require 100-ohm differential routing with length matching to within 0.127 mm (5 mils) per lane and at least 3W spacing to other signals. Use the Quartus II Pin Planner early in the design cycle to lock I/O placements and avoid unroutable placement conflicts on the BGA breakout.
At full utilization (60K LEs at 732 MHz, 12 transceivers at 6.375 Gbps), junction temperature can reach 85C with no thermal management. The 1152-BGA package has a theta-JA of roughly 10-12 C/W on a standard JEDEC test board; with 25 W dissipation, junction-to-ambient delta reaches 250-300 C without airflow or a heatsink. Use the thermal pad on the bottom of the package (if present on the FC variant) and consider a heat spreader for industrial temperature grades. Estimated: industrial-grade -I4 variants require additional derating to maintain 100C junction under worst-case conditions.
Three common pitfalls with the EP2SGX60EF1152C4K: (1) Do not hot-swap the device - Stratix II GX lacks hot-swap support and can latch-up if VCC ramps before transceivers; (2) The 'K' suffix denotes Enhanced Configuration - verify your configuration source (EPC16, EPC64, or JTAG) matches the K-suffix variant in Quartus II device selection; (3) Do not enable transceivers before VCCA stabilizes - power-down sequencing matters. Always run PowerPlay early-stage analysis before PCB layout commitment.
合規資訊
RoHS/lead-free status of EP2SGX60EF1152C4K not explicitly stated in verified web data. The K-suffix EPC variant may predate Altera's transition to lead-free processes; the 'N' suffix on related variants (e.g., EP2SGX60EF1152C4N) is Altera's lead-free / RoHS-compliant marker per the Stratix II GX handbook. AEC-Q100 not applicable - this is a commercial FPGA, not an automotive-grade part.
