EP3SL50F484I4LG - Stratix III L FPGA, 47.5K LE, 484-FCBGA | Altera (Intel)
MPN： EP3SL50F484I4LG ✗ 停產EP3SL50F484I4LG 概覽
A Field Programmable Gate Array (FPGA) is a programmable logic device that lets designers implement arbitrary digital logic, memory blocks, and DSP functions through a hardware description language. Within the broader semiconductor taxonomy, FPGAs sit between ASICs and processors: programmable like a processor, but parallel and deterministic like an ASIC. The Stratix III family uses a power-optimized 40nm process that reduces dynamic power roughly 30% versus prior Stratix generations while preserving the high logic capacity that Stratix devices are known for.
Key features of the EP3SL50F484I4LG include 47,500 logic elements (LEs), 2,184,192 bits (273 KB) of embedded RAM, embedded multipliers and DSP blocks for high-throughput arithmetic, dedicated PLL and clock-tree resources, and 296 general-purpose user I/Os. The device supports up to 12 transceiver channels in higher Stratix III L SKUs, with the L suffix denoting the low-power variant of the family.
The Stratix III L architecture uses Programmable Power Technology that automatically switches logic on or off based on the operating frequency, allowing unused logic to draw near-zero leakage. This makes the EP3SL50F484I4LG suitable for high-utilization designs that would otherwise over-budget power in older FPGA families.
Typical applications include high-throughput DSP pipelines (radar, beamforming, video processing), high-speed serial protocol bridging (PCIe Gen2, Serial RapidIO, GBE), ASIC prototyping, and telecom baseband pre-processing. The 296 user I/Os are typically distributed across multiple I/O banks to support mixed voltage standards (LVDS, LVTTL, HSTL, SSTL).
When designing with this device, pay close attention to decoupling, signal integrity on the FCBGA breakout, and transceiver reference-clock routing. Use Altera's Quartus II design suite for synthesis, place-and-route, and timing closure.
This page synthesizes distributor stock, same-package drop-in alternatives from the Stratix III family, and practical design considerations not collated in the manufacturer datasheet.
直接替換替代品，適用於 EP3SL50F484I4LG — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP3SL50F484I4LG （相同外形與佔位） — 差異在於 Package, Process Technology, Embedded Memory, Series, Speed Grade.
EP3SL50F484I4L
✅ 直接替換聯絡詢價
查看資料表 →EP3SL50F484I4G
✅ 直接替換聯絡詢價
查看資料表 →EP3SL50F484I4
✅ 直接替換聯絡詢價
查看資料表 →EP3SL50F484I3N
✅ 直接替換聯絡詢價
查看資料表 →EP3SL50F484I3G
✅ 直接替換聯絡詢價
查看資料表 →EP3SL50F484C4N
✅ 直接替換聯絡詢價
查看資料表 →EP3SL110F1152I3N
✅ 直接替換聯絡詢價
查看資料表 →EP3SL50F484I4LG 最大額定值與電氣特性
| Family | Stratix III L |
| Series | EP3SL50 |
| Logic Elements | 47,500 |
| Embedded Memory | 2,184,192 bits (273 KB) |
| User I/Os | 296 |
| 封裝 | 484-Ball FCBGA (FBGA) |
| 安裝類型 | Surface Mount |
| 工作溫度 | -40C to +100C (Industrial) |
| Speed Grade | I4 (fast) |
| 供應電壓 | 0.85 V / 1.1 V / 1.2 V / 2.5 V / 3.3 V (multi-rail) |
| Process Node | 40 nm |
| RoHS 狀態 | Compliant |
| Lead-Free | Yes |
| Configuration Memory | SRAM-based |
| Configuration Interface | JTAG / Passive Serial / Fast Passive Parallel |
EP3SL50F484I4LG 484-ball fcbga (fbga) 腳位配置指南
EP3SL50F484I4LG（484-ball fcbga (fbga) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP3SL50F484I4LG.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP3SL50F484I4LG 適用於 7 應用s: High-Throughput DSP Pipeline, High-Speed Serial Protocol Bridge, ASIC Prototyping, Telecom Baseband Pre-Processing, Industrial Video Processing, Test & Measurement Instrumentation, Aerospace & Defense Signal Processing.
High-Throughput DSP Pipeline
The EP3SL50F484I4LG fits DSP-heavy signal-processing pipelines such as radar baseband, beamforming, and video codecs. Its 47,500 logic elements combined with embedded multipliers (DSP blocks) deliver hundreds of GMACs of arithmetic throughput on a single device. Designers typically instantiate FFTs, FIR filters, and matrix multipliers while keeping data on-chip to avoid DDR bottlenecks. The 2,184,192-bit embedded memory serves as sample buffers, FFT window tables, and coefficient storage. Compared with a software DSP on a processor, the EP3SL50F484I4LG achieves deterministic latency and 10-100x throughput per watt at the cost of higher unit price.
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High-Speed Serial Protocol Bridge
The EP3SL50F484I4LG works as a protocol bridge between PCIe Gen2, Serial RapidIO, GBE, and custom serial links in telecom and storage equipment. Stratix III L transceivers support multi-gigabit data rates with embedded 8b/10b or 64b/66b encoding, clock data recovery, and channel bonding. The 296 user I/Os accommodate multiple parallel buses alongside serial channels, enabling flexible system architecture. Designers typically pair this FPGA with external PHY or use it as a soft bridge between ASIC blocks. The industrial -40C to +100C temperature range supports outdoor telecom cabinets.
推薦
ASIC Prototyping
The EP3SL50F484I4LG is widely used for ASIC prototyping, where designers map ASIC RTL onto FPGAs for pre-silicon validation. The 47,500 LEs plus 2,184,192 bits of memory can hold substantial blocks of ASIC logic, while 296 user I/Os break out to ASIC-style board connectors. Multi-FPGA partitioning tools (Synopsys Certify, Mentor Precision) split large ASIC designs across several Stratix III L devices. Compared with final ASIC NRE, prototyping on EP3SL50F484I4LG avoids mask costs and enables early software development. The -40C to +100C industrial range matches ASIC operating environments.
推薦
Telecom Baseband Pre-Processing
The EP3SL50F484I4LG handles pre-processing tasks in telecom base stations - sample-rate conversion, channel filtering, crest-factor reduction, and digital predistortion. Its DSP blocks implement complex baseband math at LTE/5G NR sample rates, and the embedded memory buffers I/Q samples. The 296 user I/Os accept parallel data from ADC/DAC devices, while the FCBGA package's high pin count keeps the PCB compact. Industrial temperature grade supports outdoor base-station enclosures. Compared with a DSP processor, the FPGA reduces latency by 5-10x and supports parallel multi-antenna processing for MIMO.
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Industrial Video Processing
The EP3SL50F484I4LG fits frame-grabber and machine-vision cards that ingest camera data at high frame rates. Designers use the embedded memory for line buffers and the DSP blocks for pixel-level operations such as demosaicing, color-space conversion, and edge detection. The 296 user I/Os interface to camera-link, coaxpress, or MIPI front-ends through external PHYs. Industrial -40C to +100C operation enables deployment in factory automation cells. Compared with GPU-based vision systems, the FPGA offers deterministic latency and lower power per pixel processed.
推薦
Test & Measurement Instrumentation
The EP3SL50F484I4LG serves as the digital core in oscilloscopes, logic analyzers, and protocol analyzers where deterministic timing and high logic capacity are required. Its DSP blocks implement FFT-based spectrum analysis, while the 2,184,192-bit memory buffers deep acquisition records. The 296 user I/Os connect to high-speed ADC/DAC front-ends, and the FCBGA package supports controlled-impedance routing for multi-GHz signals. The industrial temperature range fits laboratory and field-test environments. Compared with fixed-function ASICs, this FPGA allows custom trigger and protocol-decode features via firmware updates.
推薦
Aerospace & Defense Signal Processing
The EP3SL50F484I4LG fits aerospace and defense applications such as electronic warfare, software-defined radio, and signal-intelligence platforms where high logic density and industrial temperature grade are required. The FPGA's DSP blocks handle real-time demodulation, decoding, and direction-finding algorithms, while the embedded memory stores captured signal snapshots. The 296 user I/Os interface to RF front-ends, ADC/DAC devices, and backplane buses. Although not formally MIL-spec qualified, the -40C to +100C industrial range supports many ruggedized platforms. For full MIL-STD-810 applications, designers should review the specific lot-level screening requirements.
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推薦產品摘要
工程參考資料，適用於 EP3SL50F484I4LG — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP3SL50F484I4L | EP3SL50F484I4G | EP3SL50F484I4 | EP3SL50F484I3N | EP3SL50F484C4N | EP3SL110F1152I3N |
|---|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 484-Ball FCBGA | 484-Ball FCBGA - same | 484-Ball FCBGA - same | 484-Ball FCBGA - same | 484-Ball FCBGA - same | 484-Ball FCBGA - same | 1152-Ball FCBGA - different |
| Logic Elements | 47,500 | 47,500 - same | 47,500 - same | 47,500 - same | 47,500 - same | 47,500 - same | 110,000 - higher density |
| Speed Grade | I4 (fastest) | I4 - same | I4 - same | I4 - same | I3 - slower | C4 (commercial, fast) | I3 - slower |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C - same | -40C to +100C - same | -40C to +100C - same | -40C to +100C - same | 0C to +85C (Commercial) | -40C to +100C - same |
| Lead-Free (G suffix) | Yes | No (L only) | Yes | No (base) | No (N suffix) | No (N suffix) | No (N suffix) |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND | NRND |
主要差異化特點
- Speed grade I4 (fastest Stratix III L variant) (對比EP3SL50F484I3N)
- Lead-free RoHS-compliant G variant (對比EP3SL50F484I4 (base, non-G))
- Higher logic density than Cyclone III at same package (對比Cyclone III EP3C40F484 family)
設計說明
The 484-ball FCBGA package requires a PCB stack-up with microvias or via-in-pad for breakout. Use a 1-6-1 or 1-8-1 stack-up with sequential lamination to route signals out of the inner balls without via stubs. Maintain 100-ohm differential impedance on transceiver lanes and 50-ohm single-ended on GPIO. Decouple each power rail (VCCINT, VCCAUX, VCCIO) with 0.1uF MLCCs within 100 mils of each ball.
Stratix III L uses Programmable Power Technology to gate unused logic, but at high utilization (above 70% LE usage) the device still draws 5-10W typical. Provide a thermal pad or copper pour on the top PCB layer connected to GND; for enclosed chassis, plan a heatsink with 1-2 C/W thermal resistance to keep junction below 100C. The -40C to +100C industrial grade requires this margin at worst-case ambient.
Place configuration mode jumpers (MSEL pins) near the FPGA and route JTAG (TCK, TMS, TDI, TDO) with impedance-controlled traces under 6 inches to avoid programming failures. Differential clock inputs require 100-ohm termination at the FPGA ball. Avoid routing noisy I/O signals near PLL power pins (VCCA_PLL) to minimize jitter.
Common pitfalls include: (1) selecting a slower speed grade (I3) for a design that closes timing at I4 only - verify timing closure with margin; (2) forgetting pull-ups on configuration pins causing boot failures; (3) under-estimating transceiver reference-clock jitter - use a low-jitter clock source within the Stratix III datasheet spec; (4) not enabling the on-chip temperature sensor when designing for industrial temperature compliance.
合規資訊
The 'G' suffix in EP3SL50F484I4LG indicates lead-free RoHS-compliant packaging per Altera (Intel) part-numbering convention. AEC-Q100 is not applicable for FPGAs; for automotive-grade equivalent functionality consider Cyclone IV E automotive or Cyclone V automotive families.
