EP3SL50F780I3 - Stratix III FPGA 488 I/O 780-FBGA | Intel
MPN： EP3SL50F780I3 ✗ 停產EP3SL50F780I3 概覽
A Field-Programmable Gate Array (FPGA) is a semiconductor IC whose logic fabric, routing, and I/O can be electrically reconfigured by the end user after manufacture. Stratix III belongs to the high-performance FPGA class within the broader programmable logic hierarchy: FPGA -> programmable logic -> logic IC -> digital semiconductor. The 'L' sub-family targets low-power applications via selectable core voltage (1.1 V or 0.9 V operation), making it suitable for power-sensitive telecom, broadcast, and defense systems where previous-generation Stratix II designs are being refreshed.
Key features include 47,500 logic elements, 1,900 LABs, 2,106 Kbit embedded memory (M9K + M144K blocks), 16 transceiver channels supporting up to 3.75 Gbps with 8 dedicated 6.5 Gbps channels, and a thermal-grade -40C to +100C industrial operating range. The 'I3' speed grade and industrial temperature suffix indicate operation up to 100C ambient with timing closure at the third-fastest Stratix III speed bin.
The architecture combines adaptive logic modules (ALMs), embedded memory, embedded multipliers (DSP blocks), and high-speed transceivers, all connected by a multi-tier routing fabric. Programmable Power Technology allows unused logic, memory, and DSP blocks to enter a low-power state, while the transceiver tiles support protocols such as PCIe Gen1, Serial RapidIO, and CPRI. Per the manufacturer datasheet, this combination enables signal processing throughput well above what is achievable in smaller Cyclone or Arria devices.
Typical applications include 40G/100G line-card packet processing, software-defined radio baseband, video broadcast encoders, military secure communications, and ASIC prototyping. The wide transceiver count makes it attractive for designs requiring multiple high-speed serial links alongside a large parallel logic fabric.
When designing with this device, ensure the Quartus II design software version supports Stratix III and that PCB land pattern follows the 1 mm pitch 780-ball FC-FBGA layout. Plan for multi-rail power (VCCINT selectable, VCCAUX, VCCPD per bank) and adequate decoupling to meet transceiver jitter specs.
This page synthesizes distributor pricing, drop-in vertical-migration alternatives within the Stratix III family, and practical design notes that go beyond the manufacturer datasheet alone.
直接替換替代品，適用於 EP3SL50F780I3 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP3SL50F780I3 （相同外形與佔位） — 差異在於 Package, Speed Grade, Core Voltage, Embedded Memory Bits, Logic Elements.
EP3SL50F780I4
✅ 直接替換聯絡詢價
查看資料表 →EP3SL50F780I3N
✅ 直接替換聯絡詢價
查看資料表 →EP3SL70F780I3
✅ 直接替換聯絡詢價
查看資料表 →EP3SE50F780I3
✅ 直接替換聯絡詢價
查看資料表 →EP3SL50F780I3 最大額定值與電氣特性
| Series | Stratix III L |
| Logic Elements | 47,500 |
| Logic Array Blocks (LABs) | 1,900 |
| User I/O Pins | 488 |
| Total Memory Bits | 2,106 Kbit (M9K + M144K) |
| Transceiver Channels | 16 (up to 3.75 Gbps) + 8 (up to 6.5 Gbps) |
| 封裝 | 780-ball FC-FBGA (FineLine BGA), 1 mm pitch |
| Process Technology | 65 nm |
| Core Voltage | Selectable 1.1 V / 0.9 V |
| Speed Grade | I3 (industrial, third-fastest bin) |
| 工作溫度 | -40C to +100C (industrial) |
| 安裝類型 | Surface Mount |
| RoHS 狀態 | Compliant |
| Lead Free | Yes |
| Vertical Migration | Drop-in to EP3SL70 in 780-FBGA package |
EP3SL50F780I3 780-ball fc-fbga (fineline bga), 1 mm pitch 腳位配置指南
EP3SL50F780I3（780-ball fc-fbga (fineline bga), 1 mm pitch 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP3SL50F780I3.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP3SL50F780I3 適用於 6 應用s: 40G/100G Telecom Line-Card Packet Processing, Software-Defined Radio (SDR) Baseband, Video Broadcast Encoder / Decoder, ASIC Prototyping and Emulation, Military Secure Communications, Industrial Test and Measurement Instrumentation.
40G/100G Telecom Line-Card Packet Processing
The EP3SL50F780I3 is well suited for 40G/100G line-card designs where 16 transceivers at 3.75 Gbps plus 8 channels at 6.5 Gbps feed multi-lane packet processing pipelines. Its 47,500 logic elements and 2,106 Kbit embedded memory allow wide lookup tables and statistics counters while keeping per-port power manageable. Compared with a discrete ASIC approach, this device delivers design flexibility, in-field reprogrammability, and the ability to migrate up to EP3SL70 on the same 780-FBGA PCB as protocol standards evolve.
推薦
Software-Defined Radio (SDR) Baseband
The 65 nm Stratix III L fabric supports multi-channel DSP processing for software-defined radio baseband, including LTE and WiMAX physical-layer implementations. The embedded DSP blocks plus M9K/M144K memory deliver high tap-count FIR filters and FFT butterflies; the 488 user I/O allows multiple analog front-end interfaces without external logic. Selectable 0.9 V core operation reduces dynamic power in field-deployed SDR racks where thermal envelope is constrained.
推薦
Video Broadcast Encoder / Decoder
Broadcast video encoders (H.264 / MPEG-2 / JPEG2000) require parallel pixel processing at full-HD or 4K frame rates. The EP3SL50F780I3's 47,500 logic elements and 1,900 LABs deliver real-time motion estimation, variable-length coding, and DMA engines in a single device. Per the Altera Broadcast reference designs, this device family is commonly deployed in contribution encoders and studio playout servers.
推薦
ASIC Prototyping and Emulation
ASIC prototyping platforms partition large ASIC designs across multiple FPGAs; the EP3SL50F780I3's high logic density and 488 user I/O enable multi-board partitioning with sufficient board-to-board bandwidth. Quartus II design-flow integration with downstream ASIC synthesis tools shortens the prototype-to-silicon loop. Industrial temperature grade and lead-free packaging satisfy aerospace/defense program compliance requirements.
推薦
Military Secure Communications
Defense secure-radio platforms require FPGAs that operate across extended industrial temperature ranges with controlled supply-chain provenance. The EP3SL50F780I3's -40C to +100C industrial range and 65 nm low-power architecture make it appropriate for tactical radio baseband, signal-intelligence pre-processing, and military cryptographic accelerators. Per the manufacturer datasheet, the Stratix III family is widely deployed in ruggedized VPX and VME form-factor systems.
推薦
Industrial Test and Measurement Instrumentation
ATE pin-electronics, protocol analyzers, and high-speed digitizers leverage the EP3SL50F780I3's high transceiver count and embedded memory to stream multi-gigabit signals into host processors. The 6.5 Gbps channels support USB 3.0, PCIe Gen2, and 10 Gigabit Ethernet aggregation without external PHY devices. Quartus II integration with high-speed ADC/DAC reference designs accelerates time-to-market for modular instrumentation racks.
推薦
推薦產品摘要
工程參考資料，適用於 EP3SL50F780I3 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP3SL50F780I4 | EP3SL50F780I3N | EP3SL70F780I3 | EP3SE50F780I3 |
|---|---|---|---|---|---|
| Package | 780-ball FC-FBGA | 780-ball FC-FBGA - same | 780-ball FC-FBGA - same | 780-ball FC-FBGA - same | 780-ball FC-FBGA - same |
| Brand | Intel | Intel - same | Intel - same | Intel - same | |
| Logic Elements | 47,500 | 47,500 - same | 68,000 | 47,500 | |
| Speed Grade | I3 (industrial) | I4 (faster industrial) | I3 (industrial) | I3 (industrial) | |
| Operating Temperature | -40C to +100C | -40C to +100C | -40C to +100C | -40C to +100C | |
| Embedded Memory | 2,106 Kbit | 2,106 Kbit - same | 2,724 Kbit | 2,340 Kbit | |
| Transceiver Count | 16 (3.75 Gbps) + 8 (6.5 Gbps) | 16 + 8 - same | 16 + 8 - same | 24 + 12 | |
| Vertical Migration Target | EP3SL70F780 | EP3SL70F780 | EP3SL110F780 | EP3SE70/80F780 |
主要差異化特點
- Vertical-migration upgrade on identical footprint (對比EP3SL50F780I4)
- Higher logic density drop-in (對比EP3SL70F780I3)
- More transceivers per package (對比EP3SE50F780I3)
設計說明
The EP3SL50F780I3 requires a multi-rail power delivery network: VCCINT (selectable 1.1 V or 0.9 V), VCCAUX (2.5 V), VCCPD per I/O bank (2.5/3.3 V), and separate transceiver supplies VCCL/R/T. Decoupling must follow the Altera Stratix III PDN reference design with bulk, mid-frequency, and high-frequency capacitors placed close to each supply pin; missing the PDN spec will degrade transceiver jitter performance.
The 780-ball FC-FBGA uses 1 mm ball pitch and requires a multi-layer PCB (typically 12+ layers) with microvia stack-ups and matched-length differential routing for transceiver channels. Per the package footprint drawing, escape routing should use dog-bone fan-outs with ground via shielding; solid power planes directly below the package help thermal dissipation and reduce power-supply inductance.
Estimated: at maximum operating conditions (VCCINT 1.1 V, full transceiver activity, 100% logic utilization), worst-case power consumption for this density class is in the 10-15 W range. With the FC-FBGA package and no heatsink, board-level thermal design (copper pours, airflow) must keep junction below 100C. Always validate with manufacturer thermal models for the chosen operating profile.
Quartus II version compatibility is critical: Stratix III support requires Quartus II 9.0 SP2 or later; older versions do not include all device errata and may fail timing closure. Configuration scheme (JTAG, AS, AP, FPP) must be selected during Quartus II pin planning; mismatched MSEL pins will prevent configuration. Use only official Altera/Intel configuration devices (e.g., EPCS family) for passive serial configuration.
合規資訊
RoHS compliant and lead-free per Altera/Intel product page. AEC-Q100 not applicable (industrial FPGA, not automotive-grade). Halogen-free status not explicitly confirmed in available data.
