EP2SGX90EF1152I4N - 90k LEs Stratix II GX FPGA, 1152-BGA | Intel
MPN： EP2SGX90EF1152I4N ⚠ 最後購買機會EP2SGX90EF1152I4N 概覽
A Field-Programmable Gate Array (FPGA) is a reprogrammable integrated circuit whose logic fabric, routing, and I/O can be configured after manufacture to implement arbitrary digital functions. FPGAs occupy the middle ground between fixed-function ASICs and software-defined processors: ASICs offer higher volume efficiency but no post-silicon flexibility, while FPGAs trade cost-per-unit for rapid prototyping, field upgradability, and parallel hardware acceleration. Within the taxonomy of programmable logic, the EP2SGX90EF1152I4N sits in the high-end transceiver-equipped tier, alongside other Stratix II GX and contemporary Virtex-5 LXT/SXT FPGAs, used wherever multi-gigabit serial links, high logic density, and deterministic latency must coexist.
Key device features include a 717-732 MHz internal operating frequency, embedded multiplier/DSP blocks, a flexible PLLEU clock network, and high-speed LVDS and memory interfaces. The GX variant adds multi-gigabit transceivers supporting protocols such as PCI Express, Serial RapidIO, XAUI, and CPRI. The 1152-ball FBGA package provides sufficient I/O and power/ground integrity for transceiver and DDR2/QDR II memory applications, with industrial-grade operating temperature support and lead-free compliance per the verified manufacturer data.
The architecture combines logic elements, embedded RAM (TriMatrix), DSP blocks, and transceivers on a single die, with a hierarchical interconnect optimized for high fan-out. Hard intellectual property (IP) blocks for memory controllers and PLLs reduce soft-logic overhead and free fabric for application logic, while the 90 nm process delivers a favorable performance-per-watt ratio for its generation.
Typical applications include high-speed serial backplane bridging, wireless baseband processing, video and imaging pipelines, test and measurement equipment, and defense/aerospace signal processing. The integrated transceivers make it well suited for line-card designs requiring multi-gigabit links, while the large logic and memory capacity supports deep packet buffers and wide datapaths.
When designing with this part, allocate transceiver channels first (pin/bank assignments are fixed by package), then DDR2/QDR II memory interfaces (which consume dedicated DQS pins), and place the configuration scheme (EPC16 or JTAG) on dedicated pins. The 1152-ball FBGA requires a multi-layer PCB with controlled-impedance routing for transceivers and matched-length traces for DDR2 interfaces.
This page synthesizes distributor pricing, package dimensions, drop-in alternatives from the Stratix II GX and adjacent families, and practical design notes not consolidated in the manufacturer datasheet.
直接替換替代品，適用於 EP2SGX90EF1152I4N — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP2SGX90EF1152I4N （相同外形與佔位） — 差異在於 Package, Operating Temperature Grade, Transceivers, Family, Series.
EP2SGX90EF1152I4
✅ 直接替換聯絡詢價
查看資料表 →EP2SGX90EF1152I3N
✅ 直接替換聯絡詢價
查看資料表 →EP2SGX90EF1152C5N
✅ 直接替換聯絡詢價
查看資料表 →EP2SGX60EF1152I4N
✅ 直接替換聯絡詢價
查看資料表 →EP2SGX130GF1508I4N
✅ 直接替換聯絡詢價
查看資料表 →EP2SGX90EF1152I4N 最大額定值與電氣特性
| Family | Stratix II GX |
| Logic Elements | 90,960 |
| Total Memory Bits | 4,520,448 |
| Number of LABs/CLBs | 4,548 |
| Number of Logic Elements/Cells | 90,960 |
| Total RAM Bits | 4,520,448 |
| Number of I/O | 558 |
| Number of Transceivers | 12 |
| Operating Frequency | 717 MHz to 732.1 MHz |
| Process Technology | 90 nm CMOS |
| 封裝 | 1152-BBGA (FBGA-1152, MS-034AAR-1) |
| 工作溫度 | -40C to +100C (Industrial) |
| 安裝類型 | Surface Mount |
| Lead Free | Yes |
EP2SGX90EF1152I4N 1152-bbga (fbga-1152, ms-034aar-1) 腳位配置指南
EP2SGX90EF1152I4N（1152-bbga (fbga-1152, ms-034aar-1) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP2SGX90EF1152I4N.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP2SGX90EF1152I4N 適用於 6 應用s: Multi-Gigabit Serial Backplane Bridging, Wireless Baseband Processing, High-Definition Video Processing Pipelines, Test and Measurement Instrumentation, Defense and Aerospace Signal Processing, Industrial Protocol Bridge and Gateway.
Multi-Gigabit Serial Backplane Bridging
The EP2SGX90EF1152I4N's 12 integrated multi-gigabit transceivers support backplane protocols such as XAUI, Serial RapidIO, and PCI Express, enabling 4-lane and 8-lane aggregation across line cards. The 90,960 logic elements accommodate MAC-layer processing, link-training state machines, and protocol-aware buffering, while 4.5 Mbits of TriMatrix memory provide per-channel elastic buffers and statistics counters. Compared with a Stratix IV solution, this 90 nm part delivers comparable link performance at lower per-unit cost where power and density headroom are not primary constraints. PCB layout must enforce 100-ohm differential routing and length matching within 150 mils for the transceiver channels.
推薦
Wireless Baseband Processing
The EP2SGX90EF1152I4N is well suited to wireless baseband signal processing for 3G/4G fronthaul and small-cell applications, where its 12 transceivers carry CPRI or OBSAI links to remote radio heads and its 90,960 LEs implement FFT, channelization, and digital up/down-conversion. Embedded DSP blocks accelerate multiply-accumulate operations critical to crest-factor reduction and digital pre-distortion, while TriMatrix memory stores tap-delay line and HARQ buffers. The industrial -40C to +100C temperature grade supports outdoor base-station enclosures, and the FBGA-1152 package provides the power/ground integrity required for sustained multi-gigabit operation.
推薦
High-Definition Video Processing Pipelines
The 558 user I/O and 4.5 Mbits of embedded memory on the EP2SGX90EF1152I4N enable multi-stream HD-SDI and DisplayPort processing for broadcast video routers, video conferencing codecs, and medical imaging equipment. The high logic count supports de-interlacing, scaling, color-space conversion, and frame-rate conversion in real time without external ASSP dependencies. The transceiver channels can drive 3G-SDI over fiber or interface to HDMI/DP repeater chips, while the 717-732 MHz fabric comfortably meets the throughput required for 1080p60 RGB pipelines. Quartus II design tools provide Video and Image Processing (VIP) suite IP for rapid development.
推薦
Test and Measurement Instrumentation
The EP2SGX90EF1152I4N's combination of 90,960 LEs, 12 transceivers, and 4.5 Mbits of memory is ideal for digital storage oscilloscopes, logic analyzers, and protocol testers. The transceiver channels capture multi-gigabit serial traffic (PCIe, USB 3.0, SATA) while the fabric implements deep trigger sequencers, real-time compression, and on-screen display. The 1152-ball FBGA package offers the I/O and power integrity for 558 high-speed signals without exceeding standard board-stack-up constraints. Industrial temperature rating supports laboratory and field-deployed equipment.
推薦
Defense and Aerospace Signal Processing
The EP2SGX90EF1152I4N's industrial temperature range and high logic density support radar, electronic-warfare, and secure-communication signal-processing subsystems where multi-gigabit serial links connect to ADC/DAC front-ends. The 12 transceivers enable direct ADC-to-FPGA (JESD204-style or proprietary) connectivity and backplane distribution. The TriMatrix memory provides delay-line and correlator storage for matched-filter and pulse-Doppler processing, and the DSP blocks accelerate FFT and matrix operations. The lead-free 1152-ball FBGA is suitable for ITAR-controlled programs with appropriate long-lifecycle planning.
推薦
Industrial Protocol Bridge and Gateway
The EP2SGX90EF1152I4N's 558 user I/O, 12 transceivers, and large logic fabric are well matched to multi-protocol industrial gateways that bridge PROFINET, EtherCAT, Modbus TCP, and serial field-bus to backhaul Ethernet and PCIe links. The fabric implements deterministic cycle-time scheduling, time-sensitive networking (TSN) shaping, and protocol-stack acceleration, while the transceivers drive SFP/SFP+ backhaul to supervisory networks. The 4.5 Mbits of memory buffer high-water-mark queueing and statistics, and the 1152-ball FBGA supports the heterogeneous signal mix (LVDS, LVCMOS, differential) typical of industrial I/O modules.
推薦
推薦產品摘要
工程參考資料，適用於 EP2SGX90EF1152I4N — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP2SGX90EF1152I4 | EP2SGX90EF1152I3N | EP2SGX90EF1152C5N | EP2SGX60EF1152I4N | EP2SGX130GF1508I4N |
|---|---|---|---|---|---|---|
| Package | 1152-BBGA (FBGA-1152) | 1152-BBGA (FBGA-1152) - same | 1152-BBGA (FBGA-1152) - same | 1152-BBGA (FBGA-1152) - same | 1152-BBGA (FBGA-1152) - same | 1508-BGA (FBGA-1508) - larger |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 90,960 | 90,960 | 90,960 | 90,960 | 60,440 | 132,540 |
| Number of Transceivers | 12 | 12 | 12 | 12 | 8 | 20 |
| Total Memory Bits | 4,520,448 | 4,520,448 | 4,520,448 | 4,520,448 | 2,544,192 | 6,747,840 |
| Speed Grade | I4 (industrial, mid-speed) | I4 (same) | I3 (slower) | C5 (commercial, slower) | I4 (same) | I4 (same) |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C | -40C to +100C | 0C to +85C (Commercial) | -40C to +100C | -40C to +100C |
主要差異化特點
- Highest-density Stratix II GX option in 1152-ball FBGA package (對比EP2SGX60EF1152I4N)
- Industrial temperature grade for harsh-environment deployments (對比EP2SGX90EF1152C5N)
- Mid-range speed grade (I4) balances performance and yield (對比EP2SGX90EF1152I3N)
設計說明
The 1152-ball FBGA package requires a multilayer PCB (typically 8-12 layers) with 1.0 mm ball pitch. Use Intel's package-symbol and pin-out files in Quartus II Pin Planner to generate precise ball assignments. Route transceiver channels as 100-ohm differential pairs with length matching within 150 mils, and provide a continuous ground reference plane under the BGA for power/ground integrity. Decoupling capacitors should be placed on the BGA-side of the package, with a mix of 100 nF, 10 nF, and 1 uF values to cover the frequency spectrum of the multi-gigabit transceivers.
Estimate: at 100% logic utilization with 12 transceivers operating at 3.125 Gbps, total power consumption can approach 15-20 W. Provide a minimum 4-layer PCB with dedicated VCCINT, VCCA, VCCPD, and VCCIO planes, and use a multi-rail power supply such as a dedicated regulator module. Sequence the supplies per the Stratix II GX power-up guidelines: VCCINT first, then VCCPD, then VCCIO, and finally VCCA for the transceivers to avoid latch-up. Add 100 uF bulk capacitance near the package and 0.1 uF + 10 uF local decoupling per power pin group.
Do not mix transceiver channels and general-purpose I/O on the same bank without consulting the pin-out file. Do not exceed the maximum transceiver lane count per side of the device (typically 6 per side on the 1152-FBGA) to avoid signal-integrity issues. Ensure the configuration scheme (EPC16, AS, PS, or JTAG) is correctly assigned and that the CONF_DONE and nSTATUS pins are pulled up per datasheet. Finally, always run Quartus II fitter reports to verify that the design meets timing across all operating conditions, particularly the I4 industrial speed grade derating.
合規資訊
Lead-free per verified manufacturer data. RoHS and REACH status not directly confirmed in provided web data; refer to the manufacturer datasheet for definitive compliance statements. AEC-Q100 is not applicable as this is a commercial/industrial-grade FPGA.
