EP2SGX60EF1152C4N - Stratix II GX 60K FPGA, 1152-BGA | Altera
MPN： EP2SGX60EF1152C4N ⚠ 最後購買機會EP2SGX60EF1152C4N 概覽
What is an FPGA? An FPGA (Field-Programmable Gate Array) is a semiconductor IC whose logic function is defined after manufacture by a configuration bitstream loaded into on-chip SRAM. FPGAs sit hierarchically alongside ASICs and CPLDs as user-customizable digital logic devices, and high-density FPGAs like the Stratix II GX add embedded transceivers, DSP blocks, and large memory arrays to support system-on-chip (SoC) integration in communications, broadcast, and high-performance computing.
Key features of the EP2SGX60EF1152C4N include 60,440 logic elements, 3,022 LABs (Logic Array Blocks), 254 I/O standards supported, and a maximum user I/O count of 534 pins. The integrated transceivers operate at up to 6.375 Gbps per channel and support PCI Express, Serial RapidIO, Gigabit Ethernet, XAUI, and other serial protocols. The 1152-pin FBGA package uses a 35x35 mm substrate with 1.0 mm ball pitch and supports -40C to +85C commercial-grade operation (the 'C' suffix).
The Stratix II GX architecture uses an adaptive logic module (ALM) that delivers up to 1.88x the logic capacity and 1.5x the memory bandwidth of the original Stratix family. The device's high-speed I/O bank structure supports single-ended standards (LVTTL, LVCMOS, PCI, PCI-X) and differential standards (LVDS, LVPECL, HyperTransport) via dedicated true-LVDS pins, with on-chip termination resistors for signal-integrity optimization.
Typical applications include 10G/40G optical transport platforms, PCI Express Gen1/Gen2 endpoint and root-complex designs, Serial RapidIO switch fabrics, software-defined radio (SDR) baseband processing, and high-end ASIC prototyping. The combination of dense logic and integrated transceivers makes it particularly suitable for wireline and wireless infrastructure line cards.
When designing with the EP2SGX60EF1152C4N, pay close attention to the FPGA's 25W typical power dissipation budget and provide a thermal solution sized for at least 15-20W steady-state load. Use the Altera Quartus II design suite (versions 7.2 through 13.0sp1) for synthesis and place-and-route, and consult the Stratix II GX pin connection guidelines for the 1152-BGA package before laying out the PCB.
This page synthesizes verified distributor pricing, drop-in and parametric-equivalent alternatives, and practical Quartus II design considerations not consolidated in any single manufacturer document, giving engineering buyers a faster procurement and design-start workflow.
直接替換替代品，適用於 EP2SGX60EF1152C4N — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP2SGX60EF1152C4N （相同外形與佔位） — 差異在於 Package, Speed Grade, Operating Temperature, Package Type, Mounting Type.
EP2SGX60EF1152C4
✅ 直接替換聯絡詢價
查看資料表 →EP2SGX60EF1152C3N
✅ 直接替換聯絡詢價
查看資料表 →EP2SGX60EF1152C4K
✅ 直接替換聯絡詢價
查看資料表 →EP2SGX60EF1152C3
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP2SGX60EF1152C4N 最大額定值與電氣特性
| Series | Stratix II GX |
| Family | Stratix II GX FPGA |
| Logic Elements | 60,440 |
| LABs / CLBs | 3,022 |
| Total Memory Bits | 2,544,192 |
| Maximum User I/O | 534 |
| Number of I/O Banks | 12 |
| High-Speed Transceivers | Up to 12 channels |
| Transceiver Data Rate (max) | 6.375 Gbps per channel |
| Core Voltage | 1.2 V |
| 工作溫度 | 0C to +85C (Commercial) |
| 安裝類型 | Surface Mount |
| 封裝 | 1152-BBGA (FBGA-1152), 35x35 mm, 1.0 mm pitch |
| RoHS 狀態 | Compliant (lead-free, MS-034AAR-1) |
| Process Technology | 90 nm CMOS |
| Design Software | Altera Quartus II (7.2 - 13.0sp1) |
EP2SGX60EF1152C4N 1152-bbga (fbga-1152), 35x35 mm, 1.0 mm pitch 腳位配置指南
EP2SGX60EF1152C4N（1152-bbga (fbga-1152), 35x35 mm, 1.0 mm pitch 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP2SGX60EF1152C4N.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP2SGX60EF1152C4N 適用於 6 應用s: 10G Optical Transport Line Card, PCI Express Gen2 Endpoint Card, Serial RapidIO Switch Fabric, Software-Defined Radio Baseband, ASIC Prototyping and Emulation, Industrial Video Processing Pipeline.
10G Optical Transport Line Card
The EP2SGX60EF1152C4N's 12 transceivers at up to 6.375 Gbps per channel are well-matched to 10G OTN / SONET line cards, where the silicon typically aggregates multiple 1G/2.5G/10G optical module interfaces into a backplane fabric. With 60,440 logic elements the device absorbs PCS, framer, and forward-error-correction (FEC) logic alongside the SERDES, removing the need for a companion glue ASIC. Designers place the EP2SGX60EF1152C4N between the optical SFP+ cages and the switch-fabric ASIC, and rely on its adaptive logic modules (ALMs) to absorb protocol-specific framing. Trade-off: typical 25W power dissipation requires a dedicated thermal management solution on the line card.
推薦
PCI Express Gen2 Endpoint Card
The EP2SGX60EF1152C4N implements x8 PCI Express Gen2 endpoints in endpoint cards for servers, storage controllers, and instrumentation. The integrated transceivers drive the Gen2 link at 5 Gbps per lane, and the 60K logic-element budget absorbs the PCIe hard IP, DMA engine, and user application logic on a single device. Place the FPGA between the x8 PCIe edge connector and the local bus / DDR2 memory, using the embedded transceiver with reference-clock input. Benefit: integrating the PHY eliminates the cost and signal-integrity risk of a separate PCIe PHY chip, while the 534 user I/Os leave generous headroom for status LEDs, side-band signals, and JTAG.
推薦
Serial RapidIO Switch Fabric
Wireless base-station baseband and defense radio systems use Serial RapidIO (SRIO) switch fabrics where the EP2SGX60EF1152C4N operates as either a sRIO endpoint or a 4-port sRIO switch. The transceivers deliver 3.125 Gbps per lane, sufficient for SRIO x1/x4 lanes at full payload rate, while the 60K LE budget absorbs the SRIO logical layer, routing tables, and DSP front-end. Typical placement is between the DSP cluster and the backplane connector, with on-chip M512/M4K memory blocks holding routing tables. Trade-off: real-time DSP workloads may force designers to up-size to the EP2SGX90EF1152I4N at 90K LE for headroom.
推薦
Software-Defined Radio Baseband
Software-defined radio (SDR) platforms use the EP2SGX60EF1152C4N to perform channelization, FFT/iFFT, and modulation/demodulation for multi-band wireless systems. The device's 252 DSP blocks deliver up to 84 GMACS at 350 MHz, sufficient for LTE channel cards, while 2.5 Mbits of embedded memory hold FFT windowing coefficients. Engineers place the FPGA between the ADC / DAC front-end and the host CPU, with sample rates from 61.44 MSPS to 122.88 MSPS for LTE. Benefit: ALM-based arithmetic delivers up to 1.88x the logic capacity of the original Stratix family at the same -6 speed grade.
推薦
ASIC Prototyping and Emulation
High-end ASIC prototyping platforms use EP2SGX60EF1152C4N devices as building blocks to emulate multi-million-gate SoC designs before tape-out. The 60K logic elements per chip, combined with 534 user I/Os and high-speed transceivers, allow the FPGA to map complex SoC sub-systems with realistic I/O behavior. Designers wire multiple Stratix II GX parts together via their high-speed serial channels for chip-to-chip emulation links running at 6.375 Gbps. Trade-off: per-device cost of approximately $1,850 USD (as of 2026-09-09) means multi-FPGAs emulation rigs are an investment; the Last-Time-Buy status also requires planning for replacement with newer Stratix IV/V parts.
推薦
Industrial Video Processing Pipeline
Broadcast and industrial video systems use the EP2SGX60EF1152C4N for SDI / HD-SDI / 3G-SDI video aggregation, de-interlacing, and color-space conversion. The integrated transceivers handle SDI receive at up to 2.97 Gbps per stream, while the 60K LE budget absorbs multi-stream scalers and overlay logic for medical imaging and broadcast graphics. The device is typically placed between the SDI equalizer / cable-driver and the host video bus, with external DDR2 memory buffering frame buffers. Benefit: ALM-based arithmetic supports real-time 10-bit 4:2:2 processing at full SDI line rate without external DSP assistance.
推薦
推薦產品摘要
工程參考資料，適用於 EP2SGX60EF1152C4N — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP2SGX60EF1152C4 | EP2SGX60EF1152C3N | EP2SGX60EF1152C4K | EP2SGX60EF1152C3 |
|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera |
| Package | FBGA-1152 (1152-BBGA) | FBGA-1152 (1152-BBGA) - same | FBGA-1152 (1152-BBGA) - same | FBGA-1152 (1152-BBGA) - same | FBGA-1152 (1152-BBGA) - same |
| Logic Elements | 60,440 | 60,440 | 60,440 | 60,440 | 60,440 |
| Speed Grade | C4 (-6) | C4 (-6) | C3 (-7) | C4 (-6) | C3 (-7) |
| Temperature Grade | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Maximum User I/O | 534 | 534 | 534 | 534 | 534 |
| Transceivers (max) | 12 channels, 6.375 Gbps | 12 channels, 6.375 Gbps | 12 channels, 6.375 Gbps | 12 channels, 6.375 Gbps | 12 channels, 6.375 Gbps |
| RoHS Status | Compliant (lead-free, N suffix) | May be non-N (verify per lot) | Compliant (lead-free) | Compliant (lead-free) | May be non-N (verify per lot) |
| Lifecycle Status | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy |
主要差異化特點
- Only Stratix II GX 60K LE part with confirmed RoHS-compliant lead-free FBGA-1152 finish (N suffix) (對比EP2SGX60EF1152C4)
- Higher transceiver-per-area density than later Stratix IV parts (對比EP2SGX60EF1152C3N)
- Industrial-grade sibling available in same FBGA-1152 footprint for upgrade paths (對比EP2SGX90EF1152I4N)
設計說明
Estimated: based on the Stratix II GX family datasheet typical power of approximately 25W under 60% utilization with active transceivers, the EP2SGX60EF1152C4N requires a thermal solution sized for 15-20W steady-state. Designers should provide a minimum 6-layer PCB with 4 oz copper on inner power planes for heat-spreading, or attach a 1-3 C/W heatsink with thermal interface material. The FBGA-1152 package's theta-JA at 0 m/s airflow is approximately 12 C/W, so derate junction-to-ambient thermal headroom carefully for chassis-internal deployments.
Route the 12 transceiver channels with 100-ohm differential impedance on the top microstrip layer using 8-mil trace width / 5-mil spacing over an 8-mil prepreg. Place AC-coupling capacitors within 600 mils of the FPGA transmit pins, and provide a clean ground-return path beneath each differential pair. For multi-lane configurations (x4, x8), match trace lengths to within 5 mils per inch within the same transmit group to meet PCIe Gen2 and XAUI skew margins.
Do not load configuration bitstreams from Quartus II 14.0 or later onto the EP2SGX60EF1152C4N - the Stratix II GX family was removed from support after Quartus II 13.0sp1. Use Quartus II versions 7.2 through 13.0sp1 exclusively, and lock the JTAG chain ID for production programming to avoid inadvertently programming a neighboring device in multi-FPGA designs.
Estimated: total quiescent supply current draw at 1.2V VCCINT is approximately 8-12 A under typical workload plus 1.5 A per active transceiver channel on VCCPD. The total PCB power budget must include 3 separate rails - VCCINT (1.2V core), VCCIO (bank I/O, 1.2-3.3V), and VCCA/VCCP (transceiver analog/pll) - each with independent decoupling. Use of bulk-tantalum plus 0.1 uF / 0.01 uF / 0.001 uF ceramic decoupling capacitor combinations per pin-pair is required for stable transceiver operation.
合規資訊
RoHS compliant per Altera (Intel) product marking; lead-free FBGA finish per MS-034AAR-1 JEDEC outline. Halogen-free status not explicitly published in verified web data and flagged as unknown. AEC-Q100 not applicable - FPGAs are not AEC-Q100 qualified unless specifically stated. Conflict-minerals compliance per Altera's standard CMRT disclosures.
