EP3SL50F780I3G - Stratix III L FPGA, 47.5K LE, 780-BGA | Intel
MPN： EP3SL50F780I3G ⚠ 最後購買機會EP3SL50F780I3G 概覽
An FPGA (Field-Programmable Gate Array) is a programmable logic device containing an array of configurable logic blocks, embedded memory, DSP blocks, and programmable interconnect fabric. FPGAs are positioned between discrete logic and ASICs in the digital design hierarchy: ASIC > CPLD > FPGA > discrete logic > standard-cell IC, and they belong to the broader family of programmable logic devices that includes CPLDs, SPLDs, and structured ASICs. The Stratix III L sub-family specifically reduces static and dynamic power versus the standard Stratix III family while preserving the same high-performance transceiver and memory architecture, enabling fan-out to power-budgeted telecom, industrial, and test & measurement designs.
Key features of the EP3SL50F780I3G include support for up to 488 general-purpose I/Os, 2,184,192 bits of total on-chip memory (distributed plus block RAM), high-speed transceivers, and dedicated DSP blocks for fixed- and floating-point operations. The 780-pin FCBGA package supports high-pin-count designs while offering a thermal envelope that scales with PCB copper area. The -I3 grade specifies an industrial operating range of -40C to +100C junction and a moderate speed bin, balancing timing margin against leakage.
On the architecture side, Stratix III L uses Intel's 65 nm process and an ALM-based fabric that delivers finer-grained logic packing than legacy 4-LUT architectures, reducing logic-element waste for wide arithmetic paths. Memory blocks (M9K/M144K) and DSP blocks operate at up to ~500 MHz internally per the Stratix III family capability, supporting external memory interfaces such as DDR3 with PHY hard IP.
Typical applications include wireless baseband preprocessing, software-defined radio front ends, video format conversion and bridging, industrial motor control and robotics, medical imaging preprocessing, and test & measurement instrumentation. Engineers targeting these workloads select this device when they need more logic and DSP than a Cyclone family device but do not require the higher transceiver count of a Stratix V-class FPGA.
For PCB design, allocate at least 6 to 8 PCB layers for the 780-BGA break-out, with via-in-pad recommended for the inner-row balls. Use the Quartus II (or Intel Quartus Prime) software for synthesis, place-and-route, and power estimation; legacy Stratix III support is available through the Quartus II subscription service.
This page synthesizes distributor pricing, drop-in package-compatible alternatives from the Stratix III L family, and PCB design considerations that complement the manufacturer datasheet.
直接替換替代品，適用於 EP3SL50F780I3G — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP3SL50F780I3G （相同外形與佔位） — 差異在於 Package, Operating Temperature, Speed Grade, Mounting Type, Process Technology.
EP3SL50F780I3N
✅ 直接替換聯絡詢價
查看資料表 →EP3SL50F780I4N
✅ 直接替換聯絡詢價
查看資料表 →EP3SL50F780C4N
✅ 直接替換聯絡詢價
查看資料表 →EP3SL200H780I3N
✅ 直接替換聯絡詢價
查看資料表 →EP3SE50F780I3G
✅ 直接替換聯絡詢價
查看資料表 →EP3SL50F780I3G 最大額定值與電氣特性
| Family | Stratix III L |
| Logic Elements | 47,500 LE |
| Adaptive Logic Modules (ALMs) | 19,000 ALM |
| Embedded Memory | 2.08 Mbit |
| Total Memory Bits | 2,184,192 bit |
| User I/Os | 488 I/O |
| Operating Supply Voltage (Core) | 1.1 V |
| 工作溫度 | -40C to +100C |
| Speed Grade | I3 (industrial) |
| 封裝 | 780-ball FCBGA (F780) |
| 安裝類型 | Surface Mount (SMD/SMT) |
| Process Technology | 65 nm CMOS |
| RoHS 狀態 | Compliant |
| Lead-Free | Yes |
| MSL 等級 | 3 (per JEDEC J-STD-020) |
EP3SL50F780I3G 780-ball fcbga (f780) 腳位配置指南
EP3SL50F780I3G（780-ball fcbga (f780) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP3SL50F780I3G.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP3SL50F780I3G 適用於 6 應用s: Wireless Baseband Preprocessing, Video Format Conversion and Bridging, Industrial Motor Control and Robotics, Medical Imaging Preprocessing, Test and Measurement Instrumentation, Software-Defined Radio Front End.
Wireless Baseband Preprocessing
The EP3SL50F780I3G fits wireless baseband preprocessing because its 19,000 ALMs and dedicated DSP blocks deliver the parallel arithmetic throughput needed for channelization, crest-factor reduction (CFR), and digital predistortion (DPD) on multi-carrier signals. With 2,184,192 bits of embedded memory, designers can store FIR coefficients and HARQ buffers on-chip without external SRAM. The 1.1 V core reduces power in radio units that are already thermally constrained. Compared with a fixed-function DSP, the FPGA fabric supports late-spec updates to LTE/5G-NR algorithms, which is critical for infrastructure vendors shipping multi-standard platforms.
推薦
Video Format Conversion and Bridging
In video format conversion and bridging, the EP3SL50F780I3G's 488 user I/Os comfortably handle SDI, HDMI, DisplayPort, and parallel RGB/YC interfaces in parallel. Its M9K and M144K memory blocks implement line buffers and frame buffers needed for scaling, deinterlacing, and chroma resampling. Quartus II Video and Image Processing (VIP) Suite IP cores accelerate time-to-market for resolution and frame-rate conversion. The industrial -I3 grade is appropriate for broadcast studio and pro-AV equipment that must operate 24/7 in mixed-temperature environments.
推薦
Industrial Motor Control and Robotics
The EP3SL50F780I3G suits industrial motor control and robotics because the FPGA fabric can host multi-axis field-oriented control (FOC) loops, SVPWM generators, and EtherCAT / PROFINET MACs simultaneously. The 65 nm low-power L variant keeps continuous operating power low enough for sealed cabinet designs where heat removal is limited. Hardware DSP blocks implement Park/Clarke transforms and PI controllers with deterministic latency. The -40C to +100C industrial temperature grade is essential for factory-floor and outdoor robotics enclosures.
推薦
Medical Imaging Preprocessing
In medical imaging preprocessing, the EP3SL50F780I3G can perform real-time filtering, beamforming, and noise reduction on ultrasound or CT front-end data. The 2.08 Mbit embedded memory provides scratchpad storage for line and block processing; off-chip DDR3 PHY hard IP connects to bulk frame storage. Deterministic hardware execution of DSP pipelines meets latency budgets required by diagnostic workflows. The device is also used in patient-monitoring equipment that needs flexible glue logic between analog front ends and ARM/i.MX application processors.
推薦
Test and Measurement Instrumentation
The EP3SL50F780I3G is widely used in test and measurement instruments where the FPGA acts as a pattern generator, real-time correlator, or trigger engine. Designers exploit the parallel logic for PCIe Gen1/Gen2 endpoints to stream digitized ADC data to a host processor at multi-GB/s rates. M9K memory blocks implement deep capture buffers while M144K blocks build FFT-windowed accumulators. The industrial temperature grade supports lab and field-deployed instrumentation. Quartus II SignalTap II embedded logic analyzer eases bring-up of complex measurement firmware.
推薦
Software-Defined Radio Front End
The EP3SL50F780I3G fits software-defined radio (SDR) front ends where the FPGA implements digital up/down conversion, decimation/interpolation, and channel filtering before baseband processing. Its DSP blocks deliver GMACs of fixed-point throughput for multi-channel DDC chains; M9K memories store NCO waveforms and FIR coefficients. With proper PCB layout, the device interfaces to ADCs and DACs at hundreds of MSPS, supporting sub-6 GHz RF chains used in public-safety, milcom, and cognitive-radio applications.
推薦
推薦產品摘要
工程參考資料，適用於 EP3SL50F780I3G — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP3SL50F780I3N | EP3SL50F780I4N | EP3SL50F780C4N | EP3SL200H780I3N | EP3SE50F780I3G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-ball FCBGA (F780) | 780-ball FCBGA (F780) - same | 780-ball FCBGA (F780) - same | 780-ball FCBGA (F780) - same | 780-ball FCBGA (H780) - same ball count, hybrid package | 780-ball FCBGA (F780) - same |
| Logic Elements | 47,500 LE | 47,500 LE | 47,500 LE | 47,500 LE | 200,000 LE | 47,500 LE |
| Speed Grade | I3 (industrial) | I3 (industrial) | I4 (industrial, faster) | C4 (commercial) | I3 (industrial) | I3 (industrial) |
| Temperature Grade | -40C to +100C (industrial) | -40C to +100C (industrial) | -40C to +100C (industrial) | 0C to +85C (commercial) | -40C to +100C (industrial) | -40C to +100C (industrial) |
| Power Family | Stratix III L (low power) | Stratix III L (low power) | Stratix III L (low power) | Stratix III L (low power) | Stratix III L (low power) | Stratix III E (standard power) |
| Lifecycle Status | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy |
主要差異化特點
- Lowest-power Stratix III L variant in the 47.5K-LE density tier (對比EP3SE50F780I3G (Stratix III E))
- Industrial-grade 780-BGA package with 488 user I/Os (對比EP3SL50F484I3N (484-BGA variant))
- Same-package I4 speed grade available for timing-margin tightening (對比EP3SL50F780I4N)
設計說明
The 780-ball FCBGA package requires a high-density PCB build. Use at least 6 to 8 layers with via-in-pad (VIP) for the inner-row balls to escape cleanly. Match the manufacturer's recommended ball-pad diameter (typically 0.45 to 0.50 mm) and solder-mask-defined (SMD) pad geometry to avoid tombstoning during reflow. Estimated: a 1-oz copper outer layer with 4 inner 1-oz power/ground planes is sufficient for the 1.1 V core current, but verify with the Stratix III thermal model and power estimator in Quartus II before committing to stack-up.
Despite being the low-power L variant, the EP3SL50F780I3G can still dissipate several watts when transceivers and DSP blocks run at full utilization. Place a thermal via array directly under the package center and tie the thermal pad to an inner ground plane. Estimate a junction-to-ambient (theta_JA) of ~12 to 15 C/W on an 8-layer board with adequate copper; a small heatsink or forced-air cooling extends reliability in sealed industrial enclosures. The -I3 industrial grade limits Tj to 100C, so always budget thermal margin for worst-case utilization.
Stratix III L devices require multiple supply rails (VCC, VCCP, VCCPD, VCCPGM, VCC_AUX, VCC_BATT, and per-bank VCCIO). Sequence the rails per the Stratix III pin connection guidelines to avoid long-term reliability issues; an integrated FPGA power sequencer such as the Intel EN5339 or a discrete MOSFET-based sequencer is recommended. Decouple each rail with bulk, mid-frequency, and high-frequency capacitors placed within 2 mm of the relevant balls. The PowerPlay Power Analyzer tool in Quartus II produces an early thermal/power budget to size the rails correctly.
The 488 user I/Os are organized into I/O banks with independent VCCIO supplies. Group interfaces by voltage standard (LVDS, LVTTL, HSTL, SSTL, LVCMOS) into dedicated banks to avoid mixing incompatible standards in one bank. Use the Stratix III IBIS models for board-level SI simulation on multi-hundred-MHz parallel buses and SDR/DDR memory interfaces. For DDR3, follow the Intel-supported fly-by topology and read-levelling guidance in the External Memory Interface Handbook.
Common pitfalls when designing in the EP3SL50F780I3G include: (1) using the wrong Quartus II device pin connection file - always select the exact suffix (F780, I3, G); (2) failing to level-shift configuration signals when JTAG voltages do not match the FPGA; (3) tying CONFIG_DONE and nSTATUS incorrectly, which prevents in-system programming; (4) ignoring the MSL 3 floor-life budget during PCB assembly. Always read the latest Stratix III errata and PCN notices before taping out a board.
合規資訊
RoHS and lead-free status confirmed by the G suffix in the orderable part number; AEC-Q100 automotive qualification not applicable for this industrial-grade FPGA. Halogen-free status not explicitly stated in the verified distributor data.
