EP3SL50F780C4N - Stratix III L FPGA, 47.5K LE, 780-FBGA | Intel
MPN： EP3SL50F780C4N ✓ 啟用中EP3SL50F780C4N 概覽
A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device that combines programmable logic blocks, programmable interconnect, and dedicated hard IP (transceivers, memory interfaces, multipliers) into a single die. FPGAs sit at the top of the digital logic hierarchy: programmable logic -> configurable logic block -> FPGA -> programmable semiconductor. Stratix III in particular introduced advanced power management, hard memory controllers, and DSP blocks, making it the workhorse for high-throughput digital signal processing, high-speed serial links, and ASIC prototyping in the late-2000s and early-2010s design cycles.
Key features include 47,500 logic elements, 2,184,192 embedded RAM bits (about 273 KB), 488 user I/Os, hard DSP blocks for high-speed arithmetic, hard memory controllers supporting DDR/DDR2/DDR3, and dedicated high-speed transceivers in higher-density family members. The 65 nm process delivers a favorable performance-per-watt ratio versus the prior Stratix II generation, and the 780-ball FC-FBGA package exposes many high-speed SERDES-capable pins while keeping board-level routing feasible.
Typical applications include ASIC prototyping and emulation, high-speed data-acquisition front-ends, telecom baseband signal processing, military/aerospace DSP, test-and-measurement instrumentation, and high-performance compute accelerators. The large logic capacity combined with 488 user I/Os also makes it suitable for industrial imaging and broadcast video processing.
When designing with the EP3SL50F780C4N, follow Altera's Stratix III Hardware Reference Manual power-up sequencing: drive all power rails through the Power Management Bus (PMBus) or a TI/Linear Technology sequencer, and respect the 1.1 V core / 0.86-1.15 V supply window. Decoupling and PCB layout for a 780-ball FC-FBGA demand a multilayer board with buried vias and a solid ground pour.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet. The data sources include distributor listings, the Altera/Intel Stratix III datasheet family, and the manufacturer product page.
直接替換替代品，適用於 EP3SL50F780C4N — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP3SL50F780C4N （相同外形與佔位） — 差異在於 Package, Speed Grade, Operating Temperature, Embedded Memory, Embedded Memory Bits.
EP3SL50F780C3N
✅ 直接替換聯絡詢價
查看資料表 →EP3SL50F780C4
✅ 直接替換聯絡詢價
查看資料表 →EP3SL50F780C2N
✅ 直接替換聯絡詢價
查看資料表 →EP3SE50F780C4N
✅ 直接替換聯絡詢價
查看資料表 →EP3SE50F780C3N
✅ 直接替換聯絡詢價
查看資料表 →EP3SL50F780C4N 最大額定值與電氣特性
| Family | Stratix III L |
| Series | EP3SL50 |
| Logic Elements (LEs) | 47,500 |
| Number of LABs / CLBs | 1,900 |
| Total RAM Bits | 2,184,192 (273 KB) |
| Number of User I/Os | 488 |
| Number of GPIO | 488 |
| 封裝 | 780-BBGA, FCBGA (FBGA-780) |
| Process Technology | 65 nm CMOS |
| Speed Grade | -4 |
| 工作溫度 | 0C to +85C (commercial) |
| Core Voltage Range | 0.86 V to 1.15 V |
| 安裝類型 | Surface Mount |
| Lead Free / RoHS | Lead free, RoHS compliant per distributor listing |
| Maximum Operating Frequency | 717 MHz (per family) |
| DSP Blocks | Hard DSP blocks (Stratix III family) |
| Memory Interface Support | DDR, DDR2, DDR3 (family feature) |
EP3SL50F780C4N 780-bbga, fcbga (fbga-780) 腳位配置指南
EP3SL50F780C4N（780-bbga, fcbga (fbga-780) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP3SL50F780C4N.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP3SL50F780C4N 適用於 6 應用s: ASIC Prototyping and Emulation, Telecom Baseband Signal Processing, High-Speed Data Acquisition Front-End, Industrial Imaging and Machine Vision, Military and Aerospace Avionics DSP, Test and Measurement Instrumentation.
ASIC Prototyping and Emulation
The EP3SL50F780C4N is widely used as an ASIC and SoC prototyping platform. With 47,500 LEs, 1,900 LABs, 2,184,192 bits of embedded block RAM, and 488 user I/Os, it can map mid-complexity ASIC RTL directly into programmable logic while preserving timing closure targets. Its hard DDR/DDR2/DDR3 memory controllers in the Stratix III L family shorten bring-up for memory subsystems that would otherwise require a soft controller. Combined with Quartus II synthesis and TimeQuest timing analysis, designers can validate multi-million-gate ASIC designs at near-ASIC clock frequencies. The 488 GPIO budget is more than enough to expose PCIe-style endpoints, memory buses, and high-speed parallel interfaces for in-system validation.
推薦
Telecom Baseband Signal Processing
The Stratix III L family, including the EP3SL50F780C4N, is well-suited to telecom baseband processing where 65 nm power efficiency and hard DSP blocks are key advantages. The hard DSP blocks accelerate FIR filters, FFTs, and QAM demodulation, while the 488 user I/Os route multiple antenna data streams and CPRI/OBSAI baseband lanes. Operating at up to 717 MHz, the device sustains sample rates sufficient for LTE and early 5G prototype baseband chains. The low-power sub-family architecture keeps junction temperature manageable in dense line-card designs where multiple FPGAs share a confined chassis.
推薦
High-Speed Data Acquisition Front-End
The EP3SL50F780C4N fits high-speed data acquisition front-ends that need large FIFOs and parallel ADC/DAC interfaces. Its 2,184,192 bits of embedded block RAM give a sustained on-chip buffering budget (about 273 KB) for high-sample-rate capture before DMA to host memory, while the 488 user I/Os allow direct interfacing to multi-channel LVDS or parallel CMOS ADCs without external muxes. Hard memory controllers simplify external DDR2/DDR3 buffering for sustained streams. The 780-ball FBGA package exposes enough high-speed SERDES-capable pins for typical 1-2 Gbps ADC link rates in test and measurement instruments.
推薦
Industrial Imaging and Machine Vision
The EP3SL50F780C4N supports industrial imaging pipelines where raw sensor data throughput is the bottleneck. Its 488 user I/Os handle multiple Camera Link or MIPI CSI-2 channels, while hard DSP blocks accelerate 2D convolution and color-space conversion at line rate. The 273 KB of embedded block RAM is enough for line buffers in real-time image processing, and the 65 nm process keeps total power dissipation within industrial chassis thermal budgets. Quartus II IP cores for Camera Link, CoaXPress, and GigE Vision are validated on this device family, accelerating time-to-market for vision-system OEMs.
推薦
Military and Aerospace Avionics DSP
Aerospace and defense programs continue to use Stratix III devices such as the EP3SL50F780C4N for signal-intelligence and radar-baseband processing, where long product lifecycles and ITAR-controlled supply chains favor mature FPGAs. The 47,500 LEs are enough to implement pulse compression, MTI filtering, and beamforming for airborne radar front-ends, while the 488 GPIO count accommodates multiple analog front-end data lanes. The 65 nm Stratix III L process is qualified for harsh-environment operation, and the FBGA-780 package is compatible with established avionics PCB stackups. Many defense primes have validated FPGA bitstreams that they expect to re-use across production runs.
推薦
Test and Measurement Instrumentation
The EP3SL50F780C4N is well-suited for high-end oscilloscopes, protocol analyzers, and logic analyzer back-ends. Its 488 user I/Os capture wide parallel buses, while hard memory controllers drive deep DDR3 acquisition memory. The hard DSP blocks accelerate real-time trigger calculations, FFT-based spectrum displays, and statistical analysis on multi-gigasample waveforms. The 65 nm Stratix III L power efficiency allows dense channel count in a single 1U or 2U chassis without thermal throttling, and the FBGA-780 package supports high-density PCB layouts required for multi-GHz analog front-ends adjacent to the FPGA.
推薦
推薦產品摘要
工程參考資料，適用於 EP3SL50F780C4N — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP3SL50F780C3N | EP3SL50F780C4 | EP3SL50F780C2N | EP3SE50F780C4N | EP3SE50F780C3N |
|---|---|---|---|---|---|---|
| Package | FBGA-780 | FBGA-780 - same | FBGA-780 - same | FBGA-780 - same | FBGA-780 - same | FBGA-780 - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 47,500 | 47,500 | 47,500 | 47,500 | 47,500 | 47,500 |
| Speed Grade | -4 | -3 | -4 | -2 | -4 | -3 |
| Sub-Family | L (Low power) | L (Low power) | L (Low power) | L (Low power) | E (Enhanced) | E (Enhanced) |
| Total RAM Bits | 2,184,192 | 2,184,192 | 2,184,192 | 2,184,192 | Higher (E sub-family) | Higher (E sub-family) |
| User I/Os | 488 | 488 | 488 | 488 | 488 | 488 |
| Process | 65 nm CMOS | 65 nm CMOS | 65 nm CMOS | 65 nm CMOS | 65 nm CMOS | 65 nm CMOS |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
主要差異化特點
- Mid-density sweet spot in the Stratix III L family (對比EP3SL340F1760C4N)
- Low-power sub-family for thermal-constrained designs (對比EP3SE50F780C4N)
- Same-package speed-grade flexibility (對比EP3SL50F780C3N)
設計說明
Stratix III FPGAs require multi-rail power sequencing (VCCINT 1.1 V, VCCAUX, VCCIO banks, VCCPD, VCCBAT) per the Stratix III Power Management Bus specification. Use a TI TPS53820 or equivalent PMBus-compliant controller. Power-on must follow the VCCINT -> VCCAUX -> VCCIO order; violation can cause long-term reliability degradation or inrush latch-up. For the EP3SL50F780C4N at full utilization, plan a 6-8 layer PCB with a 1 oz copper inner core and 2 oz top/bottom pour to keep VCCINT IR drop below 50 mV.
The FBGA-780 package is 1.0 mm pitch, demanding blind or buried microvias in the breakout region. Recommended stackup is a 1-6-1 or 2-8-2 build with the BGA land pads on the top layer and via-in-pad for inner rows. Provide a continuous ground plane directly under the BGA and stitch grounds with 200-mil spacing to control return-path impedance for the high-speed transceivers. Use Altera's FBGA-780 package-symbol and pin-out files from Quartus II to drive your CAD library.
Common design pitfalls for the EP3SL50F780C4N: (1) forgetting the CF (configuration) pin pull-up requirements for AS or JTAG modes; (2) leaving any VCCIO bank unconnected - all banks must be powered, even unused ones; (3) under-estimating configuration time for 47,500-LE designs and selecting an EPCS or EPCQ flash too small; (4) omitting the POR (power-on-reset) decoupling on VCCPD - causes random configuration failures at cold start. Refer to AN 571: Using the Stratix III Configuration Scheme for a checklist.
Estimated: at 100% LE utilization, 50% toggle rate, and 717 MHz operation, the EP3SL50F780C4N can dissipate 4-6 W. With the FBGA-780 theta_JA around 13-15 C/W for a JEDEC 8-layer test board (refer to package thermal model), junction temperature rises 50-90 C above ambient. Without airflow or a heatsink, derate clock rate or utilization to keep Tj below 100 C in commercial-temperature applications. Use the Stratix III PowerPlay Early Power Estimator (EPE) spreadsheet to validate your thermal budget before tape-out.
合規資訊
RoHS and lead-free status confirmed by distributor listings (DigiKey, Octopart). Stratix III is not AEC-Q100 qualified - it is a commercial/industrial/military-temp FPGA. Halogen-free status not explicitly confirmed in distributor data - left as unknown.
