EP4CGX110DF31C6N - Cyclone IV GX FPGA, 109K LE, 896-FBGA | Intel
MPN： EP4CGX110DF31C6N ✓ 啟用中EP4CGX110DF31C6N 概覽
An FPGA (Field-Programmable Gate Array) is a reconfigurable integrated circuit whose logic fabric, routing, and I/O behaviour are defined by a user-supplied configuration bitstream rather than by the silicon vendor. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs) - alongside CPLDs - and are used to implement arbitrary digital logic, memory blocks, arithmetic units, and protocol controllers without custom ASIC NRE. The Cyclone IV GX family specifically targets low-cost, transceiver-equipped designs in the FPGA -> programmable logic -> digital semiconductor hierarchy.
Key differentiating features include 156 embedded 18x18 multipliers for DSP workloads, 4 PLLs for clock synthesis, and a hard PCIe Gen1 controller. The 896-ball FBGA package supports high-density board designs where signal integrity, controlled-impedance routing, and power-integrity decoupling are critical. Cyclone IV GX is the lowest-cost Altera/Intel family with multi-gigabit transceivers, often displacing discrete PHY plus CPLD combinations.
In terms of architecture, the EP4CGX110 uses Logic Array Blocks (LABs) containing 16 logic elements each, M9K memory blocks, and distributed MLAB memory. Configuration is loaded via JTAG, Active Serial (AS), or Passive Parallel (PPS) modes from external flash. The device is supported by Intel Quartus Prime design software across the full Cyclone IV GX tool flow.
Typical applications include industrial machine vision, broadcast video processing, low-cost wireline protocol bridging, and PCI Express endpoint cards. The transceiver channels suit SFP/QSFP cages, CPRI links for small-cell base stations, and LVDS/Sub-LVDS display bridging. With 475 user IOs the part also drives wide parallel buses for legacy interface replacement.
When designing with this device, allocate at least one full PCB layer pair for power delivery and use 0402/0201 decoupling placed as close as possible to every BGA ball. Series-termination resistors on LVDS/Sub-LVDS pairs are recommended within 5 mm of the FPGA pin.
This page synthesizes verified distributor pricing, drop-in Cyclone IV GX alternatives, and practical board-design notes not found in the manufacturer datasheet alone.
直接替換替代品，適用於 EP4CGX110DF31C6N — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP4CGX110DF31C6N （相同外形與佔位） — 差異在於 Package, Speed Grade, Embedded Memory, Family, RoHS Status.
EP4CGX110DF31C7N
✅ 直接替換聯絡詢價
查看資料表 →EP4CGX110DF31I7N
✅ 直接替換聯絡詢價
查看資料表 →EP4CGX110DF27C8N
✅ 直接替換聯絡詢價
查看資料表 →EP4CGX110CF23C7N
✅ 直接替換聯絡詢價
查看資料表 →EP4CGX150DF31C6N
✅ 直接替換📋 參考替代品（不在目錄中）
EP4CE75F29C8N
✅ 直接替換聯絡詢價
查看資料表 →EP4CGX110DF31C6N 最大額定值與電氣特性
| Family | Cyclone IV GX |
| Logic Elements | 109,424 |
| Embedded Memory | 5,621,760 bits |
| User I/O Pins | 475 |
| Embedded 18x18 Multipliers | 156 |
| PLLs | 4 |
| Transceiver Count | Up to 8 |
| Transceiver Data Rate | Up to 3.125 Gbps |
| Process Technology | 60 nm |
| Core Voltage | 1.2 V |
| 封裝 | 896-ball FBGA (F31) |
| Speed Grade | C6 |
| 工作溫度 | 0C to +85C (commercial) |
| Configuration Modes | JTAG, AS, PPS |
| PCIe Hard IP | PCIe Gen1 x1/x2/x4 |
| 安裝類型 | Surface Mount (BGA) |
EP4CGX110DF31C6N 896-ball fbga (f31) 腳位配置指南
EP4CGX110DF31C6N（896-ball fbga (f31) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP4CGX110DF31C6N.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP4CGX110DF31C6N 適用於 6 應用s: Industrial Machine Vision, Broadcast Video Processing, PCI Express Endpoint Card, Small-Cell Base Station CPRI Link, LVDS / Sub-LVDS Display Bridge, Multi-Protocol Wireline Bridge.
Industrial Machine Vision
The EP4CGX110DF31C6N's 109,424 logic elements, 156 embedded 18x18 multipliers, and 475 user IOs make it well suited for industrial machine vision pipelines running multiple Camera Link or CoaXPress frame-grabber channels. The 5,621,760 bits of embedded memory buffer full-HD image rows without external SRAM, while four PLLs derive pixel-clock domains from sensor LVDS inputs. Eight multi-gigabit transceivers at 3.125 Gbps drive GigE Vision or USB3 Vision uplinks to host PCs. Design tip: allocate a dedicated ground pour under the BGA and route LVDS pairs with 100 ohm differential impedance.
推薦
Broadcast Video Processing
Broadcast video designs using SDI, HDMI, or DisplayPort benefit from the EP4CGX110DF31C6N's up to eight 3.125 Gbps transceivers, which can carry 3G-SDI or HDMI 1.4 TMDS streams with external PHY conditioning. 156 DSP blocks enable real-time scaling, deinterlacing, and color-space conversion, while 475 user IOs aggregate 24-bit RGB buses and parallel video interfaces. Quartus Prime supports free video IP cores for HDMI and SDI. Design tip: place AC-coupling caps within 5 mm of each transceiver ball and isolate the transceiver power island with a ferrite bead.
推薦
PCI Express Endpoint Card
The EP4CGX110DF31C6N integrates a hard PCIe Gen1 IP block supporting x1, x2, or x4 lanes at 2.5 Gbps, eliminating external PHY ICs and reducing BOM cost. 109K logic elements implement the PCIe TLP/DLL state machine, BAR mapping, MSI-X interrupts, and customer application logic. Designers can prototype Gen1 endpoint cards on low-cost boards and migrate to Gen2 if higher throughput is needed. Design tip: the PCIe reference clock must be AC-coupled to the FPGA refclk pins; reference Intel AN 456 for board layout.
推薦
Small-Cell Base Station CPRI Link
CPRI (Common Public Radio Interface) links between baseband units and remote radio heads run at 3.072 Gbps (CPRI option 6) or higher; the EP4CGX110DF31C6N's eight 3.125 Gbps transceivers comfortably handle four CPRI links plus an SFP+ uplink. 109K logic elements implement the CPRI framing, antenna-carrier mapping, and CPRI-to-Ethernet bridging. The 1.2 V core and 60 nm process deliver low standby power for outdoor small-cell deployments. Design tip: use separate analog and digital power rails and route reference clocks with controlled impedance.
推薦
LVDS / Sub-LVDS Display Bridge
The EP4CGX110DF31C6N drives up to 475 LVDS or Sub-LVDS pairs, making it ideal for converting between legacy parallel LCD interfaces and modern MIPI DSI/CSI bridges. Designers use the PLL-driven LVDS SERDES to serialize 24/48-bit RGB buses onto a small number of twisted pairs, easing flex-cable routing. 156 multipliers accelerate color-space conversion and dithering. Design tip: match LVDS trace lengths to within 5 mil across each channel and add a common-mode choke near the connector.
推薦
Multi-Protocol Wireline Bridge
Protocol-bridging applications such as Serial RapidIO to Ethernet, PCIe to Aurora, or SGMII to RGMII benefit from the EP4CGX110DF31C6N's mix of transceivers and abundant logic. The device can implement two independent bridging channels simultaneously using only a fraction of the 109K logic budget, leaving room for on-chip packet buffering in 5,621,760 bits of embedded memory. Quartus Prime supports Serial RapidIO and SGMII soft-IP cores free of charge. Design tip: route each transceiver channel on its own ground-bordered microstrip to minimize crosstalk.
推薦
工程參考資料，適用於 EP4CGX110DF31C6N — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP4CGX110DF31C7N | EP4CGX110DF31I7N | EP4CGX110DF27C8N | EP4CGX110CF23C7N | EP4CGX150DF31C6N | EP4CE75F29C8N |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 896-ball FBGA (F31) | 896-ball FBGA (F31) - same | 896-ball FBGA (F31) - same | FBGA-672 (F27) - different | FBGA-484 (F23) - different | 896-ball FBGA (F31) - same | FBGA-780 (F29) - different |
| Logic Elements | 109,424 | 109,424 | 109,424 | 109,424 | 109,424 | 149,760 | 78,400 (Cyclone IV E) |
| Speed Grade | C6 | C7 (faster) | I7 (industrial, faster) | C8 | C7 | C6 | C8 |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Embedded Memory (bits) | 5,621,760 | 5,621,760 | 5,621,760 | 5,621,760 | 5,621,760 | 6,480,000 | 3,063,552 (Cyclone IV E) |
| User I/O Pins | 475 | 475 | 475 | 380 | 290 | 475 | 488 |
| Transceiver Count | 8 (up to 3.125 Gbps) | 8 | 8 | 8 | 4 | 8 | 0 (Cyclone IV E, no transceivers) |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
主要差異化特點
- Integrated 3.125 Gbps transceivers (對比EP4CE75F29C8N)
- Hard PCIe Gen1 controller (對比EP4CE75F29C8N)
- Higher density than Cyclone IV E mid-range (對比EP4CE75F29C8N)
設計說明
Estimated: the EP4CGX110DF31C6N draws approximately 1.5 A to 3.5 A from the 1.2 V VCCINT rail and 0.3 A to 1.5 A from each VCCIO bank, depending on toggle rate and utilization. Decouple VCCINT with 4 x 10 uF bulk + 40 x 100 nF ceramics distributed under the BGA, and place 4 x 4.7 uF per VCCIO bank. Provide separate analog VCCAUX and VCCA_PLL rails each decoupled with 100 nF and 10 uF. Use Intel PowerPlay early-power-estimator to refine your budget before sign-off.
Estimated: the 896-ball F31 FBGA uses 1.0 mm ball pitch and a 31 mm x 31 mm body. Microvia (0.1 mm) stack-up is mandatory, and at least one full PCB layer pair should be dedicated to power/GND with the VCCINT island poured continuously under the die. Maintain 100 ohm differential impedance on transceiver pairs, with intra-pair skew below 5 mil. Reference Intel AN 456 for the full Cyclone IV GX high-speed-layout checklist.
Estimated: each multi-gigabit transceiver channel should be AC-coupled with 100 nF caps within 5 mm of the FPGA ball, and reference clocks must be AC-coupled to dedicated refclk pins. Use IBIS-AMI simulations (HSPICE) for critical 3.125 Gbps links, especially backplane applications where insertion-loss budgets of 10 to 15 dB apply at the Nyquist frequency.
Common pitfalls include: (1) omitting the JTAG pull-up on TCK/TMS, which prevents configuration; (2) leaving MSEL pins floating, which selects the wrong configuration mode; (3) under-estimating configuration flash write cycles - use a 16 Mb or larger SPI flash for AS mode; (4) not providing proper POR sequencing - assert nCONFIG after all rails are stable for at least 1 ms. Reference the Cyclone IV Device Handbook chapter 10 for the full configuration checklist.
合規資訊
RoHS and REACH compliance per Intel product page; not AEC-Q100 qualified (FPGAs are not typically AEC-Q100 unless specified). Halogen-free per JEDEC JS709.
