EP4SGX360KF43C2 - 353K LE Stratix IV GX FPGA 880 I/O FCBGA | Intel
MPN： EP4SGX360KF43C2 ✓ 啟用中EP4SGX360KF43C2 概覽
An FPGA (Field Programmable Gate Array) is a semiconductor device built from configurable logic blocks (CLBs/LABs), programmable interconnect, and hardened IP such as memory blocks, DSP blocks, and high-speed transceivers. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs), are classified alongside CPLDs, and occupy the high-performance tier of digital semiconductors. The Stratix IV family targets applications requiring maximum logic density combined with embedded transceivers and DSP bandwidth, bridging ASIC-class performance with field-programmable flexibility.
Key features include 353,600 logic elements with adaptive logic modules (ALMs), embedded 18x18 multipliers for DSP pipelines, and dedicated transceivers capable of multi-gigabit serial protocol operation. The 1760-ball FC-FBGA package provides a very high I/O count for board-level connectivity, while 23 Mbit of on-chip RAM reduces external memory traffic for buffering and packet processing workloads. The 40 nm process delivers high core density at industry-acceptable static and dynamic power for this device class.
The device architecture separates logic fabric, embedded memory, DSP blocks, and high-speed transceiver circuitry into independent columns, allowing designers to optimize floorplanning for their specific bandwidth, latency, and signal-integrity targets. PLL resources and clock networks distribute low-skew clocks across the die, and configuration is loaded via the standard Stratix IV active/passive modes including JTAG and serial configuration.
Typical applications include high-speed serial protocol bridging (PCIe Gen2, SATA, XAUI, CEI-6G), digital signal processing for radar and beamforming, software-defined radio and test equipment, broadcast video processing, and high-density ASIC prototyping. The high I/O count and embedded transceiver bandwidth also make the EP4SGX360KF43C2 suitable for high-performance compute accelerators and network packet processing.
When designing with this device, allocate the larger PCB area required for the 1760-ball FC-FBGA package. Use Intel's Quartus II design suite (with v13.0 or earlier service releases recommended for legacy Stratix IV support). Plan thermal dissipation carefully given the package size and core power; an adequate heatsink with thermal interface material is typically required for sustained workloads.
This page synthesizes distributor pricing, drop-in alternatives, and design considerations from the manufacturer datasheet not found in any single distributor listing.
直接替換替代品，適用於 EP4SGX360KF43C2 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP4SGX360KF43C2 （相同外形與佔位） — 差異在於 Package, Speed Grade, Mounting Type, Embedded Memory, Logic Cells.
EP4SGX360KF43I3N
✅ 直接替換聯絡詢價
查看資料表 →EP4SGX360KF43C3N
✅ 直接替換聯絡詢價
查看資料表 →EP4SGX360KF43C4N
✅ 直接替換聯絡詢價
查看資料表 →EP4SGX360KF43I4N
✅ 直接替換聯絡詢價
查看資料表 →EP4SGX360KF43C2 最大額定值與電氣特性
| Series | Stratix IV GX |
| Logic Elements | 353,600 |
| Number of LABs / CLBs | 14,144 |
| Total RAM Bits | 23,105,536 (approximately 28.5 Mbit user-accessible) |
| Logic Cells (alternative count) | 141,440 |
| User I/O Count | 880 |
| Core Voltage | 0.9 V |
| Process Technology | 40 nm |
| Transceivers | Yes (Stratix IV GX integrated high-speed transceivers) |
| 封裝 | 1760-BBGA, FCBGA (Fine-Pitch Chip-Scale BGA) |
| Package Code | FC-FBGA-1760 |
| 安裝類型 | Surface Mount |
| Operating Temperature Grade | Commercial (C2 suffix: 0C to +85C) |
| RoHS 狀態 | Compliant |
| Configuration Interface | JTAG, Passive Serial, Fast Passive Parallel, Active Serial |
| Design Software | Quartus II (legacy Stratix IV support) |
EP4SGX360KF43C2 fc-fbga-1760 腳位配置指南
EP4SGX360KF43C2（fc-fbga-1760 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP4SGX360KF43C2.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP4SGX360KF43C2 適用於 7 應用s: High-Speed Serial Protocol Bridging, Digital Signal Processing (DSP) for Radar and Beamforming, Software-Defined Radio (SDR) Baseband, ASIC Prototyping and Emulation, Broadcast Video Processing, High-Performance Network Packet Processing, Test and Measurement Instrumentation.
High-Speed Serial Protocol Bridging
The EP4SGX360KF43C2's Stratix IV GX integrated multi-gigabit transceivers support protocols including PCIe Gen2, SATA, XAUI, CEI-6G, and Serial RapidIO, while the 880 user I/O allow simultaneous parallel control plane interfaces. With 353,600 logic elements and 23 Mbit of embedded RAM, the device can implement bridging across mixed-speed domains, perform packet buffering, and run protocol stacks in a single die. The 1760-ball FC-FBGA package supports the high I/O and transceiver pin count required for backplane connectivity and multi-port bridging designs.
推薦
Digital Signal Processing (DSP) for Radar and Beamforming
The Stratix IV GX family integrates dedicated DSP blocks (18x18 multipliers and accumulators) alongside 353,600 logic elements, making the EP4SGX360KF43C2 ideal for radar pulse compression, FFT pipelines, and phased-array beamforming. The high I/O count (880 pins) connects to multi-channel ADC arrays, while embedded memory buffers intermediate samples with lower latency than external DDR. The 40 nm process delivers sufficient arithmetic density for sustained multiply-accumulate workloads in radar baseband and electronic warfare signal chains.
推薦
Software-Defined Radio (SDR) Baseband
Software-defined radio baseband processing benefits from the EP4SGX360KF43C2's combination of high logic density, multi-gigabit transceivers, and abundant embedded memory. Designers can implement wideband ADC/DAC interfaces, digital down/up-converters, channelizers, and PHY-layer processing on one device. The 880 user I/O connect to RF front-ends, while 0.9 V core voltage keeps power-per-gate reasonable for the high gate count. Industrial-grade variants exist for military SDR platforms.
推薦
ASIC Prototyping and Emulation
The 353,600 logic elements and 14,144 LABs make the EP4SGX360KF43C2 a classic target for multi-million-gate ASIC prototyping and full-chip emulation. The Stratix IV GX family is supported in Intel Quartus II, which includes rapid prototyping flows and partition-based multi-FPGA timing closure. Multi-FPGA emulation rigs partition large ASIC designs across several Stratix IV GX FPGAs using high-speed serial links between boards, leveraging the integrated transceivers.
推薦
Broadcast Video Processing
Broadcast video infrastructure (such as 4K/8K video routers, frame synchronizers, and SDI/HDMI bridges) requires very high I/O counts, real-time pixel-clock processing, and color-space conversion pipelines. The EP4SGX360KF43C2's 880 user I/O connect to multi-channel SDI/HDMI transceiver chips, while 23 Mbit of embedded memory buffer active video lines and lookup tables for gamma/color-correction. Serial transceivers handle SDI (SMPTE 424M/425M) and 10 GigE video over IP.
推薦
High-Performance Network Packet Processing
Network packet processing engines (such as 100G Ethernet switches, IPsec/TLS accelerators, and DPI line cards) combine high-speed serial interfaces with deep packet buffers and lookup engines. The EP4SGX360KF43C2's multi-gigabit transceivers aggregate multiple 10G/40G Ethernet links, while 353,600 logic elements implement TCAM lookups, classification engines, and queue managers. The 880 I/O connect to external DRAM/QDR for packet storage and to host CPUs over PCIe.
推薦
Test and Measurement Instrumentation
Test equipment such as logic analyzers, protocol exercisers, and arbitrary waveform generators benefit from the EP4SGX360KF43C2's parallel I/O (880 pins) for digital stimulus/acquisition and its multi-gigabit transceivers for protocol analysis (PCIe, SATA, USB 3.0, DisplayPort). Embedded RAM buffers acquisition records while logic elements implement pattern generators, BER testers, and protocol-aware decoders. The 0.9 V core and 40 nm process balance the high gate count against the chassis thermal budget of ATE racks.
推薦
推薦產品摘要
工程參考資料，適用於 EP4SGX360KF43C2 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP4SGX360KF43I3N | EP4SGX360KF43C3N | EP4SGX360KF43C4N | EP4SGX360KF43I4N | EP4SGX360KF40C2N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1760-BBGA, FCBGA | 1760-BBGA, FCBGA | 1760-BBGA, FCBGA | 1760-BBGA, FCBGA | 1760-BBGA, FCBGA | 1517-BBGA, FCBGA (different footprint) |
| Logic Elements | 353,600 | 353,600 | 353,600 | 353,600 | 353,600 | 353,600 |
| LABs/CLBs | 14,144 | 14,144 | 14,144 | 14,144 | 14,144 | 14,144 |
| Embedded RAM | 23,105,536 bits | 23,105,536 bits | 23,105,536 bits | 23,105,536 bits | 23,105,536 bits | 23,105,536 bits |
| User I/O Count | 880 | 880 | 880 | 880 | 880 | Reduced (smaller package) |
| Temperature Grade | Commercial (0C to +85C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Commercial (0C to +85C) |
| Speed Grade | C2 | I3 | C3 (faster) | C4 (fastest) | I4 (fastest industrial) | C2 |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
| Process | 40 nm | 40 nm | 40 nm | 40 nm | 40 nm | 40 nm |
主要差異化特點
- Highest I/O count in the Stratix IV GX family at this density tier (對比EP4SGX360HF35C2)
- Drop-in replacement flexibility within the same package family (對比EP4SGX290NF45)
- Superior logic density for ASIC prototyping (對比EP4CGX150CF23I7N)
- Integrated multi-gigabit transceivers as part of the GX family (對比Stratix IV E (EP4SE530H35C4N))
設計說明
The 1760-ball FC-FBGA package delivers high I/O but requires careful thermal design. Attach a heatsink with thermal interface material to the package's exposed die surface. Estimate: in a typical application with 70% utilization, core power may reach 8-12W, producing junction-to-ambient thermal gradients of 15-25C without forced airflow. Place at least four thermal vias directly beneath the package center thermal pad and ensure the PCB inner copper planes provide low-resistance heat spreading to the board edges.
The 1760-ball FC-FBGA at 1.0mm pitch (typical for this density class) requires a high-density interconnect (HDI) PCB stack-up with microvias. Recommended: 8-layer stack-up with sequential lamination, 1-2-1 via-in-pad plating at BGA pads, and a minimum of 0.2mm-diameter microvias. Per Intel's Stratix IV device handbook, escape routing at the BGA fan-out region should leave at least 0.5mm clearance from the package outline for signal layer transitions.
High-speed transceiver channels on the Stratix IV GX require matched-length routing and controlled-impedance (typically 100 ohm differential, 85 ohm for some standards). Per Intel's transceiver layout guidelines, keep AC-coupling capacitors within 100 mils of the transmitter pins, and minimize via stubs on the high-speed channel paths. Reference clock traces should be length-matched within 5 mils across all transceiver channels in the same quad.
Do not assume Stratix IV GX is supported in the latest Quartus Prime Pro - use Quartus II 13.0 or earlier (with the legacy Stratix IV support packs) or Quartus Prime Standard. Ignoring this is a common pitfall when transitioning projects from legacy groups to new engineers using modern Quartus installations. Additionally, verify the configuration scheme (JTAG, AS, PS, FPP) supports the device density at boot - some legacy EPCS configuration memories may not have the page count required.
The 0.9 V core must be supplied by a high-current, low-noise regulator. Estimate: at 100% utilization, core current can reach 12-15A peak during dynamic switching. Use a multi-phase buck regulator with ceramic output capacitors rated for 20A continuous. For transceiver PLLs, isolate the analog VCC_PLL rails with ferrite beads and provide low-noise LDO regulation. Include bulk decoupling on all rails within 50 mils of the package balls.
合規資訊
RoHS compliant per Altera/Intel product documentation. AEC-Q100 not applicable for FPGAs - choose automotive-qualified parts like Cyclone IV GX for AEC-Q100 requirements. Halogen-free per JESD709/JEDEC J709 for FCPGA-class packages.
