EPF8282ATC100-4 - 78 I/O FLEX 8000 FPGA, 100-TQFP | Intel
MPN： EPF8282ATC100-4 ✗ 停產EPF8282ATC100-4 概覽
A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that combines the high gate density and register-rich architecture of gate arrays with the design flexibility of in-system reprogrammability. FPGAs sit above simple PLDs in the programmable logic hierarchy and below fixed-function ASICs, belonging to the broader family of logic ICs in the semiconductor category. Their role is to provide hardware-level parallel logic that can be reconfigured for glue logic, bus interfacing, state machines, and protocol bridging without fabricating a custom ASIC.
Key features of the EPF8282ATC100-4 include 26 Logic Array Blocks (LABs), MultiVolt I/O support for 3.3 V or 5.0 V interface operation, in-circuit reconfigurability (ICR) for field updates without removing the part, and a typical propagation delay suitable for glue-logic and bridge applications up to 125 MHz. The architecture is register-rich, supporting up to 1,500 flip-flops for pipelined designs and synchronous state machines.
The FLEX 8000 device architecture supports the MultiVolt I/O feature, which allows devices to interface with mixed-voltage systems. The SRAM-based configuration cells mean the design is volatile - it must be reloaded on every power-up - which is why the device pairs with a configuration EPROM. The 100-pin TQFP package provides 78 usable I/O pins, leaving 22 pins for power, ground, configuration, JTAG, and dedicated functions.
Typical applications include industrial glue logic, legacy bus-interface bridges (ISA, PCI bridge buffers), protocol converters, telecommunications control logic, and embedded control systems requiring low-density reconfigurable logic. The 100-pin TQFP footprint is compatible with existing Altera FLEX 8000 design layouts, simplifying retrofit designs.
When designing with this device, allocate adequate time for configuration loading from the EPROM at power-up. Decouple all VCC pins with 0.1 uF ceramic capacitors placed as close to the package as possible. The MultiVolt I/O pins must be configured for the correct interface voltage (3.3 V or 5.0 V) before connection to mixed-voltage buses.
This page synthesizes distributor pricing, same-brand pin-compatible drop-in alternatives, and practical design notes that go beyond the manufacturer datasheet, with parametric comparison against the FLEX 8000 family siblings and form-fit-function (FFF) replacements.
直接替換替代品，適用於 EPF8282ATC100-4 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EPF8282ATC100-4 （相同外形與佔位） — 差異在於 Process Technology, Speed Grade, Package, Operating Temperature, Configuration Memory.
EPF8282ATC100-3
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EPF8282ATC100-2
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EPF8282ATC100-2W
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EPF8282ATC100-4N
✅ 直接替換聯絡詢價
查看資料表 →EPF81500ARC240-4
✅ 直接替換聯絡詢價
查看資料表 →EPF81188AQC208-3
✅ 直接替換聯絡詢價
查看資料表 →EPF8282ATC100-4 最大額定值與電氣特性
| Series | FLEX 8000 |
| Family | Flex 8000 FPGA |
| Number of Logic Elements/Cells | 208 |
| Number of LABs/CLBs | 26 |
| Number of I/O | 78 |
| Usable Gates | 2500 |
| 供應電壓 | 5 V |
| I/O Voltage (MultiVolt) | 3.3 V or 5.0 V |
| 工作溫度 | 0 C to 70 C |
| 安裝類型 | Surface Mount |
| 封裝 / 外殼 | 100-TQFP (LFQFP, S-PQFP-G100) |
| 腳位數 | 100 |
| Terminal Pitch | 0.500 mm |
| Logic Family | CMOS |
| Configuration Method | SRAM (serial or parallel EPROM) |
| Configuration Devices Supported | EPC1, EPC1064, EPC1213, EPC1441 |
| Temperature Grade | Commercial |
EPF8282ATC100-4 100-tqfp (lfqfp, s-pqfp-g100) 腳位配置指南
EPF8282ATC100-4（100-tqfp (lfqfp, s-pqfp-g100) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EPF8282ATC100-4.
請參閱 資料表 以查看完整腳位配置。
典型應用
EPF8282ATC100-4 適用於 6 應用s: Industrial Glue Logic, Legacy Bus-Interface Bridge, Telecommunications Control Logic, Protocol Converter / State Machine Controller, Embedded Control System Integration, Test and Measurement Instrumentation.
Industrial Glue Logic
The EPF8282ATC100-4's 2,500 usable gates, 78 user I/Os, and 26 LABs make it well-suited for industrial glue-logic applications where discrete TTL/CMOS glue would otherwise consume significant board area. Engineers use this part to integrate bus isolators, address decoders, interrupt controllers, and handshake protocol converters in legacy industrial control systems. The 5 V core with 3.3 V or 5.0 V MultiVolt I/O allows direct interface to both modern 3.3 V MCUs and legacy 5 V peripheral buses without level shifters. The 100-pin TQFP package supports surface-mount assembly suitable for automated pick-and-place production. Per the Altera datasheet, the device operates over 0 C to 70 C commercial temperature range, which covers most factory-floor enclosures. The in-circuit reconfigurability (ICR) feature allows field firmware updates via JTAG without removing the part.
推薦
Legacy Bus-Interface Bridge
The EPF8282ATC100-4 is widely deployed as a glue-logic bridge between legacy buses (ISA, VME, PC/104, custom parallel buses) and modern microcontrollers. The 78 user I/Os provide sufficient bidirectional bus width for 32-bit data paths plus address and control signals, eliminating the need for external bus transceivers. MultiVolt I/O lets the FPGA sit directly between 5 V legacy peripherals and 3.3 V modern MCUs without external level translation. The 208 logic cells and 26 LABs comfortably handle state machines for bus arbitration, wait-state generation, and interrupt steering. SRAM-based configuration paired with a parallel EPROM makes the design fully deterministic at power-up. According to Altera's FLEX 8000 datasheet, the device supports JTAG boundary-scan for production board test.
推薦
Telecommunications Control Logic
Telecommunications equipment from the late 1990s and early 2000s deployed FLEX 8000 FPGAs like the EPF8282ATC100-4 for control-plane logic, including HDLC framing, channel-associated signalling, and alarm-monitoring state machines. The device's 1,500 flip-flops support deep pipelining for serial-protocol bit processing, while 78 I/Os handle multiple E1/T1 framer interfaces simultaneously. The 5 V core and CMOS SRAM configuration are well-suited to telecom shelf-card power budgets. The 100-pin TQFP package's 0.500 mm pitch is compatible with telecom OEM board layouts. Designers transitioning legacy equipment to modern platforms can use the EPF8282ATC100-4 as a form-fit-function drop-in for the original FLEX 8000 footprint. Per Altera datasheet, configuration mode is selectable via MSEL pins for serial or parallel EPROM.
推薦
Protocol Converter / State Machine Controller
The EPF8282ATC100-4's 208 logic cells, 26 LABs, and 1,500 flip-flops make it an ideal platform for synchronous protocol converters such as SPI-to-I2C bridges, UART muxes, and custom serial-protocol state machines. The 78 I/Os comfortably accommodate multiple serial channels with associated control signals, while the LAB-based architecture supports deep state encoding. MultiVolt I/O lets the FPGA bridge between a 3.3 V microcontroller and 5 V peripherals without external level shifters. The SRAM-based configuration allows design iteration via JTAG during development, then field updates via the EPC1/EPC1441 serial configuration path. The 100-pin TQFP commercial-grade package supports surface-mount manufacturing with standard reflow profiles.
推薦
Embedded Control System Integration
The EPF8282ATC100-4 integrates PWM generation, quadrature decoding, sensor multiplexing, and discrete I/O expansion in embedded control systems, reducing MCU pin count and BOM cost. The 78 user I/Os accommodate multiple encoder inputs, PWM outputs, and discrete I/O banks simultaneously. The 26 LABs support parallel encoder channels with hardware quadrature decoding at high pulse rates. The 5 V core operates directly from industrial 24 V->5 V regulated rails. According to the Altera FLEX 8000 datasheet, the device supports JTAG-based in-circuit reconfigurability (ICR), allowing firmware updates in deployed field equipment. The 100-pin TQFP package is widely accepted in industrial embedded hardware.
推薦
Test and Measurement Instrumentation
The EPF8282ATC100-4 supports bench-top test and measurement instruments such as logic analyzers, pattern generators, and stimulus-response testers where reconfigurability is essential. Engineers can load new test patterns via JTAG without removing the FPGA, dramatically shortening iteration cycles during hardware validation. The 78 user I/Os support parallel pattern generation across multiple DUT pins, while the LAB-based architecture allows precise timing control via dedicated clock inputs. The 5 V core is compatible with TTL test fixtures, and MultiVolt I/O allows direct drive of 3.3 V or 5.0 V DUTs. The 100-pin TQFP package's 0.500 mm pitch is compatible with standard PCB prototyping footprints. Per Altera datasheet, JTAG boundary-scan aids production board test.
推薦
推薦產品摘要
工程參考資料，適用於 EPF8282ATC100-4 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EPF8282ATC100-3 | EPF8282ATC100-2 | EPF8282ATC100-2W | EPF8282ATC100-4N |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 100-TQFP | 100-TQFP - same | 100-TQFP - same | 100-TQFP - same | 100-TQFP - same |
| Speed Grade | -4 | -3 (faster) | -2 (slower) | -2 (slower, wider temp) | -4 (same) |
| Usable Gates | 2500 | 2500 | 2500 | 2500 | 2500 |
| Number of Logic Cells | 208 | 208 | 208 | 208 | 208 |
| Number of LABs | 26 | 26 | 26 | 26 | 26 |
| Number of User I/O | 78 | 78 | 78 | 78 | 78 |
| Supply Voltage | 5 V | 5 V | 5 V | 5 V | 5 V |
| I/O Voltage (MultiVolt) | 3.3 V or 5.0 V | 3.3 V or 5.0 V | 3.3 V or 5.0 V | 3.3 V or 5.0 V | 3.3 V or 5.0 V |
| Operating Temperature | 0 C to 70 C | 0 C to 70 C | 0 C to 70 C | Extended | 0 C to 70 C |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
主要差異化特點
- Speed grade -4 sits in the middle of the FLEX 8000 family speed bins (對比EPF8282ATC100-3)
- Mid-density 2500-gate capacity with 78 I/Os in 100-TQFP (對比EPF8282ALC84-4)
- MultiVolt I/O supports mixed 3.3 V / 5.0 V interfaces (對比Fixed-voltage CPLDs)
設計說明
The EPF8282ATC100-4 requires both VCCINT (5 V core) and VCCIO (3.3 V or 5.0 V I/O bank) supplies. Decouple every VCC pin with a 0.1 uF ceramic capacitor placed within 5 mm of the package pin, and add a bulk 10 uF tantalum or aluminum polymer capacitor on each supply rail. The SRAM configuration cells draw configuration current at power-up until the configuration EPROM completes loading - budget 100 mA peak inrush on VCCINT during configuration. Per Altera FLEX 8000 datasheet, all VCC pins must be powered before any I/O pin drives a signal.
Do not forget to provide a configuration source (parallel EPROM, EPC1/EPC1064/EPC1213/EPC1441 serial configuration device, or system controller) - the SRAM is volatile and loses its configuration on every power-down. Do not leave MSEL pins floating - strap them to the correct logic level for the chosen configuration mode. Do not exceed the 5 V VCCINT absolute maximum. Do not drive I/O pins before the device enters user mode (CONF_DONE high), or the FPGA may latch garbage into the I/O registers. Estimated: the configuration time for a typical 2500-gate design is approximately 50 ms from a serial EPC1 device.
The EPF8282ATC100-4 in the 100-pin TQFP package has a theta_JA of approximately 50 C/W on a standard 4-layer JEDEC test board with no airflow. At a typical 5 V / 100 MHz / 50% toggle design, estimated power dissipation is 0.5 W, yielding a 25 C junction temperature rise above ambient. For closed-enclosure designs without airflow, derate clock frequency or add thermal vias under the exposed thermal pad (where present) to maintain junction temperature below 125 C. Per Altera FLEX 8000 datasheet, the device is rated for 0 C to 70 C commercial temperature operation. Mark calculated values as estimates.
合規資訊
EPF8282ATC100-4 is in obsolete lifecycle status; RoHS/REACH/lead-free status not explicitly stated in the verified data. The '-4N' suffix variant indicates lead-free terminal finish. For obsolete parts, consult the manufacturer legacy documentation.
