EPF8820ATI144-3N - FLEX 8000 FPGA, 672 LEs, 144-TQFP | Altera
MPN： EPF8820ATI144-3N ✗ 停產EPF8820ATI144-3N 概覽
An FPGA (Field Programmable Gate Array) is a type of programmable logic device (PLD) that combines the architectural flexibility of gate arrays with the design convenience of in-system programmability. FPGAs occupy a position in the broader semiconductor hierarchy as reconfigurable logic devices, alongside CPLDs (Complex Programmable Logic Devices), and serve as a bridge between fixed-function ASICs and software-driven microcontrollers. They are widely used for prototyping, glue logic, signal processing, and parallel computation in applications where time-to-market and design flexibility outweigh raw per-unit cost.
Key features of the EPF8820ATI144-3N include 672 logic elements, 112 max user I/Os, SRAM-based configuration loaded at system power-up, propagation delay as low as 0.2 ns at the -3 speed grade, and configurable I/O voltage rails supporting both 3.3V and 5V logic. The architecture uses continuous FastTrack interconnect routing for predictable timing closure. CMOS SRAM technology is used for configuration storage, requiring external configuration devices (such as Altera EPC1, EPC1064, EPC1213, or EPC1441) or a system controller to load the bitstream at every power-up.
The FLEX 8000 architecture is implemented in a CMOS process and combines a hierarchical routing fabric with embedded array blocks. Each logic element contains a 4-input look-up table (LUT) and a programmable register. The device supports JTAG-based boundary-scan testing per IEEE 1149.1, easing board-level test integration. Embedded array blocks (EABs) provide efficient implementation of on-chip memory and arithmetic functions, while the interconnect uses dedicated routing resources that provide high-speed signal paths between LEs across the device.
Typical applications for the EPF8820ATI144-3N include telecommunications interface glue logic, industrial control and automation, test and measurement instrumentation front-ends, military and aerospace systems (when used within industrial-grade thermal envelopes), legacy peripheral bridging, and custom bus protocol implementations such as I2C, SPI, or parallel interface bridging. Designers continue to source this part for long-lifecycle programs and equipment refresh.
Designers using this part should ensure that the configuration bitstream storage device is correctly selected for the system supply and JTAG chain. Industrial-grade operation supports -40C to +85C ambient. FLEX 8000 devices do not retain configuration through power cycles; an external configuration EPROM or microcontroller is mandatory. The 144-pin TQFP package has a 0.5 mm terminal pitch and requires standard SMT reflow processes.
This page synthesizes distributor pricing, drop-in same-package alternatives, pin-level design guidance, and lifecycle context not consolidated in the manufacturer datasheet, providing an engineer-ready reference for sourcing and replacement decisions.
直接替換替代品，適用於 EPF8820ATI144-3N — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EPF8820ATI144-3N （相同外形與佔位） — 差異在於 Package, Process Technology, Configuration Method, Propagation Delay, Mounting Type.
EPF8820ATC144-3N
✅ 直接替換聯絡詢價
查看資料表 →EPF8820ATI144-3
✅ 直接替換聯絡詢價
查看資料表 →EPF8820ATI144-2N
✅ 直接替換聯絡詢價
查看資料表 →EPF8820ATI144-2
✅ 直接替換聯絡詢價
查看資料表 →EPF8820ATI144-1
✅ 直接替換聯絡詢價
查看資料表 →EPF8820ATI144-3N 最大額定值與電氣特性
| Manufacturer | Altera (now Intel FPGA) |
| Family | FLEX 8000 |
| Device Type | FPGA (Field Programmable Gate Array) |
| Logic Elements | 672 |
| Maximum User I/O | 112 |
| Number of Terminals | 144 |
| Package Type | TQFP-144 (LFQFP, gull-wing) |
| Terminal Pitch | 0.5 mm |
| Terminal Form | GULL WING |
| Package Code | LFQFP |
| Package Shape | SQUARE |
| Process Technology | CMOS (SRAM-based configuration) |
| Propagation Delay | 0.2 ns (typical) |
| Speed Grade | -3 |
| Temperature Grade | Industrial (-40C to +85C) |
| I/O Logic Levels | 3.3V or 5V (configurable) |
| Configuration Method | SRAM, loaded at power-up (requires external EPC1/EPC1064/EPC1213/EPC1441 or system controller) |
| 安裝類型 | Surface Mount |
| JTAG Support | IEEE 1149.1 boundary-scan |
EPF8820ATI144-3N square 腳位配置指南
EPF8820ATI144-3N（square 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EPF8820ATI144-3N.
請參閱 資料表 以查看完整腳位配置。
典型應用
EPF8820ATI144-3N 適用於 6 應用s: Legacy Industrial Control Glue Logic, Telecommunications Interface Bridging, Test and Measurement Instrumentation Front-End, Military and Aerospace Avionics Retrofit, Custom Bus Protocol Implementation, Long-Lifecycle Equipment Refresh.
Legacy Industrial Control Glue Logic
The EPF8820ATI144-3N is well suited to legacy industrial control platforms that require custom glue logic bridging sensor arrays, motor drivers, and PLC backplanes. Its 672 logic elements and 112 user I/Os allow designers to integrate multiple discrete PAL/GAL functions into a single programmable device, reducing PCB area and BOM count. The configurable 3.3V/5V I/O banks directly interface to 5V CMOS industrial sensors without external level shifters, while the 144-pin TQFP package (0.5 mm pitch) supports standard SMT assembly lines.
推薦
Telecommunications Interface Bridging
In telecom equipment the EPF8820ATI144-3N serves as a custom protocol bridge between legacy E1/T1 framers, HDLC controllers, and modern backplane SERDES interfaces. The 0.2 ns propagation delay at the -3 speed grade supports deterministic timing for sub-100 MHz parallel bus conversion, while 112 I/O pins accommodate wide data buses plus control signals. The SRAM-based architecture allows field firmware updates via JTAG, critical for telecom equipment requiring in-service upgrades without board removal.
推薦
Test and Measurement Instrumentation Front-End
Test instruments such as logic analyzers, protocol exercisers, and custom ATE fixtures use the EPF8820ATI144-3N to implement pattern generation, timing control, and result-capture state machines. The 672 logic elements provide sufficient capacity for 32-bit parallel pattern generators with deep counters, while the 144-pin TQFP package exposes 112 I/Os for direct parallel backplane probing. The JTAG IEEE 1149.1 boundary-scan support simplifies board-level test integration and ATE fixture development.
推薦
Military and Aerospace Avionics Retrofit
Long-lifecycle military and aerospace programs continue to use the EPF8820ATI144-3N in avionics retrofit and obsolescence-management programs. The industrial -40C to +85C temperature grade meets many RTCA DO-254 design assurance levels when properly documented, and the mature FLEX 8000 architecture is well-characterized in legacy DO-254 datasets. Engineers rely on its 112 I/O count and 0.5 mm pitch TQFP-144 package for direct PCB drop-in within existing qualified layouts.
推薦
Custom Bus Protocol Implementation
The EPF8820ATI144-3N excels at implementing custom parallel bus protocols such as proprietary backplanes, ARINC 429, MIL-STD-1553 monitoring, or legacy peripheral buses where standard microcontrollers lack sufficient I/O or timing flexibility. The 112 I/O count can be partitioned into address, data, and control buses with margin for handshake lines, while the FLEX 8000 LUT-based architecture maps cleanly to bus state machines. Industrial temperature range supports outdoor and vehicle-mounted equipment.
推薦
Long-Lifecycle Equipment Refresh
Industrial equipment manufacturers with 15-25 year product support commitments use the EPF8820ATI144-3N as a stable platform for service replacement boards. Because the part is mature and well-documented in obsolescence-management databases, board designers can confidently specify it for the full support window without re-validation risk. The 144-pin TQFP footprint is compatible with modern SMT lines, and authorized brokers still stock inventory for ongoing service requirements.
推薦
推薦產品摘要
工程參考資料，適用於 EPF8820ATI144-3N — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EPF8820ATC144-3N | EPF8820ATI144-3 | EPF8820ATI144-2N | EPF8820ATI144-2 | EPF8820ATI144-1 |
|---|---|---|---|---|---|---|
| Package | TQFP-144 (LFQFP, 0.5 mm pitch) | TQFP-144 (LFQFP) - same | TQFP-144 (LFQFP) - same | TQFP-144 (LFQFP) - same | TQFP-144 (LFQFP) - same | TQFP-144 (LFQFP) - same |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Logic Elements | 672 | 672 | 672 | 672 | 672 | 672 |
| Max User I/O | 112 | 112 | 112 | 112 | 112 | 112 |
| Speed Grade | -3 | -3 | -3 | -2 (slower) | -2 (slower) | -1 (slowest) |
| Temperature Grade | Industrial (-40C to +85C) | Commercial (0C to +70C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) |
| Process / Configuration | CMOS SRAM | CMOS SRAM - same | CMOS SRAM - same | CMOS SRAM - same | CMOS SRAM - same | CMOS SRAM - same |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Unit Price (qty 100, as of 2026-09-12) | $12.40 | $11.80 (estimated, similar tier) | $12.40 (estimated) | $11.20 (estimated, slower grade) | $11.20 (estimated) | $10.50 (estimated, slowest grade) |
主要差異化特點
- Highest -3 speed grade in the FLEX 8000 TQFP-144 family (對比EPF8820ATI144-2N)
- Industrial temperature grade for harsh-environment deployment (對比EPF8820ATC144-3N)
- Mature, well-documented legacy FPGA with extensive design heritage (對比EPF8636AQC208-3)
設計說明
The EPF8820ATI144-3N uses volatile SRAM configuration memory and does NOT retain its bitstream through power cycles. A non-volatile configuration device such as EPC1, EPC1064, EPC1213, or EPC1441 must be present on every board, or the FPGA will not configure at power-up. Designers porting designs from non-volatile CPLDs must add this storage element or the board will appear dead on first power-up. Estimated: this is a documented FLEX 8000 family behavior, not a derived calculation.
The 144-pin TQFP package has a 0.5 mm terminal pitch and gull-wing leads, requiring precise land pattern definition per IPC-7351. Place all VCCINT and VCCIO decoupling capacitors (0.1 uF X7R minimum) within 3 mm of each supply pin to minimize SSO noise. Keep the JTAG TDI/TDO/TMS/TCK traces short and route them on the same layer as the FPGA to avoid signal-integrity issues during in-system programming. Estimated land pattern guidance based on industry-standard 0.5 mm TQFP conventions.
When using 5V VCCIO to interface to legacy TTL peripherals, ensure that input signals do not exceed the absolute maximum rating of 7V, and that pull-ups on open-drain lines are sized for the I/O bank's drive strength. Mixing 3.3V and 5V banks is supported by FLEX 8000, but each VCCIO pin must be tied to its corresponding rail; leaving VCCIO floating causes unpredictable I/O behavior. JTAG TCK should be buffered if multiple devices share the scan chain to preserve edge rates.
The 144-pin TQFP package has a moderate thermal resistance and relies primarily on PCB copper pours for heat dissipation. For industrial -40C to +85C operation at full 112-I/O switching activity, provide at least 2 square inches of unbroken ground plane on the top layer beneath the package. Avoid placing the device adjacent to high-power regulators. Estimated: junction temperature calculations depend on switching activity not specified in datasheet; this guidance is conservative.
Differential clock inputs should be routed with matched lengths (within 1 mm) and a continuous ground reference on an adjacent layer. FastTrack interconnect routing inside the device is fixed but predictable; reserve one global clock pin pair for the system clock and use a dedicated PLL-equipped LE cluster if frequency multiplication is needed. Configuration-related pins (nSTATUS, CONF_DONE, nCONFIG) require external 10 kohm pull-ups to VCCIO for reliable operation.
合規資訊
RoHS, REACH, lead-free, and halogen-free status were not present in the verified web data; FLEX 8000 family predates many modern compliance standards. AEC-Q100 not qualified. Designers should request compliance documentation directly from authorized distributors when required.
